公开(公告)号：US20210102797A1

公开(公告)日：2021-04-08

申请号：US17061163

申请日：2020-10-01

Applicant: Bend Labs, Inc.

Inventor： Colton A. Ottley ,  Jared K. Jonas ,  Colin D. Eichinger

IPC: G01B7/30 ,  G01B7/00 ,  G01D5/241 ,  A61B5/107 ,  G01L1/14

Abstract: Disclosed embodiments include a multi-mode sensor including an elastomeric strand having a first multi-mode sensing region configured to sense at least two different physical parameters, and a second multi-mode sensing region, space apart from the first multi-mode sensing region, and configured to sense at least two different physical parameters. In some disclosed embodiments the first multi-mode sensing region is configured to measure the physical parameters of angular displacement and strain.

公开(公告)号：US11690531B2

公开(公告)日：2023-07-04

申请号：US17061163

申请日：2020-10-01

Applicant: Bend Labs, Inc.

Inventor： Colton A. Ottley ,  Jared K. Jonas ,  Colin D. Eichinger

IPC: G01B7/30 ,  G01B7/00 ,  G01D5/241 ,  A61B5/107 ,  G01L1/14 ,  G01D5/24 ,  A61B5/00

CPC classification number: A61B5/1071 ,  G01B7/003 ,  G01B7/30 ,  G01D5/24 ,  G01D5/2412 ,  G01L1/146 ,  A61B5/6807 ,  A61B2562/0247 ,  A63B2220/50

Abstract: Disclosed embodiments include a multi-mode sensor including an elastomeric strand having a first multi-mode sensing region configured to sense at least two different physical parameters, and a second multi-mode sensing region, space apart from the first multi-mode sensing region, and configured to sense at least two different physical parameters. In some disclosed embodiments the first multi-mode sensing region is configured to measure the physical parameters of angular displacement and strain.

公开(公告)号：US11852546B2

公开(公告)日：2023-12-26

申请号：US17534297

申请日：2021-11-23

Applicant: Bend Labs Inc.

Inventor： Colton A. Ottley ,  Jared K. Jonas ,  Colin D. Eichinger ,  Nathan Grimes ,  Nathan C. Briggs

IPC: G01L1/14

CPC classification number: G01L1/142

Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.

公开(公告)号：US20220163412A1

公开(公告)日：2022-05-26

申请号：US17534297

申请日：2021-11-23

Applicant: Bend Labs Inc.

Inventor： Colton A. Ottley ,  Jared K. Jonas ,  Colin D. Eichinger ,  Nathan Grimes ,  Nathan C. Briggs

IPC: G01L1/14

Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.