公开(公告)号：US09978623B2

公开(公告)日：2018-05-22

申请号：US14822392

申请日：2015-08-10

Applicant: Brooks Automation, Inc.

Inventor： Daniel Babbs ,  William Fosnight ,  Robert C. May ,  William Weaver

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67766 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67213 ,  H01L21/67225 ,  H01L21/67376 ,  H01L21/67379 ,  H01L21/67393 ,  H01L21/67742 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S414/14

Abstract: A substrate processing system including a processing section arranged to hold a processing atmosphere therein, a carrier having a shell forming an internal volume for holding at least one substrate for transport to the processing section, the shell being configured to allow the internal volume to be pumped down to a predetermined vacuum pressure that is different than an exterior atmosphere outside the substrate processing system, and a load port communicably connected to the processing section to isolate the processing atmosphere from the exterior atmosphere, the load port being configured to couple with the carrier to pump down the internal volume of the carrier and to communicably connect the carrier to the processing section, for loading the substrate into the processing section through the load port.

公开(公告)号：US09224628B2

公开(公告)日：2015-12-29

申请号：US13625442

申请日：2012-09-24

Applicant: Brooks Automation, Inc.

Inventor： Michael L. Bufano ,  Ulysses Gilchrist ,  William Fosnight ,  Christopher Hofmeister ,  Daniel Babbs ,  Robert C. May

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67733 ,  H01L21/67017 ,  H01L21/67126 ,  H01L21/67201 ,  H01L21/67276 ,  H01L21/67376 ,  H01L21/67379 ,  H01L21/67386 ,  H01L21/677 ,  H01L21/67706 ,  H01L21/67715 ,  H01L21/67724 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67736 ,  H01L21/67757 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775

Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

Abstract translation: 根据示例性实施例，半导体工件处理系统具有至少一个用于处理半导体工件的处理工具，用于将至少一个半导体工件保持在其中以用于传送至至少一个处理工具和从该至少一个处理工具传送的容器和第一传送部分 定义旅行方向。 第一运输部分具有与集装箱接合的部件，沿着行进方向将容器支撑和运输到至少一个加工工具和从该至少一个加工工具运送。 当由第一输送部支撑时，容器以行进方向以基本上恒定的速度基本上连续输送。 第二传送部分连接到至少一个处理工具，用于将容器运送到至少一个处理工具和从该至少一个处理工具传送。

公开(公告)号：US11235935B2

公开(公告)日：2022-02-01

申请号：US17156007

申请日：2021-01-22

Applicant: Brooks Automation, Inc.

Inventor： Daniel Babbs ,  Vincent W. Tsang ,  Robert C. May

IPC: H01L21/687 ,  B65G47/90 ,  H01L21/67

Abstract: A substrate transport apparatus comprising a frame, a drive section connected to the frame, and an articulated arm having at least one articulated arm link operably connected to the drive section so that the articulated arm rotates about a pivot axis relative to the frame and extends and retracts relative to the pivot axis. The articulated arm has an end effector pivotally mounted to at least one articulated arm link forming a joint between the end effector and the articulated arm link, with an arm joint pivot axis disposed so that the end effector rotates relative to at least one articulated arm link about the arm joint pivot axis. The articulated arm has a drive band transmission with drive and driven pulleys where the driven pulley is connected to the articulated wrist.

公开(公告)号：US11121015B2

公开(公告)日：2021-09-14

申请号：US16552881

申请日：2019-08-27

Applicant: Brooks Automation, Inc.

Inventor： Daniel Babbs ,  Robert T. Caveney ,  Robert C. May ,  Krzysztof A. Majczak

IPC: H01L21/673 ,  H01L21/677 ,  H01L21/67

Abstract: A substrate transport system includes a carrier having a housing forming an interior environment having an opening for holding at least one substrate and a door for sealing the opening from an outside atmosphere where when sealed the interior environment is configured to maintain an interior atmosphere therein, the housing including a fluid reservoir exterior to the interior environment and configured to contain a fluid, forming a different atmosphere in the fluid reservoir than the interior atmosphere, to form a fluidic barrier seal that seals the interior environment from an environment exterior to the carrier.

公开(公告)号：US10679882B2

公开(公告)日：2020-06-09

申请号：US14976952

申请日：2015-12-21

Applicant: Brooks Automation, Inc.

