公开(公告)号：US12074010B2

公开(公告)日：2024-08-27

申请号：US17470294

申请日：2021-09-09

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice ,  Hanish Kumar Panavalappil Kumarankutty ,  Steven D. Marcus ,  Kirubanandan Naina Shanmugam ,  Sriharsha Dharmapura Sathyanarayanamurthy ,  Madhukar Krishna ,  Shivaprakash Padadayya Hiremath ,  Senthil Kumar Nattamai Subramanian ,  Sankar Menon Cherubala Pathayapura

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46

CPC classification number: H01J37/3244 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/4586 ,  C23C16/46 ,  C23C16/463 ,  H01J37/32357 ,  H01J37/32522 ,  H01J37/32724 ,  C23C16/4582

Abstract: Methods and apparatus for coating processing reactor component parts are provided herein. In some embodiments, a part coating reactor includes: a lower body and a lid assembly that together define and enclose an interior volume; one or more heaters disposed in the lid assembly; one or more coolant channels disposed in the lid assembly to flow a heat transfer medium therethrough; a plurality of gas passages disposed through the lid assembly to facilitate providing one or more gases to the interior volume, wherein the plurality of gas passages include a plurality of fluidly independent plenums disposed in the lid assembly; and one or more mounting brackets to facilitate coupling a workpiece to the lid assembly.

公开(公告)号：US11848218B2

公开(公告)日：2023-12-19

申请号：US17077711

申请日：2020-10-22

Applicant: Applied Materials, Inc.

Inventor： Katty Guyomard ,  Chidambara A. Ramalingam ,  Shawyon Jafari ,  Palash Joshi ,  Moin Ahmed Khan ,  Kirubanandan Naina Shanmugam ,  Subhaschandra Shreepad Salkod ,  Avishek Ghosh ,  David W. Groechel ,  Li Wu ,  Dorothea Buechel-Rimmel

IPC: H01L21/67 ,  B08B3/04

CPC classification number: H01L21/67057 ,  B08B3/048

Abstract: Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

公开(公告)号：US20220130692A1

公开(公告)日：2022-04-28

申请号：US17077711

申请日：2020-10-22

Applicant: Applied Materials, Inc.

Inventor： Katty Guyomard ,  Chidambara A. Ramalingam ,  Shawyon Jafari ,  Palash Joshi ,  Moin Ahmed Khan ,  Kirubanandan Naina Shanmugam ,  Subhaschandra Shreepad Salkod ,  Avishek Ghosh ,  David W. Groechel ,  Li Wu ,  Dorothea Buechel-Rimmel

IPC: H01L21/67 ,  B08B3/04

Abstract: Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.