公开(公告)号：US20250132270A1

公开(公告)日：2025-04-24

申请号：US18382973

申请日：2023-10-23

Applicant: Advanced Micro Devices, Inc.

Inventor： Mohit ARORA ,  Deepak Vasant KULKARNI ,  Richard E. GEORGE ,  Terry Eugene RICHARDSON

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: A chip package includes a package substrate and an integrated circuit (IC) die disposed on the package substrate. The IC dies includes a security asset. The chip package also includes a glass based shield selectively disposed on the IC die and above the security asset. The glass based shield is configured to block access to the security asset. In some embodiments, the chip package includes an oxide layer disposed between the glass based shield and the IC die. In some embodiments, the chip package includes a detection module and a wire connecting the detection module to the glass based shield. The detection module is configured to generate and send a serial bit stream to the glass based shield. The detection module is also configured to monitor for changes in the serial bit stream returning from the glass based shield. Changes detected in the serial bit stream indicates the glass based shield has been tampered.