公开(公告)号：US20170203408A1

公开(公告)日：2017-07-20

申请号：US15287665

申请日：2016-10-06

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24

CPC classification number: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20240136485A1

公开(公告)日：2024-04-25

申请号：US18490847

申请日：2023-10-19

Applicant: Applied Materials, Inc.

Inventor： Zhiyong LI ,  Sivapackia GANAPATHIAPPAN ,  Mingwei ZHU ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Lisong XU ,  Ding KAI ,  Kulandaivelu SIVANANDAN

IPC: H01L33/60 ,  H01L25/16

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L2933/0058

Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device includes a backplane, at least three LEDs disposed on the backplane, subpixel isolation (SI) structures disposed defining wells of at least three subpixels, a reflection material is disposed on sidewalls and a top surface of the SI structures, at least three of the subpixels have a color conversion material disposed in the wells, an encapsulation layer disposed over the subpixel isolation structures and the subpixels, a light filter layer disposed over the encapsulation layer and micro-lenses disposed over the light filter layer and over each of the wells of the subpixels.

公开(公告)号：US20230294239A1

公开(公告)日：2023-09-21

申请号：US18202013

申请日：2023-05-25

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Ankit VORA ,  Boyi FU ,  Venkat HARIHARAN ,  Mayu YAMAMURA ,  Mario CORNEJO ,  Igor ABRAMSON ,  Mo YANG ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA

IPC: B24B37/24 ,  C08F283/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10

CPC classification number: B24B37/24 ,  C08F283/008 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10 ,  B29L2031/736

Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

公开(公告)号：US20230052048A1

公开(公告)日：2023-02-16

申请号：US17946547

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Ashavani KUMAR ,  Ashwin CHOCKALINGAM ,  Sivapackia GANAPATHIAPPAN ,  Rajeev BAJAJ ,  Boyi FU ,  Daniel REDFIELD ,  Nag B. PATIBANDLA ,  Mario Dagio CORNEJO ,  Amritanshu SINHA ,  Yan ZHAO ,  Ranga Rao ARNEPALLI ,  Fred C. REDEKER

IPC: B24B37/24 ,  B33Y80/00 ,  B33Y10/00 ,  B24D11/04 ,  B24B37/26 ,  B24D18/00 ,  B29C64/112

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US20220362904A1

公开(公告)日：2022-11-17

申请号：US17321694

申请日：2021-05-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Uma SRIDHAR ,  Yingdong LUO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Sebastian David ROZO ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Sudhakar MADHUSOODHANAN

IPC: B24B37/24

Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.

公开(公告)号：US20220111579A1

公开(公告)日：2022-04-14

申请号：US17070854

申请日：2020-10-14

Applicant: Applied Materials, Inc.

Inventor： Daihua ZHANG ,  Uma SRIDHAR ,  Hou T. NG ,  Sivapackia GANAPATHIAPPAN ,  Nag B. PATIBANDLA

IPC: B29C64/112 ,  B29C64/264 ,  B29C64/209 ,  B29C64/245 ,  B29C64/232 ,  B33Y70/00 ,  A61F2/02

Abstract: A method of forming a three dimensional object includes dispensing droplets of an electromagnetic energy curable liquid onto a surface to form a plurality of layers of the three dimensional object in liquid form, wherein each droplet forms a layer of liquid on the surface which is larger than a minimum feature size of a structure to be formed by curing the curable liquid, and directing electromagnetic energy capable of curing the liquid and having a beam width intersecting the layer of liquid which is at least as small as the smallest feature of a structure to be formed in the curable liquid.

公开(公告)号：US20210347005A1

公开(公告)日：2021-11-11

申请号：US17382194

申请日：2021-07-21

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Sivapackia GANAPATHIAPPAN ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Ashwin CHOCKALINGAM ,  Dominic J. BENVEGNU ,  Mario Dagio CORNEJO ,  Mayu YAMAMURA ,  Nag B. PATIBANDLA ,  Ankit VORA

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material and methods of forming thereof. In one embodiment, a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition, and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US20190047112A1

公开(公告)日：2019-02-14

申请号：US16050442

申请日：2018-07-31

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Sivapackia GANAPATHIAPPAN ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Ashwin CHOCKALINGAM ,  Dominic J. BENVEGNU ,  Mario Dagio CORNEJO ,  Mayu YAMAMURA ,  Nag B. PATIBANDLA ,  Ankit VORA

IPC: B24B37/20

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US20240234655A9

公开(公告)日：2024-07-11

申请号：US18490847

申请日：2023-10-20

Applicant: Applied Materials, Inc.

Inventor： Zhiyong LI ,  Sivapackia GANAPATHIAPPAN ,  Mingwei ZHU ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Lisong XU ,  Ding KAI ,  Kulandaivelu SIVANANDAN

IPC: H01L33/60 ,  H01L25/16

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L2933/0058

Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device includes a backplane, at least three LEDs disposed on the backplane, subpixel isolation (SI) structures disposed defining wells of at least three subpixels, a reflection material is disposed on sidewalls and a top surface of the SI structures, at least three of the subpixels have a color conversion material disposed in the wells, an encapsulation layer disposed over the subpixel isolation structures and the subpixels, a light filter layer disposed over the encapsulation layer and micro-lenses disposed over the light filter layer and over each of the wells of the subpixels.

公开(公告)号：US20240145624A1

公开(公告)日：2024-05-02

申请号：US18493426

申请日：2023-10-24

Applicant: Applied Materials, Inc.

Inventor： Peiwen LIU ,  Hyunsung BANG ,  Jianfeng SUN ,  Lisong XU ,  Zhiyong LI ,  Sivapackia GANAPATHIAPPAN ,  Mingwei ZHU ,  Hou T. NG ,  Nag. B. PATIBANDLA

IPC: H01L33/06 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58

CPC classification number: H01L33/06 ,  H01L33/502 ,  H01L33/52 ,  H01L33/58 ,  H01L2933/0041

Abstract: A pixel herein includes a color panel, a light emitting diode (LED) panel, and an adhesive layer disposed between the color panel and the LED panel. The color panel includes a transparent layer, a plurality of sub-pixel isolation structures, and a plurality of black matrix structures disposed between the plurality of sub-pixel isolation structures and the transparent layer. The sub-pixel isolation structures define a plurality color conversion wells of plurality of sub-pixels. A color conversion material is disposed in the color conversion well. The plurality of black matrix structures define a plurality of color resist wells of the plurality of sub-pixels. A color resist is disposed in the color resist wells. The LED panel includes a plurality of micro-LEDs disposed on a backplane. The plurality of micro-LEDs correspond to a sub-pixel.