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1.发明申请公开(公告)号：US20230025696A1
公开(公告)日：2023-01-26
申请号：US17389605
申请日：2021-07-30
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： CHUNG-HSING LIAO
Abstract: An electromagnetic wave transmission board proofed against internal signal leakage includes an inner plate, a first outer plate, a second outer plate, a first plate bump, a first conductive bump, a second plate bump, and a second conductive bump. The inner plate defines a first through hole with a plated metal layer on the hole wall. The first and second plated bumps are disposed between the first outer and inner plates. The second plate bump and the second conductive bump are disposed between the second outer plate and the inner plate. The plate metal layer, the first plate bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump jointly form an air-filled chamber. A method for manufacturing the electromagnetic wave transmission board is also provided.
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公开(公告)号：US20150052742A1
公开(公告)日：2015-02-26
申请号：US13973012
申请日：2013-08-22
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： CHIEN-CHENG LEE , Chung-Hsing Liao
IPC: H05K1/02
CPC classification number: H05K1/0204 , H05K1/021 , H05K3/0035 , H05K3/42 , H05K2201/10674 , H05K2203/025 , H05K2203/0597 , H05K2203/0733 , Y10T29/49124
Abstract: A circuit board structure manufacturing method includes the following steps. A circuit substrate is provided including an insulating layer, a first metal layer, and a second metal layer. The insulating layer is disposed between the first metal layer and the second metal layer. The first metal layer has a first cavity. The insulating layer has a second cavity and a provisional region. A width of the first cavity is larger than a width of the second cavity. The provisional region is defined between a sidewall of the first metal layer defining the first cavity and another sidewall of the first metal layer defining the second cavity. A first masking layer is formed to cover the first metal layer and provisional region. The second cavity is exposed from the first masking layer. A heat-dissipating metal member is formed in the second cavity. Furthermore, the first masking layer is removed.
Abstract translation: 电路板结构制造方法包括以下步骤。 提供了包括绝缘层，第一金属层和第二金属层的电路基板。 绝缘层设置在第一金属层和第二金属层之间。 第一金属层具有第一腔。 绝缘层具有第二腔和临时区。 第一腔的宽度大于第二腔的宽度。 临时区域限定在限定第一空腔的第一金属层的侧壁和限定第二空腔的第一金属层的另一个侧壁之间。 形成第一掩模层以覆盖第一金属层和临时区域。 第二腔从第一掩模层露出。 散热金属部件形成在第二腔中。 此外，去除第一掩模层。
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公开(公告)号：US20140123487A1
公开(公告)日：2014-05-08
申请号：US13671742
申请日：2012-11-08
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： CHIEN-CHENG LEE
IPC: H05K3/10
CPC classification number: H05K1/0265 , H05K3/022 , H05K3/10 , H05K3/427 , H05K3/429 , H05K2201/09736 , H05K2203/0723 , H05K2203/1476 , Y10T29/49155
Abstract: In a printed circuit board manufacturing method that manufactures at least one thin circuit and at least one large cross-section circuit on a same PCB substrate, a circuit trench is formed on a first PCB substrate having a copper clad circuit layer of a smaller thickness and exposed from the bottom of a groove on another side of the copper clad layer, and then a thick copper is filled into the circuit trench by a copper electroplating method until the thick copper is protruded from the first PCB substrate to form the large cross-section circuit along the circuit trench, and at least one prepreg is covered onto the large cross-section circuit and at a position where it is exposed from the board surface of the first PCB substrate, and the prepreg is covered onto the large cross-section circuit by a hot melt pressing method to maintain a flat smooth surface.
