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1.
公开(公告)号:US20230356540A1
公开(公告)日:2023-11-09
申请号:US18142305
申请日:2023-05-02
Applicant: Applied Materials, Inc.
Inventor: Yingdong LUO , Rami HOURANI , Xiaopei DENG , Kang LUO , Erica CHEN , Ludovic GODET
IPC: B41M5/00
CPC classification number: B41M5/0047
Abstract: Embodiments of the present disclosure relate to methods, systems, and apparatus for inkjet printing self-assembled monolayer (SAM) structures on substrates. In one embodiment, which can be combined with other embodiments, one or more SAM layers are printed on a substrate surface of a substrate in a localized manner such that a portion of the substrate surface is left exposed to a processing region of the inkjet chamber. The printing includes spraying one or more subsections of the substrate surface with an ink, the ink having a SAM composition. The SAM composition includes an active component, and a hydrophobic tail.
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公开(公告)号:US20230194982A1
公开(公告)日:2023-06-22
申请号:US18091525
申请日:2022-12-30
Applicant: Applied Materials, Inc.
Inventor: Yingdong LUO , Yongan XU , Kang LUO , Ludovic GODET
IPC: G03F7/00
CPC classification number: G03F7/0015 , G03F7/0002
Abstract: Embodiments described herein provide method a method of forming optical devices using nanoimprint lithography that maintains the critical dimension of the optical device structures. The method described herein accounts for lateral shrinkage of the solvent based resist during the cure process to maintain the critical dimension. The method includes disposing a stamp coating on a stamp having an inverse optical device pattern of inverse structures. The coating is disposed on sidewalls, inverse structure bottom, and inverse structure top of the inverse structures. The method includes etching the inverse structures such that the stamp coating remains on the sidewalls and is removed from the inverse structure top and bottom. The method further includes imprinting the stamp into an optical device material disposed and subjecting the imprintable optical device material to a cure process which transfers the optical device critical dimension to the optical device structures of the optical device pattern.
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公开(公告)号:US20240142690A1
公开(公告)日:2024-05-02
申请号:US18473079
申请日:2023-09-22
Applicant: Applied Materials, Inc.
Inventor: Yingdong LUO , Jinxin FU , Zhengping YAO , Daihua ZHANG , Ludovic GODET
IPC: F21V8/00
CPC classification number: G02B6/0016 , G02B6/002 , G02B6/0036 , G02B6/0046 , G02B6/0065
Abstract: An apparatus for waveguides and a method of fabricating a waveguide combiner having at least one grating with trenches gap-filled with variable refractive index materials. At least two trenches of at least one grating includes a first gap-fill material having a first volume and a first refractive index, and a second gap-fill material having a second volume and a second refractive index different than the first refractive index. Control of the deposition of first volume and the deposition of second volume in an inkjet deposition process provide for the formation of the grating with two trenches that have different refractive indices and different gap-fill depths. The first gap-fill material and the second gap-fill material merge to form the gap-filler. Therefore, by controlling the varied refractive indices and different gap-fill depths the waveguide combiner is optimized by efficiency or a color uniformity.
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4.
公开(公告)号:US20230192971A1
公开(公告)日:2023-06-22
申请号:US18084741
申请日:2022-12-20
Applicant: Applied Materials, Inc.
Inventor: Yingdong LUO , Xiaopei DENG , Kang LUO , Rami HOURANI , Daihua ZHANG , Ludovic GODET
CPC classification number: C08J3/28 , B41M5/0047 , B41M5/0064 , C08J5/18 , C08J2333/10
Abstract: Methods of curing a deformation in a substrate are provided. In some embodiments, the method includes identifying one or more areas on the substrate with deformation. The method further includes printing a first film on a first area of a surface of the substrate via inkjet printing, the first film being a material that polymerizes and contracts when cured. The method includes printing a second film on a second area of the surface of the substrate via inkjet printing, the second film being a material that polymerizes and contracts when cured. The method further includes curing the first film and the second film to induce a bend in the substrate. In some embodiments, the method includes inkjet printing a third film and a fourth film on the surface of the substrate.
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公开(公告)号:US20220362904A1
公开(公告)日:2022-11-17
申请号:US17321694
申请日:2021-05-17
Applicant: Applied Materials, Inc.
