公开(公告)号：US20250098181A1

公开(公告)日：2025-03-20

申请号：US18829848

申请日：2024-09-10

Applicant: Advanced Micro Devices, Inc.

Inventor： Alan D. SMITH ,  Samuel NAFFZIGER ,  Joe MACRI ,  James R. MAGRO ,  Vydhyanathan KALYANASUNDHARAM

IPC: H10B80/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

Abstract: A package device includes a processing device, memory dies and a memory controller. The memory controller die is coupled to the processing device and the memory dies. The memory controller die controls communication from the processing device to the memory dies and to an external memory device. The external memory device is external to the memory dies.

公开(公告)号：US20250156076A1

公开(公告)日：2025-05-15

申请号：US18941799

申请日：2024-11-08

Applicant: Advanced Micro Devices, Inc.

Inventor： James R. MAGRO ,  Christopher Edward COX ,  Aaron John NYGREN

IPC: G06F3/06

Abstract: A system and technique for buffering data locally within a memory device to allow access to data associated with multiple different rows within the memory device. The memory device includes memory bank circuitry having memory cells and sense amplifier circuitry coupled to the memory bank circuitry. The memory device further includes buffer circuitry coupled to an output of the sense amplifier circuitry. Further, the memory device includes selection circuitry. The selection circuitry receives a first data signal from the sense amplifier circuitry and a second data signal from the buffer circuitry, and outputs a selected one of the first data signal and the second data signal.