Abstract translation: 在制造同一PCB基板上的至少一个薄电路和至少一个大截面电路的印刷电路板的制造方法中，在具有较薄厚度的铜包层电路层的第一PCB基板上形成电路沟槽， 从铜包层的另一侧的槽的底部露出，然后用铜电镀法将厚铜填充到电路沟槽中，直到厚铜从第一PCB基板突出形成大的截面 电路沟槽，并且至少一个预浸料被覆盖在大横截面电路上以及从第一PCB基板的板表面露出的位置，并且预浸料被覆盖在大的横截面电路 通过热熔压制法保持平滑光滑的表面。
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公开(公告)号：US20230411334A1
公开(公告)日：2023-12-21
申请号：US17865586
申请日：2022-07-15
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： CHIEN-CHENG LEE
IPC: H01L23/00 , H01L23/498 , H01L23/367 , H01L21/48
CPC classification number: H01L24/20 , H01L24/32 , H01L24/19 , H01L23/49827 , H01L23/367 , H01L21/486 , H01L21/4867 , H01L24/29 , H01L2224/29339 , H01L24/83 , H01L2224/83192 , H01L2224/83201 , H01L2224/19 , H01L2224/211
Abstract: A high-frequency power module less vulnerable to parasitic phenomena includes first base board, power chip, and second base board. The first base board includes a first substrate, a first conductive wiring layer, and a second conductive wiring layer on each side of the first substrate. The power chip is disposed on the first conductive wiring layer. The second base board includes a second substrate covering the power chip and the first conductive wiring layer, and a third conductive wiring layer away from the first conductive wiring layer. First conductive structures penetrate the second substrate to connect the third conductive wiring layer with the power chip, greatly reducing the lengths of signal paths between components and so parasitic effects A second conductive structure penetrates the first and second substrates to connect the first, second, and third conductive wiring layers. A manufacturing method is also disclosed.
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公开(公告)号：US11678431B2
公开(公告)日：2023-06-13
申请号：US17376406
申请日：2021-07-15
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： Chien-Cheng Lee
CPC classification number: H05K1/024 , H01P3/121 , H01P11/002 , H05K2201/037
Abstract: A method of manufacturing a circuit board having waveguides including forming a waveguiding structure by injection molding. The waveguiding structure includes a plurality of waveguides arranged at intervals and at least one connecting portion connecting two adjacent waveguides. Each waveguide includes a waveguiding substrate and at least one protrusion on the waveguiding substrate. The connecting portion is removed to obtain at least two waveguides. A metal layer is formed to wrap the whole outer surface of each waveguide. A plurality of receiving grooves is formed to penetrate a wiring board. Each waveguide wrapped by the metal layer is embedded in one of the receiving grooves. The waveguides and the wiring board are fixed. A portion of the metal layer on a surface of each protrusion facing away from the waveguiding substrate is removed. A circuit board is also provided.
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Patent Agency Ranking
公开(公告)号：US09661760B2
公开(公告)日：2017-05-23
申请号：US14845597
申请日：2015-09-04
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： Chien-Cheng Lee
CPC classification number: H05K3/4611 , H05K1/0265 , H05K3/022 , H05K3/06 , H05K3/10 , H05K3/427 , H05K3/429 , H05K2201/09736 , H05K2203/0723 , H05K2203/1476 , Y10T29/49155
Abstract: A printed circuit board includes a first substrate, two first circuits formed on a surface of the first substrate, and a thick copper circuit. The thickness of each first circuit is smaller than the thickness of the first substrate, and the first substrate and one of the first circuits cooperatively define a circuit trench. The thick copper circuit is arranged in the circuit trench and is integrally connected to the first circuit, which is corresponding to the groove. The thick copper circuit and the connected first circuit are defined as a thick circuit, and another first circuit is defined as a thin circuit. The length of the thick copper circuit connected to the corresponding first circuit is identical to or greater than 10% of the length of the thick circuit. Additionally, the instant disclosure also provides a method for manufacturing a printed circuit board.
