公开(公告)号：US20170298529A1

公开(公告)日：2017-10-19

申请号：US15099738

申请日：2016-04-15

Applicant: BOARDTEK ELECTRONICS CORPORATION.

Inventor： Wen-Feng Cheng ,  Shun-Chang HSIAO ,  Huan-Hsin LO ,  Chi-Chang HSU ,  Shang-Pei Sun

IPC: C25D17/00 ,  C25D17/10 ,  C25D21/12

CPC classification number: C25D17/007 ,  C25D17/005 ,  C25D17/10 ,  C25D17/12 ,  C25D21/12

Abstract: An electroplating system includes an electroplating bath in which a cathode end and at least an anode end are configured. The anode end is provided with plural anode elements which are insulative from one another, as well as plural conductive elements which are connected electrically with each anode element, respectively. The electroplating system enables a variety of distribution of the electric lines of force to be formed in the electroplating bath through energizing one or any number of anode elements. In particular, good benefits can be achieved by a more aggressive and reliable means, without a need for changing the original anode end equipment.

公开(公告)号：US11063333B2

公开(公告)日：2021-07-13

申请号：US16517318

申请日：2019-07-19

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Wen-Feng Cheng ,  Chien-Cheng Lee

IPC: H01P3/12 ,  H05K9/00

Abstract: An electromagnetic wave transmission board includes a composite board and a plated metal layer. The composite board has a plurality of inner walls surroundingly defining an elongated channel in an interior of the composite board. The plated metal layer is formed on at least part of the inner walls so as to jointly form an inner channel structure in the channel. The inner channel structure surroundingly defines a predetermined space filled with air, and the inner channel structure has two entrances in air communication with the predetermined space. The predetermined space of the inner channel structure is configured to receive and output an electromagnetic wave signal through the two entrances, respectively, and the electromagnetic wave transmission board is configured to transmit the electromagnetic wave signal by using the air in the predetermined space of the inner channel structure as a conductive medium.

公开(公告)号：US09860990B1

公开(公告)日：2018-01-02

申请号：US15393633

申请日：2016-12-29

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Chien-Cheng Lee ,  Wen-Feng Cheng ,  Chung-Hsing Liao

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/02 ,  H05K3/40 ,  H05K3/32 ,  H05K3/06 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/24247 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0268 ,  H05K1/0298 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/32 ,  H05K3/40 ,  H05K3/4641 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/066 ,  H05K2201/10522 ,  H05K2203/0228 ,  H05K2203/16

Abstract: A circuit board structure with chips embedded therein includes a multi-layer board and a power module embedded in the multi-layer board. The power module includes an insulating material, a power unit covered by the insulating material, and a circuit layer disposed on the insulating material. The power unit includes an electrically and thermally conductive carrier and a plurality of power chips. The electrically and thermally conductive carrier includes a transmitting portion and a carrying portion perpendicularly connected to the transmitting portion. Each power chip has a first electrode layer and an opposite second electrode layer. The first electrode layers are fixed on and electrically connected to the carrying portion in parallel, and the power chips are disposed at one side of the transmitting portion. The circuit layer is electrically connected to the electrically and thermally conductive carrier and the second electrode layers.

公开(公告)号：US20170298530A1

公开(公告)日：2017-10-19

申请号：US15099695

申请日：2016-04-15

Applicant: BOARDTEK ELECTRONICS CORPORATION.

Inventor： Wen-Feng Cheng ,  Shun-Chang HSIAO ,  Huan-Hsin LO ,  Chi-Chang HSU ,  Shang-Pei Sun

IPC: C25D17/12

CPC classification number: C25D17/12 ,  C25D17/007 ,  C25D21/12

Abstract: An electroplating anode assembly includes primarily a bracket on which plural anode elements are disposed, with which anode element controlling the on or off of the circuit, respectively. The electroplating anode assembly enables a variety of distribution of the electric lines of force to be formed in an electroplating bath through energizing one or any number of anode elements. In particular, when the shape of the product to be electroplated or the configuration that the product is suspended and disposed is changed, the corresponding distribution of the electric lines of force can be formed only through a simple way of switching an electric current supplying loop, so as to secure the quality of electroplating of the product using a more aggressive and reliable means.