公开(公告)号：US12247847B2

公开(公告)日：2025-03-11

申请号：US17387709

申请日：2021-07-28

Applicant: Bend Labs, Inc.

Inventor： Colton A Ottley ,  Jared K. Jonas ,  Colin D. Eichinger ,  Nathan Grimes ,  Nathan C. Briggs

IPC: G01D11/24 ,  G01D5/241

Abstract: Disclosed embodiments include compliant sensors having a signal electrode layer of an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor, and a perimeter electrode region. The compliant sensors also include a dielectric layer including an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region and a top electrode layer including an elastomeric material with conducting material integrated within and in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region. In some embodiments, the top electrode layer includes a portion of electrically conducting material configured in a hatched pattern.

公开(公告)号：US11852546B2

公开(公告)日：2023-12-26

申请号：US17534297

申请日：2021-11-23

Applicant: Bend Labs Inc.

Inventor： Colton A. Ottley ,  Jared K. Jonas ,  Colin D. Eichinger ,  Nathan Grimes ,  Nathan C. Briggs

IPC: G01L1/14

CPC classification number: G01L1/142

Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.

公开(公告)号：US20220163412A1

公开(公告)日：2022-05-26

申请号：US17534297

申请日：2021-11-23

Applicant: Bend Labs Inc.

Inventor： Colton A. Ottley ,  Jared K. Jonas ,  Colin D. Eichinger ,  Nathan Grimes ,  Nathan C. Briggs

IPC: G01L1/14

Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.