Methods for applying a coating over laser marking

    公开(公告)号:US09808829B2

    公开(公告)日:2017-11-07

    申请号:US14846269

    申请日:2015-09-04

    Applicant: Apple Inc.

    Abstract: Coatings for filling cracks within anodic films formed from, for example, a laser marking process are described. The cracks generally have widths of nanometers in scale and can extend from an external surface of an anodic film to an underlying metal substrate. The coatings fill the cracks to prevent liquid and contaminants from entering the cracks and reaching the metal substrate, thereby preventing corrosion of the underlying metal substrate. The coatings can be hydrophobic such that water is wicked away from the cracks. In some cases, the coatings are fluoropolymer coatings. Methods include spray-on techniques that provide a thin and uniform layer of the coating. The spray-on technique can be configured to spray on a fluoropolymer precursor onto the anodic film such that the fluoropolymer precursor diffuses into and polymerizes into the fluoropolymer coating within the cracks.

    CORROSION RESISTANT MAGNET ASSEMBLY
    6.
    发明申请

    公开(公告)号:US20170272864A1

    公开(公告)日:2017-09-21

    申请号:US15464077

    申请日:2017-03-20

    Applicant: APPLE INC.

    Abstract: Embodiments of the disclosure pertain to methods of plating magnets with a stack of layers such that the resulting magnet assembly has improved corrosion resistance. Embodiments of the disclosure are also directed to magnet assemblies formed by such methods. Some embodiments include a High Phosphorus Electroless Nickel (HiPEN) layer with Phosphorus content greater than 11% by weight.

    Corrosion resistant magnet assembly

    公开(公告)号:US10553352B2

    公开(公告)日:2020-02-04

    申请号:US15464077

    申请日:2017-03-20

    Applicant: APPLE INC.

    Abstract: Embodiments of the disclosure pertain to methods of plating magnets with a stack of layers such that the resulting magnet assembly has improved corrosion resistance. Embodiments of the disclosure are also directed to magnet assemblies formed by such methods. Some embodiments include a High Phosphorus Electroless Nickel (HiPEN) layer with Phosphorus content greater than 11% by weight.

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