公开(公告)号：US10307822B2

公开(公告)日：2019-06-04

申请号：US15655229

申请日：2017-07-20

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Ron Naftali ,  Christopher G. Talbot

IPC: H04N5/74 ,  B22F3/105 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  G02B26/08 ,  B29C64/135 ,  B29C64/153 ,  B29C64/171 ,  B29C64/245

Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense layers of feed material on the platform, and a fusing system to direct an energy beam to fuse at least a portion of the outermost layer of feed material. The fusing system includes an energy source to emit the energy beam, a deformable mirror to receive the energy beam and reflect the energy beam, wherein a shape of the deformable mirror defines at least in part an intensity profile of the energy beam on the outermost layer of feed material, an actuator coupled to the deformable mirror, and a controller coupled to the actuator and configured to cause the actuator to deform the shape of the deformable mirror to adjust the intensity profile of the energy beam on the outermost layer of feed material in accordance to a desired profile.

公开(公告)号：US20240248046A1

公开(公告)日：2024-07-25

申请号：US18405546

申请日：2024-01-05

Applicant: Applied Materials, Inc.

Inventor： Keith Wells ,  Ron Naftali ,  Elad Eizner ,  Tal Kuzniz ,  Chi-Ming Tsai

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/8835 ,  G01N2021/8848 ,  G01N2201/025 ,  G01N2201/06113 ,  G01N2201/06146 ,  G01N2201/0691 ,  G01N2201/0697

Abstract: Implementations disclosed describe, among other things, a system and a method of using a wafer inspection system that includes a plurality of inspection heads configured to concurrently inspect a separate region of a plurality of regions of a wafer. Each inspection head includes an illumination subsystem to illuminate a corresponding region of the wafer, a collection subsystem to collect a portion of light reflected/scattered from the corresponding region of the wafer. Each inspection head further includes a light detection subsystem to detect the collected light and generate one or more signals representative of a state of the corresponding region of the wafer. The wafer inspection system further includes a processing device configured to determine, using the one or more signals received from each of the inspection heads, the quality of the wafer.

公开(公告)号：US10421125B2

公开(公告)日：2019-09-24

申请号：US15655298

申请日：2017-07-20

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Ron Naftali ,  Christopher G. Talbot

IPC: B22F3/105 ,  B29C64/135 ,  B29C64/171 ,  B33Y50/02 ,  G02B26/08 ,  H04N5/74 ,  B29C64/153 ,  B29C64/245 ,  B33Y10/00 ,  B33Y30/00

Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense layers of feed material on the platform, and a fusing system including an energy source to generate an energy beam having an adjustable intensity profile, an actuator to cause the energy beam to traverse across an outermost layer of feed material, and a controller coupled to the actuator and the energy source. The controller is configured to cause the energy source to adjust the intensity profile of the energy beam on the outermost layer of feed material based on a traversal velocity and/or a traversal direction of the light beam across the outermost layer of feed material.