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公开(公告)号：US20230371174A1
公开(公告)日：2023-11-16
申请号：US18351437
申请日：2023-07-12
Applicant: CelLink Corporation
Inventor： Jean-Paul Ortiz , Malcom Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
CPC classification number: H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
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公开(公告)号：US11950377B1
公开(公告)日：2024-04-02
申请号：US18300828
申请日：2023-04-14
Applicant: CelLink Corporation
Inventor： Jean-Paul Ortiz , Malcom Parker Brown , Casey Anderson , Will Findlay , Gabrielle Tate , Shawn D'Gama , Arturo Cantu-Chavez
CPC classification number: H05K3/46 , H05K1/0201 , H05K1/118 , H05K2201/10037
Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.
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Patent Agency Ranking
公开(公告)号：US11751328B1
公开(公告)日：2023-09-05
申请号：US18172781
申请日：2023-02-22
Applicant: CelLink Corporation
Inventor： Jean-Paul Ortiz , Malcom Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
CPC classification number: H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
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公开(公告)号：US12010792B2
公开(公告)日：2024-06-11
申请号：US18351437
申请日：2023-07-12
Applicant: CelLink Corporation
Inventor： Jean-Paul Ortiz , Malcom Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
CPC classification number: H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
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公开(公告)号：US20240292527A1
公开(公告)日：2024-08-29
申请号：US18656082
申请日：2024-05-06
Applicant: CelLink Corporation
Inventor： Jean-Paul Ortiz , Malcolm Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
CPC classification number: H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
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公开(公告)号：US20240215173A1
公开(公告)日：2024-06-27
申请号：US18595910
申请日：2024-03-05
Applicant: CelLink Corporation
Inventor： Jean-Paul Ortiz , Malcolm Parker Brown , Casey Anderson , Will Findlay , Gabrielle Tate , Shawn D'Gama , Arturo Cantu-Chavez
CPC classification number: H05K3/46 , H05K1/0201 , H05K1/118 , H05K2201/10037
Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.
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公开(公告)号：US20230269870A1
公开(公告)日：2023-08-24
申请号：US18172781
申请日：2023-02-22
Applicant: CelLink Corporation
Inventor： Jean-Paul Ortiz , Malcom Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
CPC classification number: H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
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