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公开(公告)号：US11876312B2
公开(公告)日：2024-01-16
申请号：US17487652
申请日：2021-09-28
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Emily Hernandez , Mark Terlaak
CPC classification number: H01R12/613 , H01R12/777 , H05K1/118
Abstract: A connector for connecting a flexible interconnect circuit includes a base, having a first set of protrusions and a second set of protrusions. The first set of protrusions and the second set of protrusions are configured to secure the flexible interconnect circuit at a first set of apertures and a second set of apertures of the flexible interconnect circuit, respectively. The first set of protrusions may be positioned at a first distance from the second set of protrusions on the base. The first set of apertures may be positioned on the flexible interconnect circuit at a second distance, greater than the first distance, from the second set of apertures. The base causes the flexible interconnect circuit into an arched configuration when the apertures are secured to the respective protrusions. The connector further includes a cover piece configured to secure the flexible interconnect circuit in the arched configuration.
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公开(公告)号：US20230371174A1
公开(公告)日：2023-11-16
申请号：US18351437
申请日：2023-07-12
Applicant: CelLink Corporation
Inventor： Jean-Paul Ortiz , Malcom Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
CPC classification number: H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
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公开(公告)号：US20230101123A1
公开(公告)日：2023-03-30
申请号：US18060283
申请日：2022-11-30
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcom Parker Brown , Mark Terlaak , Will Findlay
Abstract: Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.
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公开(公告)号：US11545773B2
公开(公告)日：2023-01-03
申请号：US16939912
申请日：2020-07-27
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Mark Terlaak , Will Findlay
Abstract: Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.
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公开(公告)号：US20250038442A1
公开(公告)日：2025-01-30
申请号：US18915897
申请日：2024-10-15
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Mark Terlaak , Will Findlay
Abstract: Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.
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Patent Agency Ranking
公开(公告)号：US12176640B2
公开(公告)日：2024-12-24
申请号：US18457200
申请日：2023-08-28
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Emily Hernandez , Mark Terlaak , Malcolm Parker Brown
Abstract: Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.
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公开(公告)号：US12010792B2
公开(公告)日：2024-06-11
申请号：US18351437
申请日：2023-07-12
Applicant: CelLink Corporation
Inventor： Jean-Paul Ortiz , Malcom Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
CPC classification number: H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
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公开(公告)号：US11888180B2
公开(公告)日：2024-01-30
申请号：US18352466
申请日：2023-07-14
Applicant: CelLink Corporation
Inventor： Will Findlay , Mark Terlaak , Kevin Michael Coakley , Malcolm Parker Brown , Emily Hernandez
IPC: H01M50/526 , H01M50/533 , H01M50/50 , H01M50/503 , H01M50/555 , H01M50/522 , H01M50/516 , H01M50/502 , H01M50/569
CPC classification number: H01M50/526 , H01M50/50 , H01M50/502 , H01M50/516 , H01M50/522 , H01M50/533 , H01M50/569 , H01M50/503 , H01M50/555
Abstract: Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity. The two conductive layers can be welded together to ensure electric connections and mechanical support.
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公开(公告)号：US20220311103A1
公开(公告)日：2022-09-29
申请号：US17656370
申请日：2022-03-24
Applicant: CelLink Corporation
Inventor： Will Findlay , Mark Terlaak , Kevin Michael Coakley , Malcolm Parker Brown , Emily Hernandez
IPC: H01M50/526 , H01M50/516 , H01M50/522 , H01M50/533
Abstract: Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity. The two conductive layers can be welded together to ensure electric connections and mechanical support.
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公开(公告)号：US20250070490A1
公开(公告)日：2025-02-27
申请号：US18944424
申请日：2024-11-12
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Emily Hernandez , Mark Terlaak , Malcolm Parker Brown
Abstract: Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.
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