公开(公告)号：US20090053942A1

公开(公告)日：2009-02-26

申请号：US12120488

申请日：2008-05-14

Applicant: Chin Chi Lin

Inventor： Chin Chi Lin

IPC: H01R4/02 ,  H01R43/00

CPC classification number: H01R12/57 ,  H01R13/03 ,  H01R43/0256 ,  Y10T29/49117

Abstract: The invention provides a conduction terminal, and the conduction terminal includes a weld part and a solder. The weld part includes an end surface and a side wall adjacent to the end surface. A solder film covers the end surface and the side wall. Compared with prior art, a solder on the weld part of the conduction terminal of the invention forms as a film. Therefore, the conduction terminal of the invention is easily welded on a substrate, and the conduction terminals do not easily have a short circuit and conjoined solders. Additionally, a method for tin-dipping the conduction terminal including the following steps of: providing a fixture having multiple storage troughs, sizes of the storage troughs are the same; disposing equivalent quantity of solder on each of the storage troughs; heating the fixture to melt the solders; inserting the weld parts of the conduction terminals into the corresponding accommodation holes, so as to stick the solder on the conduction terminal, and the solder covers as a solder film on the conduction terminal after cooling.

Abstract translation: 本发明提供一种导电端子，并且导电端子包括焊接部分和焊料。 焊接部分包括端表面和与端表面相邻的侧壁。 焊锡膜覆盖端面和侧壁。 与现有技术相比，本发明的导电端子的焊接部分上的焊料形成为膜。 因此，本发明的导电端子容易焊接在基板上，并且导电端子不容易发生短路和结合的焊料。 另外，一种用于锡浸导电端子的方法，包括以下步骤：提供具有多个储存槽的固定装置，储存槽的尺寸相同; 在每个储存槽处设置等量的焊料; 加热夹具以熔化焊料; 将导电端子的焊接部分插入到相应的容纳孔中，以将焊料粘在导电端子上，并且在冷却之后焊料在导电端子上作为焊料覆盖。

公开(公告)号：US08570745B2

公开(公告)日：2013-10-29

申请号：US13310101

申请日：2011-12-02

Applicant: Ted Ju ,  Chin Chi Lin

Inventor： Ted Ju ,  Chin Chi Lin

IPC: H05K7/20 ,  H05K1/14

CPC classification number: H01L23/36 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/10477 ,  H01L2924/00

Abstract: The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole. The substrate is at least partially located in the through hole. The auxiliary circuit board has a transitional connecting surface. A first conducting region and a second conducting region electrically connected to each other are disposed on the transitional connecting surface. The first conducting region is electrically connected to the substrate, and the second conducting region is electrically connected to the main circuit board.

Abstract translation: 本发明涉及电连接器组件。 电连接器组件包括具有通孔的主电路板，处理器和辅助电路板。 处理器包括芯片和基板。 芯片电连接到基板并位于通孔中。 衬底至少部分地位于通孔中。 辅助电路板具有过渡连接面。 电连接的第一导电区域和第二导电区域设置在过渡连接面上。 第一导电区域电连接到基板，并且第二导电区域电连接到主电路板。

公开(公告)号：US20090029591A1

公开(公告)日：2009-01-29

申请号：US11955551

申请日：2007-12-13

Applicant: Chin Chi Lin

Inventor： Chin Chi Lin

IPC: H01R13/40 ,  H01R43/00

CPC classification number: H01R13/41 ,  Y10T29/53209

Abstract: An electrical connector and its assembly method, in which the electrical connector includes an insulator body and conductive terminals, wherein the insulator body has a first surface and a second surface and a plurality of through slots each including a first and a second terminal receiving slots, each conductive terminal including a first and a second sections respectively received within the first and the second terminal receiving slots, the second section being wider than the first terminal receiving slot, wherein the second section of each terminal and the sidewall of the second terminal receiving slot form a cooperating structure close to the second surface for preventing the withdrawing of the terminal from the through slot. According to the present invention, there is no need to provide several barbs on each terminal for pressed fitting with the insulator body. Thus, the walls of the insulator body will not be damaged.

Abstract translation: 一种电连接器及其组装方法，其中所述电连接器包括绝缘体和导电端子，其中所述绝缘体具有第一表面和第二表面以及多个通孔，每个通孔包括第一和第二端子接收槽， 每个导电端子包括分别容纳在第一和第二端子接收槽内的第一和第二部分，第二部分比第一端子接收槽宽，其中每个端子的第二部分和第二端子接收槽的侧壁 形成靠近第二表面的配合结构，以防止终端从通槽中退出。 根据本发明，不需要在每个端子上设置几个倒钩，用于与绝缘体本体进行压配合。 因此，绝缘体的壁面不会被损坏。

公开(公告)号：US20130077252A1

公开(公告)日：2013-03-28

申请号：US13310101

申请日：2011-12-02

Applicant: Ted Ju ,  Chin Chi Lin

Inventor： Ted Ju ,  Chin Chi Lin

IPC: H05K7/20 ,  H05K1/14

CPC classification number: H01L23/36 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/10477 ,  H01L2924/00

Abstract: The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole. The substrate is at least partially located in the through hole. The auxiliary circuit board has a transitional connecting surface. A first conducting region and a second conducting region electrically connected to each other are disposed on the transitional connecting surface. The first conducting region is electrically connected to the substrate, and the second conducting region is electrically connected to the main circuit board.

Abstract translation: 本发明涉及电连接器组件。 电连接器组件包括具有通孔的主电路板，处理器和辅助电路板。 处理器包括芯片和基板。 芯片电连接到基板并位于通孔中。 衬底至少部分地位于通孔中。 辅助电路板具有过渡连接面。 电连接的第一导电区域和第二导电区域设置在过渡连接面上。 第一导电区域电连接到基板，并且第二导电区域电连接到主电路板。

公开(公告)号：US20080299808A1

公开(公告)日：2008-12-04

申请号：US12025325

申请日：2008-02-04

Applicant: Chin Chi Lin

Inventor： Chin Chi Lin

IPC: H01R3/00 ,  H01R13/40

CPC classification number: H01R12/714 ,  H01R13/24

Abstract: An electronic device electrically connected to an external electronic component is provided. The electronic device comprises first conductors for contacting the external electronic component and a base. The base has holes with second conductors disposed on inner walls thereof and an elastic body having terminal receiving holes for receiving the first conductors. The first and second conductors and the elastic body are disposed at appropriate positions. When the external electronic device presses and contacts the first conductors, the elastic body is forced to deform, and the first conductors are made to move to contact the second conductors. As the elastic body has good elasticity, the first conductors after being compressed can contact the second conductors of the base, and thus soldering is not required, which facilitates the electrical connection to a chip module.

Abstract translation: 提供电连接到外部电子部件的电子设备。 电子设备包括用于接触外部电子部件和基座的第一导体。 基座具有设置在其内壁上的第二导体的孔，弹性体具有用于接收第一导体的端子接收孔。 第一和第二导体和弹性体设置在适当的位置。 当外部电子装置按压并接触第一导体时，弹性体被迫变形，并使第一导体移动以接触第二导体。 由于弹性体具有良好的弹性，被压缩后的第一导体可接触基座的第二导体，因此不需要焊接，这有助于与芯片模块的电连接。