公开(公告)号：US20030077852A1

公开(公告)日：2003-04-24

申请号：US10062407

申请日：2002-02-05

Applicant: Advanced Micro Devices, Inc.

Inventor： Raj N. Master ,  Edward S. Alcid ,  Diong-Hing Ding

IPC: H01L021/66 ,  G01R031/26

CPC classification number: H05K3/3478

Abstract: A method of fabricating laminate assemblies determines the ideal weight (W) of underfill to be dispensed, based on the size of the semiconductor die and the gap between the die and the laminate substrate. Underfill is dispensed in a single step in an amount between 1.1W and 1.3W to form fillets that cover at least 15% of the height of the semiconductor die on all four sides of the die. The amount of underfill ensures that the fillet coverage imbalance is 30% or less for each of the pairs of opposing sides of the die, thereby improving solder joint reliability.

Abstract translation: 基于半导体管芯的尺寸和管芯与层叠基板之间的间隙，制造叠层组件的方法决定了要分配的底部填充物的理想重量（W）。 底部填充剂以1.1W至1.3W之间的一个步骤进行分配，以形成在模具的四面上覆盖半导体管芯高度的至少15％的圆角。 底部填充物的量确保了模具的每对相对侧的圆角覆盖不平衡为30％以下，从而提高焊点的可靠性。