公开(公告)号：US10797004B2

公开(公告)日：2020-10-06

申请号：US16421238

申请日：2019-05-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-Lun Yang ,  Yu-Shun Hsieh ,  Chia Yi Cheng ,  Hong Jie Chen ,  Shih Yu Huang

IPC: H01L23/552 ,  H01L23/495

Abstract: A semiconductor device package includes: (1) a lead frame including a connection element and multiple leads; (2) a package body encapsulating the lead frame, wherein the package body includes a lower surface and an upper surface opposite to the lower surface, the package body includes a cavity exposing at least one of the leads; (3) at least one conductive via disposed in the cavity of the package body, electrically connected to the connection element, and exposed from the upper surface of the package body; and (4) a conductive layer disposed on the upper surface of the package body and the conductive via.

公开(公告)号：US12155111B2

公开(公告)日：2024-11-26

申请号：US17566573

申请日：2021-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung Ju Yu ,  Shao-Lun Yang ,  Chun-Hung Yeh ,  Hong Jie Chen ,  Tsung-Wei Lu ,  Wei Shuen Kao

IPC: H01L23/66 ,  H01L21/56 ,  H01L23/06 ,  H01L23/31 ,  H01Q1/22 ,  H01Q13/18

Abstract: An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.

公开(公告)号：US11811957B2

公开(公告)日：2023-11-07

申请号：US17324958

申请日：2021-05-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Chung Ju Yu ,  Jui-Hsien Wang ,  Chai-Chi Lin ,  Hong Jie Chen

IPC: H04M1/02 ,  H01L25/16 ,  H01L23/498

CPC classification number: H04M1/0202 ,  H01L23/4985 ,  H01L25/16

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.

公开(公告)号：US10312198B2

公开(公告)日：2019-06-04

申请号：US15789858

申请日：2017-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-Lun Yang ,  Yu-Shun Hsieh ,  Chia Yi Cheng ,  Hong Jie Chen ,  Shih Yu Huang

IPC: H01L23/52 ,  H01L23/552 ,  H01L23/495

Abstract: A semiconductor device package includes a lead frame, an electronic component, a package body, at least one conductive via and a conductive layer. The lead frame includes a paddle, a connection element and a plurality of leads. The electronic component is disposed on the paddle. The package body encapsulates the electronic component and the lead frame. The at least one conductive via is disposed in the package body, electrically connected to the connection element, and exposed from the package body. The conductive layer is disposed on the package body and the conductive via.