MICROFLUIDIC SEPARATION DEVICE AND METHOD OF MAKING SAME
    1.
    发明申请
    MICROFLUIDIC SEPARATION DEVICE AND METHOD OF MAKING SAME 审中-公开
    微流体分离装置及其制造方法

    公开(公告)号:US20150209690A1

    公开(公告)日:2015-07-30

    申请号:US14614376

    申请日:2015-02-04

    Abstract: A device and method for making a microfluidic separation device. A microfluidic separation device could include a microfluidic column having an inlet, the microfluidic column being configured to hold a first fluid and the microfluidic column including a porous portion, and an outlet attached to the microfluidic column, the outlet being configured to output a second fluid. The method may include providing a microfluidic column having an inlet, configuring the microfluidic column to hold a first fluid, forming a porous portion in the microfluidic column, and attaching an outlet to the microfluidic column.

    Abstract translation: 用于制造微流体分离装置的装置和方法。 微流体分离装置可以包括具有入口的微流体柱,所述微流体柱被配置为保持第一流体,并且所述微流体柱包括多孔部分和连接到所述微流体柱的出口,所述出口构造成输出第二流体 。 该方法可以包括提供具有入口的微流体柱,构造微流体柱以保持第一流体,在微流体柱中形成多孔部分,以及将出口附接到微流体柱。

    METHODS AND DEVICES FOR SAMPLE LYSIS
    2.
    发明申请
    METHODS AND DEVICES FOR SAMPLE LYSIS 有权
    用于样本检测的方法和设备

    公开(公告)号:US20140087359A1

    公开(公告)日:2014-03-27

    申请号:US14033365

    申请日:2013-09-20

    Abstract: Disclosed herein are methods and systems for use in preparing a sample. The methods and systems may be used for lysing one or more structures in a sample (e.g., cells, viral particles, etc.). The methods and compositions may comprise a microfluidic chip or use thereof. The microfluidic chips disclosed herein may comprise (a) a substrate comprising a chamber, wherein at least one mechanical element may be located within the chamber; (b) a thermal element in contact with the chamber; and (c) at least one aperture within the surface of the substrate, wherein the aperture may be configured to insulate the chamber.

    Abstract translation: 本文公开了用于制备样品的方法和系统。 方法和系统可用于裂解样品中的一种或多种结构(例如,细胞,病毒颗粒等)。 所述方法和组合物可以包含微流控芯片或其用途。 本文公开的微流体芯片可以包括(a)包括腔室的基底,其中至少一个机械元件可以位于腔室内; (b)与所述室接触的热元件; 以及(c)在所述基底表面内的至少一个孔,其中所述孔可以被配置为使所述腔绝缘。

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