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公开(公告)号:US20170348466A1
公开(公告)日:2017-12-07
申请号:US15602645
申请日:2017-05-23
Applicant: Cardiac Pacemakers, Inc.
Inventor: Eoin Enright
CPC classification number: A61L31/10 , A61L29/02 , A61L29/085 , A61L31/022 , A61L2420/02 , B05D1/60 , B05D3/002 , B05D3/06 , B05D2202/00 , B05D2202/15 , B05D2202/35 , B05D2350/33 , C08L65/04
Abstract: A process for coating parylene onto a metal surface, such as a medical device, that has been textured by a series of laser pulses. The laser pulses can be overlapping or rastered. The textured portion of the metal surface and parylene coating can form a strong mechanical interlock. The bond created by using the laser texturing process can result in a cohesive failure of the parylene and not an adhesive failure of the bonding.
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公开(公告)号:US08849420B2
公开(公告)日:2014-09-30
申请号:US13711664
申请日:2012-12-12
Applicant: Cardiac Pacemakers, Inc.
Inventor: Michael J. Kane , John O'Rourke , Eoin Enright , Moira B. Sweeney , Daragh Nolan , James Michael English
CPC classification number: A61N1/05 , A61N1/3752 , H01R13/405 , H01R13/5224 , H01R24/76 , H01R43/00 , Y10T29/49004
Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device includes a device container including an electronic module within the device container. A header core includes a bore hole portion and at least two electronic connection features disposed within the bore hole portion. The bore hole portion includes at least one cavity configured to allow placement of at least one of the electronic connection features within the bore hole portion. The at least two electronic connection features are electrically coupled to the electronic module within the device container. The header core is configured to allow location of the at least two electronic connection features in a selected configuration within the bore hole portion. A header shell is disposed around the header core and attached to the device container.
Abstract translation: 描述了可植入医疗装置和集管的系统和方法。 在一个示例中,可植入医疗装置包括在装置容器内包括电子模块的装置容器。 集管芯包括钻孔部分和设置在钻孔部分内的至少两个电连接特征。 所述钻孔部分包括至少一个空腔,其被配置为允许将所述电子连接部件中的至少一个放置在所述钻孔部分内。 该至少两个电子连接特征电耦合到设备容器内的电子模块。 集管芯被配置为允许在钻孔部分内以选定的构造定位至少两个电子连接特征。 集管壳体围绕集管芯设置并附接到设备容器。
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