Inventor： Michael L. Bufano ,  Ulysses Gilchrist ,  William Fosnight ,  Christopher Hofmeister ,  Daniel Babbs ,  Robert C. May

IPC: H01L21/677

Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

公开(公告)号：US11201070B2

公开(公告)日：2021-12-14

申请号：US15986710

申请日：2018-05-22

Applicant: Brooks Automation, Inc.

Inventor： Daniel Babbs ,  William Fosnight ,  Robert C. May ,  William Weaver

IPC: H01L21/673 ,  H01L21/677 ,  H01L21/67

Abstract: A substrate processing system including a processing section arranged to hold a processing atmosphere therein, a carrier having a shell forming an internal volume for holding at least one substrate for transport to the processing section, the shell being configured to allow the internal volume to be pumped down to a predetermined vacuum pressure that is different than an exterior atmosphere outside the substrate processing system, and a load port communicably connected to the processing section to isolate the processing atmosphere from the exterior atmosphere, the load port being configured to couple with the carrier to pump down the internal volume of the carrier and to communicably connect the carrier to the processing section, for loading the substrate into the processing section through the load port.

公开(公告)号：US20200161153A1

公开(公告)日：2020-05-21

申请号：US16552881

申请日：2019-08-27

Applicant: Brooks Automation, Inc.

Inventor： Daniel Babbs ,  Robert T. Caveney ,  Robert C. May ,  Krysztof A. Majczak

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

Abstract: A substrate transport system includes a carrier having a housing forming an interior environment having an opening for holding at least one substrate and a door for sealing the opening from an outside atmosphere where when sealed the interior environment is configured to maintain an interior atmosphere therein, the housing including a fluid reservoir exterior to the interior environment and configured to contain a fluid, forming a different atmosphere in the fluid reservoir than the interior atmosphere, to form a fluidic barrier seal that seals the interior environment from an environment exterior to the carrier.

公开(公告)号：US10395959B2

公开(公告)日：2019-08-27

申请号：US14161039

申请日：2014-01-22

Applicant: Brooks Automation, Inc.

Inventor： Daniel Babbs ,  Robert T. Caveney ,  Robert C. May ,  Krysztof A. Majczak

IPC: H01L21/677 ,  H01L21/673 ,  H01L21/67

Abstract: A substrate transport system includes a carrier having a housing forming an interior environment having an opening for holding at least one substrate and a door for sealing the opening from an outside atmosphere where when sealed the interior environment is configured to maintain an interior atmosphere therein, the housing including a fluid reservoir exterior to the interior environment and configured to contain a fluid, forming a different atmosphere in the fluid reservoir than the interior atmosphere, to form a fluidic barrier seal that seals the interior environment from an environment exterior to the carrier.

公开(公告)号：US20180269094A1

公开(公告)日：2018-09-20

申请号：US15986710

申请日：2018-05-22

Applicant: Brooks Automation, Inc.

Inventor： Daniel Babbs ,  William Fosnight ,  Robert C. May ,  William Weaver

IPC: H01L21/677 ,  H01L21/673 ,  H01L21/67

CPC classification number: H01L21/67766 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67213 ,  H01L21/67225 ,  H01L21/67376 ,  H01L21/67379 ,  H01L21/67393 ,  H01L21/67742 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S414/14

Abstract: A substrate processing system including a processing section arranged to hold a processing atmosphere therein, a carrier having a shell forming an internal volume for holding at least one substrate for transport to the processing section, the shell being configured to allow the internal volume to be pumped down to a predetermined vacuum pressure that is different than an exterior atmosphere outside the substrate processing system, and a load port communicably connected to the processing section to isolate the processing atmosphere from the exterior atmosphere, the load port being configured to couple with the carrier to pump down the internal volume of the carrier and to communicably connect the carrier to the processing section, for loading the substrate into the processing section through the load port.

公开(公告)号：US20160111308A1

公开(公告)日：2016-04-21

申请号：US14976952

申请日：2015-12-21

Applicant: Brooks Automation, Inc.

Inventor： Michael L. Bufano ,  Ulysses Gilchrist ,  William Fosnight ,  Christopher Hofmeister ,  Daniel Babbs ,  Robert C. May

IPC: H01L21/677

Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.