公开(公告)号：US20030052155A1

公开(公告)日：2003-03-20

申请号：US10062515

申请日：2002-02-05

Applicant: Advanced Micro Devices, Inc.

Inventor： Raj N. Master ,  Cheon-Seng Chan ,  Ooi-Tong Ong

IPC: B23K031/02

CPC classification number: H05K3/3478 ,  H05K2201/09945 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082

Abstract: A universal attach manufacturing process employs a boat onto which solder balls or columns are loaded. A universal attach line has a number of attach station to accommodate different types of attach processes. Depending on the process and the desired configuration and form factor of the array of solder balls or columns, a template is selected that covers some of the holes in the universal boat, and exposes other holes. The solder balls or columns are held securely in the exposed holes, and a substrate is placed onto the solder balls. Once loaded with balls or columns, the universal boat is transported to only the appropriate attach stations in the universal attach line, where the different attach operations for a given attach process, such as high temperature ball attach, eutectic ball attach, or column attach, are performed.

Abstract translation: 通用连接制造工艺采用装载有焊球或列的船。 通用连接线具有多个连接台以适应不同类型的连接过程。 根据工艺以及焊球或列阵列的期望配置和形状因素，选择覆盖通用船中的一些孔的模板，并露出其他孔。 焊球或支柱牢固地固定在暴露的孔中，并且将衬底放置在焊球上。 一旦装载了球或柱，通用船仅被运送到通用附着线中的适当的附接站，其中对于给定的附接过程（例如高温球附着，共晶球附着或柱附着）的不同附着操作， 被执行。

公开(公告)号：US20030077852A1

公开(公告)日：2003-04-24

申请号：US10062407

申请日：2002-02-05

Applicant: Advanced Micro Devices, Inc.

Inventor： Raj N. Master ,  Edward S. Alcid ,  Diong-Hing Ding

IPC: H01L021/66 ,  G01R031/26

CPC classification number: H05K3/3478

Abstract: A method of fabricating laminate assemblies determines the ideal weight (W) of underfill to be dispensed, based on the size of the semiconductor die and the gap between the die and the laminate substrate. Underfill is dispensed in a single step in an amount between 1.1W and 1.3W to form fillets that cover at least 15% of the height of the semiconductor die on all four sides of the die. The amount of underfill ensures that the fillet coverage imbalance is 30% or less for each of the pairs of opposing sides of the die, thereby improving solder joint reliability.

Abstract translation: 基于半导体管芯的尺寸和管芯与层叠基板之间的间隙，制造叠层组件的方法决定了要分配的底部填充物的理想重量（W）。 底部填充剂以1.1W至1.3W之间的一个步骤进行分配，以形成在模具的四面上覆盖半导体管芯高度的至少15％的圆角。 底部填充物的量确保了模具的每对相对侧的圆角覆盖不平衡为30％以下，从而提高焊点的可靠性。

公开(公告)号：US20030047527A1

公开(公告)日：2003-03-13

申请号：US10062538

申请日：2002-02-05

Applicant: Advanced Micro Devices, Inc.

Inventor： Raj N. Master ,  Cheon-Seng Chan

IPC: A47F007/00

CPC classification number: H05K3/3478

Abstract: A boat onto which solder balls or columns are loaded for an attach process can be used in a universal attach line has a number of attach station to accommodate different types of attach processes. Depending on the process and the desired configuration and form factor of the array of solder balls or columns, a template is selected that covers some of the holes in the universal boat, and exposes other holes. The holes are configured and sized to hold solder balls in the holes such that the solder balls protrude above the top surface of the boat by a predetermined height. This prevents damage to the solder balls while ensuring that the solder balls protrude enough to accommodate imperfectly flat packages that are placed on the array of solder balls held in the boat. Vacuum applied through the holes help to securely hold the balls in place, and a substrate is placed onto the solder balls. Once loaded with balls or columns, the boat is transported to only the appropriate attach stations in the universal attach line, where the different attach operations for a given attach process, such as high temperature ball attach, eutectic ball attach, or column attach, are performed.

Abstract translation: 用于连接工艺的用于装载焊球或列的船可用于通用连接线路，具有多个附接站以适应不同类型的附接过程。 根据工艺以及焊球或列阵列的期望配置和形状因素，选择覆盖通用船中的一些孔的模板，并露出其他孔。 孔被构造和定尺寸成将焊球保持在孔中，使得焊球在船的顶表面上突出预定高度。 这样可防止焊球损坏，同时确保焊球足够突出，以适应放置在保持在船上的焊球阵列上的不完全平坦的封装。 通过孔施加的真空有助于牢固地将球保持在适当位置，并且将基底放置在焊球上。 一旦装载了球或柱，船就被运送到通用连接线中的适当的附接站，其中对于给定的附接过程（例如高温球附着，共晶球附着或柱附着）的不同的附着操作是 执行。