MEMORY ARRANGEMENT
    1.
    发明申请
    MEMORY ARRANGEMENT 审中-公开

    公开(公告)号:US20180158490A1

    公开(公告)日:2018-06-07

    申请号:US15823932

    申请日:2017-11-28

    Applicant: Axis AB

    Inventor: Henrik HOVMOLLER

    Abstract: A memory arrangement and method to arrange memories are disclosed. The memory arrangement comprises at least two memory chips (M1, M2) arranged on a Printed Circuit Board, PCB. A first memory chip (M1) is arranged on a first surface of the PCB, a second memory chip (M2) is arranged on a second surface of the PCB. The second memory chip (M2) is placed back to back to the first memory chip (M1) and oriented such that respective pins having the same function on the first memory chip (M1) and the second memory chip (M2) are placed opposite to each other and connected by vias to respective signal traces arranged between the first and second surfaces of the PCB.

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