CIRCUIT MODULE AND MANUFACTURING PROCESS THEREOF
    1.
    发明申请
    CIRCUIT MODULE AND MANUFACTURING PROCESS THEREOF 审中-公开
    电路模块及其制造工艺

    公开(公告)号:US20080032523A1

    公开(公告)日:2008-02-07

    申请号:US11563281

    申请日:2006-11-27

    Applicant: Ching-Chi Kuo

    Inventor: Ching-Chi Kuo

    Abstract: A circuit module to be mounted on a system circuit board having first contact portions is provided. The circuit module includes a printed wire board and at least an electronic component mounted on the printed wire board. The printed wire board includes a substrate and a trace pattern formed on at least a surface of the substrate. At least an edge side of the substrate has second contact portions corresponding to the first contact portions of the system circuit board and in contact with the trace pattern.

    Abstract translation: 提供一种要安装在具有第一接触部分的系统电路板上的电路模块。 电路模块包括印刷线路板和安装在印刷线路板上的至少一个电子部件。 印刷线路板包括形成在基板的至少一个表面上的基板和迹线图案。 衬底的至少边缘侧具有对应于系统电路板的第一接触部分并与迹线图案接触的第二接触部分。

    Compositions and process for producing foam plastics
    4.
    发明授权
    Compositions and process for producing foam plastics 失效
    用于生产泡沫塑料的组合物和方法

    公开(公告)号:US4939019A

    公开(公告)日:1990-07-03

    申请号:US436834

    申请日:1989-11-15

    Abstract: Plastic foam materials having a high degree of structural integrity, cell network uniformity and small cell size are obtained from (meth)acrylic acid and (meth)acrylonitrile by incorporating acrylamide as a comonomer additive within certain ranges of concentration. Incorporation of the latter together with conventional additives normally used in preparing foams from the principal monomers helps to avoid preliminary precipitation during the polymerization process, and the gradients in the polymer microstructure which frequently result and cause internal stresses and weaknesses in the ultimate product.

    Abstract translation: 通过在一定浓度范围内加入作为共聚单体添加剂的丙烯酰胺,由(甲基)丙烯酸和(甲基)丙烯腈获得具有高度结构完整性,细胞网络均匀性和小孔尺寸的塑料泡沫材料。 将后者与通常用于制备主要单体泡沫的常规添加剂一起有助于避免在聚合过程中的初步沉淀,以及聚合物微结构中的梯度,其经常导致并导致最终产物的内部应力和弱点。

    Compositions and process for producing foam plastics

    公开(公告)号:US4918110A

    公开(公告)日:1990-04-17

    申请号:US243383

    申请日:1988-09-12

    CPC classification number: C08J9/02 C08J9/06 C08J2333/02

    Abstract: Plastic foam materials having a high degree of structural integrity, cell network uniformity and small cell size are obtained from (meth)acrylic acid and (meth)acrylonitrile by incorporating acrylamide as a comonomer additive within certain ranges of concentration. Incorporation of the latter together with conventional additives normally used in preparing foams from the principal monomers helps to avoid preliminary precipitation during the polymerization process, and the gradients in the polymer microstructure which frequently result and cause internal stresses and weaknesses in the ultimate product.

Patent Agency Ranking