公开(公告)号：US20230167543A1

公开(公告)日：2023-06-01

申请号：US18101944

申请日：2023-01-26

Applicant: Applied Materials, Inc.

Inventor： Mats LARSSON ,  Kevin A. PAPKE ,  Chirag Shaileshbhai KHAIRNAR ,  Rajasekhar PATIBANDLA ,  Karthikeyan BALARAMAN ,  Balamurugan RAMASAMY ,  Kartik SHAH ,  Umesh M. KELKAR

IPC: C23C16/02 ,  C23C16/40 ,  C23C16/56 ,  C23C16/513 ,  C23C16/44 ,  C04B35/18 ,  C04B35/44 ,  C04B35/10 ,  C04B35/20 ,  C04B35/505 ,  C04B35/14 ,  C04B35/04 ,  C04B35/16 ,  C04B35/01 ,  C04B35/195

CPC classification number: C23C16/0281 ,  C23C16/405 ,  C23C16/56 ,  C23C16/513 ,  C23C16/4404 ,  C04B35/18 ,  C04B35/44 ,  C04B35/10 ,  C04B35/20 ,  C04B35/505 ,  C04B35/14 ,  C04B35/04 ,  C04B35/16 ,  C04B35/01 ,  C04B35/195 ,  Y10S156/914 ,  Y10T428/1317 ,  Y10T428/12743 ,  Y10T428/1259 ,  Y10T428/12667 ,  Y10T428/12764 ,  Y10T428/12604 ,  Y10T428/31504 ,  Y10T428/12736 ,  Y10T428/1266 ,  Y10T428/12597 ,  Y10T428/12611 ,  Y10T428/31678 ,  C04B2235/96

Abstract: One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz.

公开(公告)号：US20200013589A1

公开(公告)日：2020-01-09

申请号：US16401871

申请日：2019-05-02

Applicant: Applied Materials, Inc.

Inventor： Karthikeyan BALARAMAN ,  Sathyanarayana BINDIGANAVALE ,  Rajasekhar PATIBANDLA ,  Balamurugan RAMASAMY ,  Kartik SHAH ,  Umesh M. KELKAR ,  Mats LARSSON ,  Kevin A. PAPKE ,  William M. LU

IPC: H01J37/32 ,  H01L21/687 ,  C23C14/16 ,  C23C14/06 ,  C23C16/06 ,  C23C16/34

Abstract: Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20° C. to about 300° C. during use of the process chamber. The protective multilayer coating comprises a bond layer and a top layer, the bond layer is formed on a chamber component to reduce the stress between the top layer and the chamber component. The reduced stress decreases or prevents particle shedding from the top layer of the multilayer coating during and after use of the process chamber. The bond layer comprises titanium, titanium nitride, aluminum, or combinations thereof, and the top layer comprises tungsten nitride.

公开(公告)号：US20250086356A1

公开(公告)日：2025-03-13

申请号：US18244113

申请日：2023-09-08

Applicant: Applied Materials, Inc.

Inventor： Adolph Miller ALLEN ,  Karthik RAMANATHAN ,  Girish VENKATACHALAPATHY ,  Umesh M. KELKAR ,  Kasturi Tulashidas SARANG ,  Yimeng LYU ,  Weize HU ,  Ying TENG ,  Sejune CHEON ,  Shiqi DONG ,  Paul Gerard KIELY ,  Milan PRAKASH

IPC: G06F30/27 ,  G05B19/418

Abstract: A method, apparatus, and system for controlling a multi-chamber system configured to process substrates are described herein. In some embodiments, a method comprises automatically determining, by each digital twin device a first data set associated with a corresponding process chamber of process chambers. The plurality of digital twin devices captures and models characteristics and processes of process chambers and generates control inputs for controlling the process chambers or processes executed by the chambers during the manufacturing of substrates. The method further comprises automatically generating, by each digital twin device, a second data set that comprises control inputs, and automatically transmitting the second data set to the process chamber.

