公开(公告)号：US12240078B2

公开(公告)日：2025-03-04

申请号：US17344617

申请日：2021-06-10

Applicant: Applied Materials, Inc.

Inventor： Roy C. Nangoy ,  Shantanu Rajiv Gadgil ,  Nathan Arron Davis ,  Allen L. D'Ambra ,  Michael J. Coughlin ,  Sumit Subhash Patankar

IPC: B24B57/02 ,  B24B37/34 ,  B24B53/017

Abstract: A polishing assembly includes a rotatable platen to support a polishing pad, a polishing liquid delivery arm having an enclosure open at a bottom thereof and one or more ports to deliver a polishing liquid and a cleaning fluid downwardly through an interior space of the enclosure onto the polishing pad, and a delivery arm cleaning tool removably attached to the polishing liquid delivery arm, the cleaning tool extending below the delivery arm and having a delivery arm-facing surface shaped such that the cleaning tool directs the cleaning fluid from the polishing liquid delivery arm on to a surface of the enclosure of the polishing liquid delivery arm.

公开(公告)号：US11648645B2

公开(公告)日：2023-05-16

申请号：US17849576

申请日：2022-06-24

Applicant: Applied Materials, Inc.

Inventor： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Michael J. Coughlin ,  Allen L. D'Ambra

IPC: B24B53/017

CPC classification number: B24B53/017

Abstract: A method of cleaning a conditioner head includes bringing two clamps of a cleaning tool inward toward a disk-shaped pad conditioner head to press a sponge against an outer surface of the disk-shaped pad conditioner head, and creating relative motion between the cleaning tool and the pad conditioner head to wipe the sponge against the pad conditioner head.

公开(公告)号：US11251047B2

公开(公告)日：2022-02-15

申请号：US16173676

申请日：2018-10-29

Applicant: Applied Materials, Inc.

Inventor： Roy C. Nangoy ,  Chad Pollard ,  Allen L. D'Ambra

IPC: H01L21/306 ,  B24B57/02 ,  B67D7/12 ,  B67D7/42 ,  G01F1/20

Abstract: Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments herein provide a flow splitter manifold configured to enable monitoring of the pressure of the polishing fluid disposed therein. Monitoring the fluid pressure in the flow splitter manifold enables the detection of clogs in the delivery lines and/or dispense nozzles that inhibit and/or prevent the flow of polishing fluid therethrough or therefrom.

公开(公告)号：US09227293B2

公开(公告)日：2016-01-05

申请号：US13791617

申请日：2013-03-08

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D'Ambra ,  Jagan Rangarajan

IPC: B24B37/00 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/34

CPC classification number: B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/345

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

公开(公告)号：US11986925B2

公开(公告)日：2024-05-21

申请号：US17977794

申请日：2022-10-31

Applicant: Applied Materials, Inc.

Inventor： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Michael J. Coughlin ,  Allen L. D'Ambra

IPC: B24B53/017 ,  B05C17/00 ,  B24B37/34 ,  B65D47/42 ,  B65D81/32 ,  C09D5/00 ,  B05D1/28 ,  B05D5/08

CPC classification number: B24B53/017 ,  B05C17/00 ,  B24B37/34 ,  B65D81/3266 ,  C09D5/00 ,  B05D1/28 ,  B05D5/08 ,  B65D47/42

Abstract: Chemically impregnated applicators used to provide hydrophobic surfaces on chemical mechanical polishing system components and related application methods are shown. A method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.

公开(公告)号：US20160101497A1

公开(公告)日：2016-04-14

申请号：US14973044

申请日：2015-12-17

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D'Ambra ,  Jagan Rangarajan

IPC: B24B37/005

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

公开(公告)号：US20140141695A1

公开(公告)日：2014-05-22

申请号：US13791617

申请日：2013-03-08

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D'Ambra ,  Jagan Rangarajan

IPC: B24B37/005

CPC classification number: B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/345

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

公开(公告)号：US11756804B2

公开(公告)日：2023-09-12

申请号：US18091309

申请日：2022-12-29

Applicant: Applied Materials, Inc.

Inventor： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Allen L. D'Ambra

IPC: B08B1/04 ,  B24B37/34 ,  H01L21/67 ,  B24B37/27 ,  B08B3/00 ,  B24B37/12 ,  B24B57/00 ,  H01L21/306 ,  B24B55/04 ,  H01L21/304

CPC classification number: B08B1/04 ,  B08B3/003 ,  B24B37/27 ,  B24B37/34 ,  H01L21/6704 ,  B24B37/12 ,  B24B55/04 ,  B24B57/00 ,  H01L21/304 ,  H01L21/30625

Abstract: In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

公开(公告)号：US11545371B2

公开(公告)日：2023-01-03

申请号：US16909947

申请日：2020-06-23

Applicant: Applied Materials, Inc.

Inventor： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Allen L. D'Ambra

IPC: H01L21/67 ,  B24B37/27 ,  B08B3/00 ,  B08B1/04 ,  B24B37/34 ,  B24B37/12 ,  B24B57/00 ,  H01L21/306 ,  B24B55/04 ,  H01L21/304

Abstract: In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

公开(公告)号：US11484987B2

公开(公告)日：2022-11-01

申请号：US16813275

申请日：2020-03-09

Applicant: Applied Materials, Inc.

Inventor： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Michael J. Coughlin ,  Allen L. D'Ambra

IPC: B24B53/017 ,  B24B37/34 ,  C09D5/00 ,  B65D81/32 ,  B65D47/42 ,  B05C17/00 ,  B05D1/28 ,  B05D5/08

Abstract: Chemically impregnated applicators used to provide hydrophobic surfaces on chemical mechanical polishing system components and related application methods. A method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.