公开(公告)号：US20020060363A1

公开(公告)日：2002-05-23

申请号：US10052681

申请日：2002-01-17

Applicant: Applied Materials, Inc.

Inventor： Ming Xi ,  Paul Frederick Smith ,  Ling Chen ,  Michael X. Yang ,  Mei Chang ,  Fusen Chen ,  Christophe Marcadal ,  Jenny C. Lin

IPC: H01L021/4763 ,  H01L021/44

CPC classification number: H01L21/76804 ,  C25D5/02 ,  H01L21/2855 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/76831 ,  H01L21/76843 ,  H01L21/76844 ,  H01L21/76846 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.

Abstract translation: 本发明的实施例提供了用金属（例如铜）在衬底上填充图案化特征的工艺顺序和相关硬件。 序列包括首先在图案化特征中形成可靠的阻挡层，以防止金属扩散到通过其形成图案化特征的电介质层。 一个序列包括在图案化电介质上形成大致共形的阻挡层，在图案化特征的底部蚀刻阻挡层，沉积第二阻挡层，然后用诸如铜的金属填充图案化的特征。