公开(公告)号：US20240295693A1

公开(公告)日：2024-09-05

申请号：US18629636

申请日：2024-04-08

Applicant: Applied Materials, Inc.

Inventor： Yingdong LUO ,  Zhengping YAO ,  Daihua ZHANG ,  David Alexander SELL ,  Jingyi YANG ,  Xiaopei DENG ,  Kevin MESSER ,  Samarth BHARGAVA ,  Rami HOURANI ,  Ludovic GODET

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/124 ,  G02B6/13 ,  G02B27/00

CPC classification number: G02B6/1228 ,  G02B6/12004 ,  G02B6/124 ,  G02B6/13 ,  G02B27/0081

Abstract: Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.

公开(公告)号：US20240126012A1

公开(公告)日：2024-04-18

申请号：US18381604

申请日：2023-10-18

Applicant: Applied Materials, Inc.

Inventor： Yingdong LUO ,  Zhengping YAO ,  Daihua ZHANG ,  David Alexander SELL ,  Jingyi YANG ,  Xiaopei DENG ,  Kevin MESSER ,  Samarth BHARGAVA ,  Rami HOURANI ,  Ludovic GODET

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/124 ,  G02B6/13 ,  G02B27/00

CPC classification number: G02B6/1228 ,  G02B6/12004 ,  G02B6/124 ,  G02B6/13 ,  G02B27/0081

Abstract: Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.

公开(公告)号：US20230360890A1

公开(公告)日：2023-11-09

申请号：US18131997

申请日：2023-04-07

Applicant: Applied Materials, Inc.

Inventor： Yue CHEN ,  Jinyu LU ,  Yongmei CHEN ,  Jinxin FU ,  Zihao YANG ,  Mingwei ZHU ,  Takashi KURATOMI ,  Rami HOURANI ,  Ludovic GODET ,  Qun JING ,  Jingyi YANG ,  David Masayuki ISHIKAWA

IPC: H01J37/32 ,  H01J7/02

CPC classification number: H01J37/32449 ,  H01J37/32458 ,  H01J37/32724 ,  H01J7/02 ,  H01J2237/332 ,  H01J2237/334

Abstract: A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide. The method further includes providing one or more process gases to the interior volume of the process chamber, and generating a plasma of the one or more process gases in the interior volume for a first time period when the optical device is on the substrate support, and stopping the plasma after the first time period. A carbon content of the one or more surface regions of each optical device structure is reduced by at least 50% by the plasma.