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公开(公告)号：US20150359087A1
公开(公告)日：2015-12-10
申请号：US14299017
申请日：2014-06-09
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： CHIEN-CHENG LEE
CPC classification number: H05K1/0284 , H05K1/0326 , H05K3/4614 , H05K3/4697 , H05K2201/0145 , H05K2201/0154 , H05K2201/0195 , H05K2201/10424 , H05K2201/2018
Abstract: A circuit board having an interior space includes a multi-layer structure and a compartmentalized frame embedded in the multi-layer structure. The multi-layer structure has a plurality of plates stacked along a stacking direction and a gel combining any two adjacent plates. The plates include two outer plates and at least one inner plate arranged between the outer plates. The compartmentalized frame defines a predetermined space. The compartmentalized frame is arranged between the outer plates and substantially abuts the outer plates. The compartmentalized frame is arranged in a path of a flowing direction of gel which flows toward the predetermined space to prevent any gel from flowing into the predetermined space. Thus, the circuit board of the instant disclosure is provided with the interior space accurately formed by embedding the compartmentalized frame.
Abstract translation: 具有内部空间的电路板包括多层结构和嵌入多层结构中的分隔框架。 多层结构具有多个层叠堆叠的板和凝胶组合任何两个相邻的板。 板包括两个外板和布置在外板之间的至少一个内板。 分隔框架限定了预定的空间。 分隔框架布置在外板之间并且基本上邻接外板。 分隔框架布置在朝向预定空间流动的凝胶流动方向的路径中，以防止任何凝胶流入预定空间。 因此，本公开的电路板设置有通过嵌入隔间框架而精确地形成的内部空间。
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公开(公告)号：US11803022B2
公开(公告)日：2023-10-31
申请号：US17412536
申请日：2021-08-26
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： Chien-Cheng Lee
CPC classification number: G02B6/428 , H05K1/0216 , H05K2201/10121
Abstract: A method for manufacturing a circuit board structure with a waveguide is provided. The method includes: providing a plate including a top wall and sidewalls disposed on the top wall, an opening being defined between ends of two adjacent sidewalls away from the top wall; forming a conductive layer on the plate to obtain a conductive plate; providing a circuit board, the circuit board comprising an outer circuit layer; mounting the conductive plate on the outer circuit layer, causing the outer circuit layer to be disposed on the opening. The two adjacent sidewalls, the top wall between the two adjacent sidewalls, and the circuit board between the two adjacent sidewalls cooperatively constitutes a tube body of the waveguide, and the conductive layer and the outer circuit layer on an inner surface of the tube body cooperatively constitute a shielding of the waveguide.
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公开(公告)号：US20230029270A1
公开(公告)日：2023-01-26
申请号：US17460586
申请日：2021-08-30
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： CHIEN-CHENG LEE
Abstract: A method for manufacturing a circuit board structure with a waveguide is provided. The method includes: providing a first substrate unit, a second substrate unit, a third substrate unit, and two adhesive layers, the first substrate unit including a first dielectric layer and a first conductive layer, the first conductive layer including a first shielding area and two first artificial magnetic conductor areas disposed on two sides of the first shielding area; the second substrate unit including a second dielectric layer and a second conductive layer, the second conductive layer including a second shielding area; the third substrate unit defining a first slot, and the adhesive layer defining a second slot; stacking the first substrate unit, one of the adhesive layers, the third substrate unit, another one of the adhesive layers, and the second substrate unit in that order; pressing the intermediate body.
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公开(公告)号：US20230027319A1
公开(公告)日：2023-01-26
申请号：US17412536
申请日：2021-08-26
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： CHIEN-CHENG LEE
Abstract: A method for manufacturing a circuit board structure with a waveguide is provided. The method includes: providing a plate including a top wall and sidewalls disposed on the top wall, an opening being defined between ends of two adjacent sidewalls away from the top wall; forming a conductive layer on the plate to obtain a conductive plate; providing a circuit board, the circuit board comprising an outer circuit layer; mounting the conductive plate on the outer circuit layer, causing the outer circuit layer to be disposed on the opening. The two adjacent sidewalls, the top wall between the two adjacent sidewalls, and the circuit board between the two adjacent sidewalls cooperatively constitutes a tube body of the waveguide, and the conductive layer and the outer circuit layer on an inner surface of the tube body cooperatively constitute a shielding of the waveguide.
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