OBJECTIVE LENS
    1.
    发明申请
    OBJECTIVE LENS 审中-公开

    公开(公告)号:US20190033234A1

    公开(公告)日:2019-01-31

    申请号:US15881777

    申请日:2018-01-28

    Applicant: Camtek Ltd.

    Abstract: An inspection system for inspecting a semiconductor substrate, the inspection system may include an inspection unit that comprises a partially blocking bright field unit and a non-blocking bright field unit; wherein the partially blocking bright field unit is configured to block any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along a first axis, of an area of the wafer, (b) the specular reflection propagates along a second axis, (c) the first axis and the second axis are symmetrical about a normal to the area of the wafer, and (d) the normal is parallel to an optical axis of the partially blocking bright field unit; and wherein the non-blocking bright field unit is configured to pass to the image plane any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along the first axis, of an area of the wafer, (b) the specular reflection propagates along the second axis, (c) the first axis and the second axis are symmetrical about the normal, and (d) the normal is parallel to the optical axis of the partially blocking bright field unit.

    SYSTEM AND A METHOD FOR AUTOMATIC RECIPE VALIDATION AND SELECTION
    2.
    发明申请
    SYSTEM AND A METHOD FOR AUTOMATIC RECIPE VALIDATION AND SELECTION 审中-公开
    系统和自动验证和选择的方法

    公开(公告)号:US20160321792A1

    公开(公告)日:2016-11-03

    申请号:US15208678

    申请日:2016-07-13

    Applicant: CAMTEK LTD.

    Abstract: A system, a non-transitory computer program product and a method for selecting an inspection recipe, the method includes: (i) obtaining an image of a structural element of the semiconductor device; (ii) calculating multiple types of distances between the image of the structural element and each of a plurality of reference images obtained by applying a plurality of inspection recipes; and (iii) automatically selecting at least one selected inspection recipe out of the plurality of inspection recipes based on values of the multiple types of distances.

    Abstract translation: 一种系统,非暂时性计算机程序产品和用于选择检查配方的方法,所述方法包括:(i)获得半导体器件的结构元件的图像; (ii)计算结构元素的图像与通过应用多个检查配方获得的多个参考图像中的每一个之间的距离的多种类型; 和(iii)基于多种类型的距离的值自动地选择多个检查配方中的至少一个选择的检查配方。

    High throughput triangulation system
    4.
    发明申请
    High throughput triangulation system 有权
    高通量三角测量系统

    公开(公告)号:US20170010093A1

    公开(公告)日:2017-01-12

    申请号:US15158665

    申请日:2016-05-19

    Applicant: CAMTEK LTD.

    CPC classification number: G01B11/2522 G01B11/25

    Abstract: A system for measuring heights of multiple structures of an object, the system may include an illumination module that is configured to illuminate the object by a light strip that is spatially incoherent; multiple cameras; a collection module that is configured to collect light that is reflected from the object and to distribute the light to the multiple cameras; wherein the collection module has an elongated field of view that has a longitudinal axis that is parallel to the light strip; wherein the multiple cameras are configured to generate, during a height measurement process, detection signals indicative of heights of the multiple structures; a mechanical stage for introducing a movement, during the height measurement process, between the object and each one of the illumination module and the collection module; and a processor that is configured to process the detection signals to determine the heights of the multiple structures.

    Abstract translation: 一种用于测量物体的多个结构的高度的系统,所述系统可以包括照明模块,其被配置为通过空间不相干的光条照射所述物体; 多台相机; 收集模块,被配置为收集从对象反射并将光分布到多个相机的光; 其中所述收集模块具有细长视场,其具有平行于所述光条的纵向轴线; 其中所述多个照相机被配置为在高度测量过程期间生成指示所述多个结构的高度的检测信号; 用于在所述高度测量过程期间在所述对象和所述照明模块和所述收集模块中的每一个之间引入运动的机械平台; 以及被配置为处理所述检测信号以确定所述多个结构的高度的处理器。

    HIGH THROUGHPUT AND LOW COST HEIGHT TRIANGULATION SYSTEM AND METHOD
    5.
    发明申请
    HIGH THROUGHPUT AND LOW COST HEIGHT TRIANGULATION SYSTEM AND METHOD 有权
    高通量和低成本高度三角系统和方法

    公开(公告)号:US20140362208A1

    公开(公告)日:2014-12-11

    申请号:US14284483

    申请日:2014-05-22

    Applicant: CAMTEK LTD.

    Abstract: A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.

    Abstract translation: 一种三角测量系统,包括区域照相机,通信接口,第一图像处理模块,第二图像处理模块; 其中所述区域相机被布置成以获取速率获得对象的照明区域的图像流; 其中防止区域相机执行高度计算; 其中所述通信接口被布置成实时地从所述区域摄像机向所述第一图像处理模块传送与所述获取速率相对应的图像流; 其中所述第一图像处理模块被布置成实时地处理所述图像流以提供第一压缩信息; 其中所述第二图像处理模块被布置成以非实时图像处理速率处理所述第一压缩信息以提供指示所述对象的至少所述照明区域的高度的高度信息。

    Aperture stop
    6.
    发明授权

    公开(公告)号:US10222517B2

    公开(公告)日:2019-03-05

    申请号:US15469578

    申请日:2017-03-27

    Applicant: Camtek Ltd.

