公开(公告)号：US20250037973A1

公开(公告)日：2025-01-30

申请号：US18912366

申请日：2024-10-10

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.

公开(公告)号：US20250060321A1

公开(公告)日：2025-02-20

申请号：US18234777

申请日：2023-08-16

Applicant: Applied Materials, Inc.

Inventor： Elias Anthony Martinez ,  Sidharth Bhatia ,  Sarah Michelle Bobek ,  Ka Shun Wong ,  Zhi Wang ,  Martin J. Seamons ,  Raj Singu ,  Abdul Aziz Khaja ,  Ganesh Balasubramanian ,  Mark McTaggart Wylie

IPC: G01N21/95 ,  G01N35/00

Abstract: Disclosed are systems and techniques for fast and efficient detection of defects in wafers, including a system that has a factory interface (FI) coupled to a wafer carrier and a load lock chamber. The FI includes a robot fetches a wafer from the wafer carrier and deliver the first wafer to an aligner device. The aligner device imparts rotational motion to the wafer and identifies, using the rotational motion of the wafer, a position of a reference feature of the wafer. The FI further includes an optical inspection system that collects, during the rotational motion imparted to the wafer, an imaging data for the first wafer. The system further includes a processing device that performs evaluation, using the imaging data, of a presence of defect(s) in the wafer, and evaluates suitability of the wafer for wafer processing.

公开(公告)号：US20250079207A1

公开(公告)日：2025-03-06

申请号：US18242886

申请日：2023-09-06

Applicant: Applied Materials, Inc.

Inventor： Punyabrahma Panda ,  Tao Zhang ,  Ganapathy Saravanavel ,  Zhi Wang

IPC: H01L21/67 ,  C23C16/52 ,  G01H1/00 ,  H04Q9/00

Abstract: An electronic device manufacturing system is provided that includes a monitoring system coupled to a tool. The monitoring system comprises a body to mount to a surface of a tool; a vibration detecting sensor disposed in or on the body, the vibration detecting sensor to generate a signal based on a vibration of the surface; a wired communication device disposed in or on the body, wherein in a first configuration the wired communication device is to transmit the signal generated by the vibration detecting sensor to the computer system via a wired connection with the computer system; and a wireless communication device disposed in or on the body, wherein in a second configuration the wireless communication device is to establish a wireless connection with the computer system and to transmit the signal generated by the vibration detecting sensor to the computer system via the wireless connection.

公开(公告)号：US20240393761A1

公开(公告)日：2024-11-28

申请号：US18324080

申请日：2023-05-25

Applicant: Applied Materials, Inc.

Inventor： Zhi Wang ,  Tao Zhang ,  Punyabrahma Panda ,  Michael Kutney

IPC: G05B19/402

Abstract: A method includes receiving, by a processing device, position error data from one or more motors of a process chamber. The method further includes performing preprocessing of the position error data. The method further includes transforming the position error data to a frequency domain. The method further includes determining, based on the frequency domain position error data, that a vibration fault has occurred in connection with the process chamber. The method further includes performing a corrective action in view of the vibration fault.

公开(公告)号：US12142461B2

公开(公告)日：2024-11-12

申请号：US17737670

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.

公开(公告)号：US20230360886A1

公开(公告)日：2023-11-09

申请号：US17737670

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32935 ,  H01J2237/332

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.