公开(公告)号：US20190194810A1

公开(公告)日：2019-06-27

申请号：US16292078

申请日：2019-03-04

Applicant: Applied Materials, Inc.

Inventor： Kartik SHAH ,  Chaitanya A. PRASAD ,  Kevin Joseph BAUTISTA ,  Jeffrey TOBIN ,  Umesh M. KELKAR ,  Lara HAWRYLCHAK

IPC: C23C16/455 ,  H01L21/67 ,  C23C16/458

CPC classification number: C23C16/45565 ,  C23C16/458 ,  C23C16/4584 ,  H01L21/67115

Abstract: Embodiments described herein relate to a showerhead having a reflector plate with a gas injection insert for radially distributing gas. In one embodiment, a showerhead assembly includes a reflector plate and a gas injection insert. The reflector plate includes at least one gas injection port. The gas injection insert is disposed in the reflector plate, and includes a plurality of apertures. The gas injection insert also includes a baffle plate disposed in the gas injection insert, wherein the baffle plate also includes a plurality of apertures. A first plenum is formed between a first portion of the baffle plate and the reflector plate, and a second plenum is formed between a second portion of the baffle plate and the reflector plate. The plurality of apertures of the gas injection insert and the plurality of apertures of the baffle plate are not axially aligned.

公开(公告)号：US20150329966A1

公开(公告)日：2015-11-19

申请号：US14691496

申请日：2015-04-20

Applicant: Applied Materials, Inc.

Inventor： Kartik SHAH ,  Chaitanya A. PRASAD ,  Kevin Joseph BAUTISTA ,  Jeffrey TOBIN ,  Umesh M. KELKAR ,  Lara HAWRYLCHAK

IPC: C23C16/455 ,  C23C16/458

CPC classification number: C23C16/45565 ,  C23C16/458 ,  C23C16/4584 ,  H01L21/67115

Abstract: Embodiments described herein relate to a showerhead having a reflector plate with a gas injection insert for radially distributing gas. In one embodiment, a showerhead assembly includes a reflector plate and a gas injection insert. The reflector plate includes at least one gas injection port. The gas injection insert is disposed in the reflector plate, and includes a plurality of apertures. The gas injection insert also includes a baffle plate disposed in the gas injection insert, wherein the baffle plate also includes a plurality of apertures. A first plenum is formed between a first portion of the baffle plate and the reflector plate, and a second plenum is formed between a second portion of the baffle plate and the reflector plate. The plurality of apertures of the gas injection insert and the plurality of apertures of the baffle plate are not axially aligned.

Abstract translation: 本文所述的实施例涉及一种具有反射板的喷头，其具有用于径向分布气体的气体注射插入件。 在一个实施例中，喷头组件包括反射板和气体注射插入件。 反射板包括至少一个气体注入口。 气体注射插入件设置在反射板中，并且包括多个孔。 气体注射插入件还包括设置在气体注射插入件中的挡板，其中挡板还包括多个孔。 在挡板的第一部分和反射板之间形成第一增压室，并且在挡板的第二部分和反射板之间形成第二增压室。 气体注射插入物的多个孔和挡板的多个孔不轴向对齐。

公开(公告)号：US20250086357A1

公开(公告)日：2025-03-13

申请号：US18244126

申请日：2023-09-08

Applicant: Applied Materials, Inc.

Inventor： Adolph Miller ALLEN ,  Karthik RAMANATHAN ,  Girish VENKATACHALAPATHY ,  Umesh M. KELKAR ,  Kasturi Tulashidas SARANG ,  Yimeng LYU ,  Weize HU ,  Ying TENG ,  Sejune CHEON ,  Shiqi DONG ,  Paul Gerard KIELY ,  Milan PRAKASH

IPC: G06F30/27 ,  G05B19/418

Abstract: A method, apparatus, and system for controlling a multi-chamber process system for substrate processing are described herein. In some embodiments, a method comprises determining, by each digital twin device, of a plurality of digital twin devices, a first data set associated with at least one process chamber of a plurality of chamber processes, and the corresponding processes for processing a plurality of substrates. Each digital twin device comprises one or more computational models. The first data set comprises measurements reported by probes or sensors within the at least one chamber process, or data collected and reported by internal sensors of the digital twin device. The method further automatically generating, by each digital twin device a second data set based on, at least in part, the first data set, and by executing one or more computational models of the digital twin device.