    Abstract: An aperture stop that includes a non-circular region that comprises at least one opaque region and at least one opening region; wherein each point in the at least one opening region is (a) mapped to an angle of illumination and (b) is associated with a corresponding point in the at least one opaque region that. mapped to an angle of specular reflectance from the angle of illumination mapped to the opening point.

    System for inspecting a backside of a wafer

    公开(公告)号:US10215707B2

    公开(公告)日:2019-02-26

    申请号:US15207537

    申请日:2016-07-12

    Applicant: CAMTEK LTD.

    Abstract: An inspection system for inspection a surface of a substrate, the inspection system may include an interface for holding the substrate; a movement mechanism for moving the interface, thereby moving the substrate between different positions; a bright field light source that is configured to illuminate different bright field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; at least one dark field light source that is configured to illuminate different dark field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; and a camera that is configured to: (a) generate bright field detection signals in response to light that is detected by the camera as a result of the illumination of the different bright field illuminated parts; and (b) generate dark field detection signals in response to light that is detected by the camera as a result of the illumination of the different dark field illuminated parts; and wherein light that is detected by the camera as the result of the illumination of the different bright field illuminated parts and as the result of the illumination of the different dark field illuminated parts does not include an image of the camera.

    APERTURE STOP
    8.
    发明申请
    APERTURE STOP 审中-公开

    公开(公告)号:US20170261654A1

    公开(公告)日:2017-09-14

    申请号:US15469578

    申请日:2017-03-27

    Applicant: Camtek Ltd.

    Abstract: An aperture stop that includes a non-circular region that comprises at least one opaque region and at least one opening region; wherein each point in the at least one opening region is (a) mapped to an angle of illumination and (b) is associated with a corresponding point in the at least one opaque region that. mapped to an angle of specular reflectance from the angle of illumination mapped to the opening point.

    SYSTEM FOR INSPECTING A BACKSIDE OF A WAFER
    9.
    发明申请
    SYSTEM FOR INSPECTING A BACKSIDE OF A WAFER 审中-公开
    检查水底座的系统

    公开(公告)号:US20170010220A1

    公开(公告)日:2017-01-12

    申请号:US15207537

    申请日:2016-07-12

    Applicant: CAMTEK LTD.

    Abstract: An inspection system for inspection a surface of a substrate, the inspection system may include an interface for holding the substrate; a movement mechanism for moving the interface, thereby moving the substrate between different positions; a bright field light source that is configured to illuminate different bright field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; at least one dark field light source that is configured to illuminate different dark field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; and a camera that is configured to: (a) generate bright field detection signals in response to light that is detected by the camera as a result of the illumination of the different bright field illuminated parts; and (b) generate dark field detection signals in response to light that is detected by the camera as a result of the illumination of the different dark field illuminated parts; and wherein light that is detected by the camera as the result of the illumination of the different bright field illuminated parts and as the result of the illumination of the different dark field illuminated parts does not include an image of the camera.

    Abstract translation: 一种用于检查基板表面的检查系统,所述检查系统可以包括用于保持基板的界面; 用于移动界面的移动机构,从而使基板在不同位置之间移动; 配置为当所述基板位于所述不同位置时照亮所述基板表面的不同亮场照明部分的亮场光源; 至少一个暗场光源,其构造成当所述衬底位于所述不同位置时照亮所述衬底表面的不同暗场照射部分; 以及相机,其被配置为:(a)响应于由所述照相机检测到的由于所述不同亮场照明部分的照明的结果而产生亮场检测信号; 以及(b)响应于照相机由于不同暗场照明部分的照明而检测到的光而产生暗视场检测信号; 并且由于作为不同亮场照明部分的照明的结果由照相机检测到的光和作为不同暗场照射部分的照明的结果的光不包括照相机的图像。

    Objective lens
    10.
    发明授权

    公开(公告)号:US10598607B2

    公开(公告)日:2020-03-24

    申请号:US15881777

    申请日:2018-01-28

    Applicant: Camtek Ltd.

    Abstract: An inspection system for inspecting a semiconductor substrate, the inspection system may include an inspection unit that comprises a partially blocking bright field unit and a non-blocking bright field unit; wherein the partially blocking bright field unit is configured to block any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along a first axis, of an area of the wafer, (b) the specular reflection propagates along a second axis, (c) the first axis and the second axis are symmetrical about a normal to the area of the wafer, and (d) the normal is parallel to an optical axis of the partially blocking bright field unit; and wherein the non-blocking bright field unit is configured to pass to the image plane any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along the first axis, of an area of the wafer, (b) the specular reflection propagates along the second axis, (c) the first axis and the second axis are symmetrical about the normal, and (d) the normal is parallel to the optical axis of the partially blocking bright field unit.

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