公开(公告)号：US20240184858A1

公开(公告)日：2024-06-06

申请号：US18075055

申请日：2022-12-05

Applicant: Applied Materials, Inc.

Inventor： Peter J. Lindner ,  John G. Albright ,  Jimmy Iskandar ,  Michael D. Armacost

IPC: G06F18/25 ,  G06F18/21 ,  G06F18/2113 ,  G06F18/23 ,  G06F18/2433

CPC classification number: G06F18/25 ,  G06F18/2113 ,  G06F18/2193 ,  G06F18/23 ,  G06F18/2433

Abstract: An electronic device manufacturing system configured to obtain, by a processor, a plurality of datasets associated with a process recipe, wherein each dataset of the plurality of datasets comprises data generated by a plurality of sensors during a corresponding process run performed using the process recipe. The processor is further configured to determine, using the plurality of data sets associated with the process recipe, a correlation value between two or more sensors of the plurality of sensors. Responsive to the correlation value satisfying a threshold criterion, the processor assigns the two or more sensors to a cluster. During a subsequent process run, the processor generates an anomaly score associated with the cluster and indicative of an anomaly associated with at least one step of the subsequent process run.

公开(公告)号：US20220019863A1

公开(公告)日：2022-01-20

申请号：US16947052

申请日：2020-07-16

Applicant: Applied Materials, Inc.

Inventor： Jimmy Iskandar ,  Michael D. Armacost

IPC: G06K9/62 ,  G06N3/04

Abstract: Implementations disclosed describe a method and a system to perform the method of obtaining a reduced representation of a plurality of sensor statistics representative of data collected by a plurality of sensors associated with a device manufacturing system performing a manufacturing operation. The method further includes generating, using a plurality of outlier detection models, a plurality of outlier scores, each of the plurality of outlier scores generated based on the reduced representation of the plurality of sensor statistics using a respective one of the plurality of outlier detection models. The method further includes processing the plurality of outlier scores using a detector neural network to generate an anomaly score indicative of a likelihood of an anomaly associated with the manufacturing operation.

公开(公告)号：US10770321B2

公开(公告)日：2020-09-08

申请号：US16240318

申请日：2019-01-04

Applicant: Applied Materials, Inc.

Inventor： Kang-Lie Chiang ,  Greg A. Blackburn ,  Pallavi Zhang ,  Michael D. Armacost ,  Nitin Khurana

IPC: H01L21/67 ,  G01R21/06 ,  G01R19/165

Abstract: Embodiments of the present disclosure provide a method, system, and computer program product for monitoring a service life of a chamber component. In one example, the method includes receiving one or more power measurements of a semiconductor processing chamber from one or more sensors positioned about the semiconductor processing chamber. The processor compares the one or more power measurements to one or more threshold values corresponding to the service life of the chamber component. The processor determines whether the one or more power measurements exceed the threshold values. If the processor determines that the one or more power measurements exceed the threshold values, the processor takes remedial measures for the service life of the chamber component.

公开(公告)号：US20230259585A1

公开(公告)日：2023-08-17

申请号：US18136488

申请日：2023-04-19

Applicant: Applied Materials, Inc.

Inventor： Jimmy Iskandar ,  Michael D. Armacost

IPC: G06F18/10 ,  G06N3/04 ,  G06F18/25 ,  G06F18/2433

CPC classification number: G06F18/10 ,  G06N3/04 ,  G06F18/251 ,  G06F18/2433

Abstract: Implementations disclosed describe systems and techniques to detect anomalies in a manufacturing operation. The techniques include generating, using a plurality of outlier detection models, a plurality of outlier scores. The outlier scores are representative of a degree of presence, in a plurality of sensor statistics, of an anomaly associated with the manufacturing operation. Individual outlier scores are generated using a respective one of the plurality of outlier detection models. The techniques further include determining, using the outlier scores, a likelihood of the anomaly associated with the manufacturing operation.

公开(公告)号：US20250035680A1

公开(公告)日：2025-01-30

申请号：US18226554

申请日：2023-07-26

Applicant: Applied Materials, Inc.

Inventor： Suketu Parikh ,  Jimmy Iskandar ,  Tsz Keung Cheung ,  Chih Wei Lin ,  Michael D. Armacost

IPC: G01R19/12 ,  H01L21/66

Abstract: An electronic device manufacturing system configured to obtain current sensor data associated with a sensor of a substrate manufacturing system and determine a slope value associated with the current sensor data. Responsive to determining that the slope value satisfied a threshold criterion associated with a fault detection limit, at least one of an alert is generated or a corrective action performed.

公开(公告)号：US20240419813A1

公开(公告)日：2024-12-19

申请号：US18209821

申请日：2023-06-14

Applicant: Applied Materials, Inc.