Inventor: Sivapackia GANAPATHIAPPAN , Uma SRIDHAR , Yingdong LUO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Sebastian David ROZO , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA , Hou T. NG , Sudhakar MADHUSOODHANAN
IPC: B24B37/24
Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.
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公开(公告)号:US20240295693A1
公开(公告)日:2024-09-05
申请号:US18629636
申请日:2024-04-08
Applicant: Applied Materials, Inc.
Inventor: Yingdong LUO , Zhengping YAO , Daihua ZHANG , David Alexander SELL , Jingyi YANG , Xiaopei DENG , Kevin MESSER , Samarth BHARGAVA , Rami HOURANI , Ludovic GODET
CPC classification number: G02B6/1228 , G02B6/12004 , G02B6/124 , G02B6/13 , G02B27/0081
Abstract: Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.
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公开(公告)号:US20240001700A1
公开(公告)日:2024-01-04
申请号:US18337294
申请日:2023-06-19
Applicant: Applied Materials, Inc.
Inventor: Yingdong LUO , Xiaopei DENG , Rami HOURANI , Ludovic GODET
CPC classification number: B41M3/003 , G02B27/0172 , B41J11/0021 , B41M5/0047 , G02B2207/101
Abstract: A method of forming an optical device is provided. The method includes forming a first layer over a plurality of optical structures, the first layer including a first plurality of nanoparticles and a second plurality of nanoparticles. The first plurality of nanoparticles and the second plurality of nanoparticles are formed of a first material, the first plurality of nanoparticles have a first average volume, greater than 95% of the first plurality of nanoparticles have a volume within 10% of the first average volume, the second plurality of nanoparticles have a second average volume, greater than 95% of the second plurality of nanoparticles have a volume within 10% of the second average volume, and the second average volume is at least 25% larger the first average volume.
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公开(公告)号:US20240001398A1
公开(公告)日:2024-01-04
申请号:US18337246
申请日:2023-06-19
Applicant: Applied Materials, Inc.
Inventor: Russell Chin Yee TEO , Yingdong LUO , Ludovic GODET , Daihua ZHANG , Zhengping YAO , James D. STRASSNER
CPC classification number: B05C5/0291 , B05D3/007 , B05D3/067 , B05D7/24 , B05D2203/30
Abstract: A method of forming a substrate carrier is provided. The method includes forming a first electrode over a first surface of a substrate, the first electrode arranged in a first pattern including a plurality of segments, wherein portions of the plurality of segments are spaced apart from each other by a plurality of gaps; and dispensing a plurality of droplets of a dielectric material over the substrate and into the plurality of gaps. The plurality of droplets includes a first droplet and a second droplet, the first droplet is dispensed onto a first location over the substrate, the second droplet is dispensed onto a second location over the substrate, a size of the first droplet is at least 10% larger than a size of the second droplet.
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公开(公告)号:US20240270007A1
公开(公告)日:2024-08-15
申请号:US18167682
申请日:2023-02-10
Applicant: Applied Materials, Inc.
Inventor: Yingdong LUO , Jinyu LU , Takashi KURATOMI , Alexia Adilene PORTILLO RIVERA , Xiaopei DENG , Zhengping YAO , Daihua ZHANG , Rami HOURANI , Ludovic GODET
CPC classification number: B41M3/003 , B41J11/00212 , G02B27/0172
Abstract: Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to optical devices and methods of manufacturing a patterned optical device film on an optical device substrate. According to certain embodiments, an inkjet deposition process is used to deposit a patterned inkjet coating layer on the optical device substrate. A deposition process may then be used to deposit an optical device material on the patterned inkjet coating and the optical device substrate. The patterned inkjet coating on the optical device substrate may then be washed with an appropriate detergent to lift-off the patterned inkjet coating layer from the optical device substrate to form the patterned optical device film.
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公开(公告)号:US20240126012A1
公开(公告)日:2024-04-18
申请号:US18381604
申请日:2023-10-18
Applicant: Applied Materials, Inc.
Inventor: Yingdong LUO , Zhengping YAO , Daihua ZHANG , David Alexander SELL , Jingyi YANG , Xiaopei DENG , Kevin MESSER , Samarth BHARGAVA , Rami HOURANI , Ludovic GODET
CPC classification number: G02B6/1228 , G02B6/12004 , G02B6/124 , G02B6/13 , G02B27/0081
Abstract: Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.
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