公开(公告)号：US07371973B1

公开(公告)日：2008-05-13

申请号：US09830635

申请日：1999-03-04

Applicant: Alexandr Ivanovich Taran

Inventor： Alexandr Ivanovich Taran

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/363 ,  H01L23/5384 ,  H01L24/80 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/8203 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4647 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10303 ,  H05K2201/10666 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: The contact node comprises at least two metallized contacts coupled with conductive paths arranged on surfaces of connection layers made on the base of a dielectric material and mutually aligned and interconnected electrically and mechanically by conductive binding material. The contact node is a joint between a contact made in the form of a metallized pad coupled with a conductive path on the surface of the underlying connection layer and a respective contact made in the form of a metallized hole in a dielectric material layer.

Abstract translation: 接触节点包括至少两个金属化触点，其与布置在电介质材料的基底上形成的连接层的表面上的导电通路耦合，并且通过导电结合材料电和机械地相互对准和互连。 接触节点是在金属化焊盘形式的接触件之间的接头，其与下层连接层的表面上的导电路径耦合，以及在电介质材料层中以金属化孔的形式制成的相应触点。