Inventor： Fei Li ,  Jimmy Iskandar ,  Michael D. Armacost

IPC: G06F21/60 ,  G06F21/62 ,  H04L9/08

Abstract: An electronic device manufacturing system configured to receive, by a first computing system, a request for manufacturing process data request. The system further uses a first cryptographic key controlled by a first entity and a second cryptographic key controlled by a second entity, a database management system to retrieve the manufacturing process data from a data store. The system further obtains, using the database management system, the manufacturing process data stored in the data store. The manufacturing process data is encrypted. The system further sends the encrypted manufacturing process data to a second computing system configured to perform one or more anonymization operations on the manufacturing process data.

公开(公告)号：US10901407B2

公开(公告)日：2021-01-26

申请号：US15610280

申请日：2017-05-31

Applicant: Applied Materials, Inc.

Inventor： Jimmy Iskandar ,  Michael D. Armacost ,  Heng Hao

IPC: G05B23/02 ,  G06F16/248

Abstract: Embodiments provide techniques for compressing sensor data collected within a manufacturing environment. One embodiment monitors a plurality of runs of a recipe for fabricating one or more semiconductor devices within a manufacturing environment to collect runtime data from a plurality of sensors within the manufacturing environment. The collected runtime data is compressed by generating, for each of the plurality of sensors and for each of the plurality of runs, a respective representation of the corresponding runtime data that describes a shape of the corresponding runtime data and a magnitude of the corresponding runtime data. A query specifying one or more runtime data attributes is received and executed against the compressed runtime data to generate query results, by comparing the one or more runtime data attributes to at least one of the generated representations of runtime data.

公开(公告)号：US10177018B2

公开(公告)日：2019-01-08

申请号：US15674180

申请日：2017-08-10

Applicant: Applied Materials, Inc.

Inventor： Kang-Lie Chiang ,  Greg A. Blackburn ,  Pallavi Zhang ,  Michael D. Armacost ,  Nitin Khurana

IPC: H01L21/67 ,  G01R21/06 ,  G01R19/165

Abstract: Embodiments of the present disclosure provide a method, system, and computer program product for monitoring a service life of a chamber component. In one example, the method includes receiving one or more power measurements of a semiconductor processing chamber from one or more sensors positioned about the semiconductor processing chamber. The processor compares the one or more power measurements to one or more threshold values corresponding to the service life of the chamber component. The processor determines whether the one or more power measurements exceed the threshold values. If the processor determines that the one or more power measurements exceed the threshold values, the processor takes remedial measures for the service life of the chamber component.

公开(公告)号：US11657122B2

公开(公告)日：2023-05-23

申请号：US16947052

申请日：2020-07-16

Applicant: Applied Materials, Inc.

Inventor： Jimmy Iskandar ,  Michael D. Armacost

IPC: G06K9/62 ,  G06N3/04

CPC classification number: G06K9/6298 ,  G06K9/6284 ,  G06K9/6289 ,  G06N3/04

Abstract: Implementations disclosed describe a method and a system to perform the method of obtaining a reduced representation of a plurality of sensor statistics representative of data collected by a plurality of sensors associated with a device manufacturing system performing a manufacturing operation. The method further includes generating, using a plurality of outlier detection models, a plurality of outlier scores, each of the plurality of outlier scores generated based on the reduced representation of the plurality of sensor statistics using a respective one of the plurality of outlier detection models. The method further includes processing the plurality of outlier scores using a detector neural network to generate an anomaly score indicative of a likelihood of an anomaly associated with the manufacturing operation.

公开(公告)号：US10541169B2

公开(公告)日：2020-01-21

申请号：US15593502

申请日：2017-05-12

Applicant: Applied Materials, Inc.

Inventor： Chong Jiang ,  Lei Jing ,  Mingte Liu ,  Adolph Miller Allen ,  Michael W. Johnson ,  Pallavi Zhang ,  Michael D. Armacost

IPC: H01L21/683

Abstract: Embodiments of the disclosure relate to methods and a system for adjusting the chucking voltage of an electrostatic chuck. In one embodiment, a system for plasma processing a substrate includes a plasma processing chamber, a radio-frequency (RF) matching circuit coupled to the chamber, a sensor and a controller. The chamber includes a chamber body having an inner volume, a bipolar electrostatic chuck disposed in the inner volume and a power supply configured to provide chucking voltage to a pair of electrodes embedded within the electrostatic chuck. When plasma is energized within the chamber by the application of RF power through an RF matching circuit, the sensor is configured to detect a change in an electrical characteristic at the RF matching circuit. The controller is coupled to the power supply and configured to adjust the chucking voltage in response to the change in the electrical characteristic detected by the sensor.