公开(公告)号：US20250085699A1

公开(公告)日：2025-03-13

申请号：US18244104

申请日：2023-09-08

Applicant: Applied Materials, Inc.

Inventor： Adolph Miller ALLEN ,  Karthik RAMANATHAN ,  Girish VENKATACHALAPATHY ,  Umesh M. KELKAR ,  Kasturi Tulashidas SARANG ,  Yimeng LYU ,  Weize HU ,  Ying TENG ,  Sejune CHEON ,  Shiqi DONG ,  Paul Gerard KIELY ,  Milan PRAKASH

IPC: G05B19/418 ,  H01L21/67

Abstract: A method, apparatus, and system for controlling a physical twin chamber configured to process substrates are described herein. In some embodiments, a method comprises determining, by a digital twin device, characteristics of a physical twin chamber and generating control inputs for controlling the physical twin chamber. The digital twin device comprises one or more computational models for determining the characteristics of the physical twin and for generating the control inputs. The digital twin device determines a first data set associated with the physical twin chamber. The first data set comprises process data collected by sensors configured to measure attributes of the physical twin chamber. Based on the first data, the digital twin device automatically generates a second data set based on the generated control inputs and transmits the second data set to the physical twin chamber for controlling the process performed on the substrates by the physical twin chamber.

公开(公告)号：US20200270747A1

公开(公告)日：2020-08-27

申请号：US16791264

申请日：2020-02-14

Applicant: Applied Materials, Inc.

Inventor： Mats LARSSON ,  Kevin A. PAPKE ,  Chirag Shaileshbhai KHAIRNAR ,  Rajasekhar PATIBANDLA ,  Karthikeyan BALARAMAN ,  Balamurugan RAMASAMY ,  Kartik SHAH ,  Umesh M. KELKAR

IPC: C23C16/02 ,  C23C16/513 ,  C23C16/56 ,  C23C16/40

Abstract: One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz.

公开(公告)号：US20200234932A1

公开(公告)日：2020-07-23

申请号：US16703140

申请日：2019-12-04

Applicant: Applied Materials, Inc.

Inventor： Venkata Sharat Chandra PARIMI ,  Zubin HUANG ,  Jian LI ,  Satish RADHAKRISHNAN ,  Rui CHENG ,  Diwakar N. KEDLAYA ,  Juan Carlos ROCHA-ALVAREZ ,  Umesh M. KELKAR ,  Karthik JANAKIRAMAN ,  Sarah Michelle BOBEK ,  Prashant Kumar KULSHRESHTHA ,  Vinay K. PRABHAKAR ,  Byung Seok KWON

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50

Abstract: Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.

公开(公告)号：US20200020511A1

公开(公告)日：2020-01-16

申请号：US16412109

申请日：2019-05-14

Applicant: Applied Materials, Inc.

Inventor： Karthikeyan BALARAMAN ,  Balamurugan RAMASAMY ,  Kartik SHAH ,  Mats LARSSON ,  Kevin A. PAPKE ,  Rajasekhar PATIBANDLA ,  Sathyanarayana BINDIGANAVALE ,  Umesh M. KELKAR

IPC: H01J37/32 ,  C23C28/04

Abstract: Embodiments of the present disclosure provide protective coatings, i.e., diffusion and thermal barrier coatings, for aluminum alloy substrates. In particular, embodiments described herein provide a protective layer stack comprising a tantalum nitride layer disposed on an aluminum alloy substrate and a ceramic layer disposed on the tantalum nitride layer. In some embodiments, the aluminum alloy substrates comprise processing chambers and processing chamber components used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, an article includes a substrate, a tantalum nitride layer disposed on the substrate, and a ceramic layer disposed on the tantalum nitride layer.