公开(公告)号：US20250129477A1

公开(公告)日：2025-04-24

申请号：US18916299

申请日：2024-10-15

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Vinh N. TRAN ,  Yong ZHENG ,  Vishwas Kumar PANDEY ,  Ala MORADIAN ,  Rajeev CHAVAN ,  Abraham PALATY

IPC: C23C16/455 ,  C23C16/44

Abstract: In one or more embodiments, a semiconductor processing kit includes a reflector assembly. The reflector assembly configured to support one or more sensing devices therein. The reflector assembly includes a body having a top surface and a volume at least partially defined by an inner surface and an outer surface. The reflector assembly further includes a baffle and a fluid channel disposed within the baffle. The fluid channel is configured to flow a fluid to adjust a temperature of the one or more sensing devices. A ring is disposed on the top surface. The ring is configured to reduce a flow of a fluid into the volume. A reflector is concentrically disposed radially outward of the outer surface and creates a gap that allows the fluid to partially flow between the inner surface of the reflector and the outer surface.