公开(公告)号：US20250038052A1

公开(公告)日：2025-01-30

申请号：US18611848

申请日：2024-03-21

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Chia-Ling Shih

IPC: H01L21/78 ,  H01L21/48 ,  H01L21/683 ,  H01L23/367

Abstract: In a method of manufacturing a chip structure, a first carrier is attached on a back surface of a wafer, the wafer is diced into individual dies and there is a groove formed between the adjacent dies, then a second carrier is attached on an active surface of the wafer and the first carrier is removed to expose the groove, a back surface and a lateral surface of each of the dies, a heat dissipation cover is formed on the back surface and the lateral surface of each of the dies to obtain chip structures. The heat dissipation cover is provided to increase heat dissipation efficiency of the dies and prevent formation of metal debris which may contaminate the dies. Furthermore, the heat dissipation cover is prevented from being separated from the die.