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公开(公告)号：US20150144383A1
公开(公告)日：2015-05-28
申请号：US14612046
申请日：2015-02-02
Applicant: Avant Technology, Inc.
Inventor： Paul Goodwin
CPC classification number: H05K1/0284 , H01R12/7082 , H01R12/721 , H05K1/0296 , H05K1/111 , H05K3/0017 , H05K2201/09081 , H05K2201/10189
Abstract: A high speed, high reliability circuit module and connective strategy that is connectively compliant with a receptacle in compliance with the SFF-8639 Specification whether expressing for example a PCIe interface or a high speed SAS interface. The present invention reduces impedance discontinuity by reducing the interconnection length and cross-planar transit found in typical specification compliant connectors.
Abstract translation: 高速，高可靠性电路模块和连接性策略，符合SFF-8639规范的插座，无论是表示PCIe接口还是高速SAS接口。 本发明通过减少在典型的规范兼容连接器中发现的互连长度和跨平面转移来减少阻抗不连续性。
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公开(公告)号：US09402308B2
公开(公告)日：2016-07-26
申请号：US14612046
申请日：2015-02-02
Applicant: Avant Technology, Inc.
Inventor： Paul Goodwin
CPC classification number: H05K1/0284 , H01R12/7082 , H01R12/721 , H05K1/0296 , H05K1/111 , H05K3/0017 , H05K2201/09081 , H05K2201/10189
Abstract: A high speed, high reliability circuit module and connective strategy that is connectively compliant with a receptacle in compliance with the SFF-8639 Specification whether expressing for example a PCIe interface or a high speed SAS interface. The present invention reduces impedance discontinuity by reducing the interconnection length and cross-planar transit found in typical specification compliant connectors.
Abstract translation: 高速，高可靠性电路模块和连接性策略，符合SFF-8639规范的插座，无论是表示PCIe接口还是高速SAS接口。 本发明通过减少在典型的规范兼容连接器中发现的互连长度和跨平面转移来减少阻抗不连续性。
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公开(公告)号：US09301415B2
公开(公告)日：2016-03-29
申请号：US14626515
申请日：2015-02-19
Applicant: Avant Technology, Inc.
Inventor： Paul Goodwin , Tim Peddecord
CPC classification number: H05K7/1053 , G06F1/186 , H01R12/7082 , H01R12/721 , H05K1/0284 , H05K1/0296 , H05K1/111 , H05K1/117 , H05K3/0017 , H05K2201/09081 , H05K2201/10189
Abstract: A circuit module configured for connective mating with standards compliant receptacles includes a PCB configured with one or more tabs populated with conductive pads for connection to the receptacle. In preferred embodiments, the tab or tabs emerge from a circuit module case configured to be substantially compliant with dimensional requirements for connectors that couple with receptacles compliant with various specifications including, in preferred embodiments, the SFF 8639 or SATA Specifications.
Abstract translation: 配置用于与标准兼容的插座连接配合的电路模块包括配置有一个或多个突片的PCB，该标签上嵌有用于连接到插座的导电焊盘。 在优选实施例中，突出部或突出部从电路模块壳体出现，电路模块壳体被配置为基本上符合连接器的尺寸要求，该连接器与符合各种规格的插座相连，在优选实施例中包括SFF 8639或SATA规格。
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公开(公告)号：US20150163944A1
公开(公告)日：2015-06-11
申请号：US14626515
申请日：2015-02-19
Applicant: Avant Technology, Inc.
Inventor： Paul Goodwin , Tim Peddecord
CPC classification number: H05K7/1053 , G06F1/186 , H01R12/7082 , H01R12/721 , H05K1/0284 , H05K1/0296 , H05K1/111 , H05K1/117 , H05K3/0017 , H05K2201/09081 , H05K2201/10189
Abstract: A circuit module configured for connective mating with standards compliant receptacles includes a PCB configured with one or more tabs populated with conductive pads for connection to the receptacle. In preferred embodiments, the tab or tabs emerge from a circuit module case configured to be substantially compliant with dimensional requirements for connectors that couple with receptacles compliant with various specifications including, in preferred embodiments, the SFF 8639 or SATA Specifications.
Abstract translation: 配置用于与标准兼容的插座连接配合的电路模块包括配置有一个或多个突片的PCB，该标签上嵌有用于连接到插座的导电焊盘。 在优选实施例中，突出部或突出部从电路模块壳体出现，电路模块壳体被配置为基本上符合连接器的尺寸要求，该连接器与符合各种规格的插座相连，在优选实施例中包括SFF 8639或SATA规格。
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