公开(公告)号：US07911059B2

公开(公告)日：2011-03-22

申请号：US11760369

申请日：2007-06-08

Applicant: Ching-Tai Cheng ,  Jui-Kang Yen

Inventor： Ching-Tai Cheng ,  Jui-Kang Yen

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L33/641 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation.

Abstract translation: 提供了一种用于封装半导体管芯以提高导热性并且与常规半导体封装技术相比更简单的制造的方法和装置。 本文描述的封装技术可适用于各种半导体器件，例如发光二极管（LED），中央处理单元（CPU），图形处理单元（GPU），微控制器单元（MCU）和数字信号处理器（DSP） 。 对于一些实施例，封装包括陶瓷衬底，其具有上空腔，其中设置有一个或多个半导体管芯，并且具有沉积有一个或多个金属层的下部空腔，以将散热从半导体管芯散出。 对于其它实施例，封装包括陶瓷衬底，该陶瓷衬底具有上空腔，其中设置有一个或多个半导体管芯，并且具有下表面，其上沉积有一个或多个金属层，用于有效散热。

公开(公告)号：US07852015B1

公开(公告)日：2010-12-14

申请号：US11548604

申请日：2006-10-11

Applicant: Jui-Kang Yen ,  Trung Tri Doan ,  Yung-Wei Chen ,  Ching-Tai Cheng

Inventor： Jui-Kang Yen ,  Trung Tri Doan ,  Yung-Wei Chen ,  Ching-Tai Cheng

IPC: H05B41/16

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A solid state light module incorporating light emitting diodes (LEDs) disposed on a metal substrate, a solid state lighting system employing such modules, and method of replacing LEDs of the light modules are provided. The metal substrate may allow for lower LED junction temperature and, hence, a longer device lifetime. In addition, the metal substrate may allow for the potential omission of a heat sink, which may reduce light module size, when compared to conventional solid state light emitters.

Abstract translation: 提供了一种结合设置在金属基板上的发光二极管（LED）的固态光模块，采用这种模块的固态照明系统，以及替换该光模组的LED的方法。 金属基板可以允许较低的LED结温度，并因此允许更长的器件寿命。 此外，与传统的固态发光体相比，金属基板可以允许潜在的省略散热器，这可能减少光模块尺寸。

公开(公告)号：US20080123023A1

公开(公告)日：2008-05-29

申请号：US11468363

申请日：2006-08-30

Applicant: TRUNG DOAN ,  Wen-Huang Liu ,  Jui-Kang Yen ,  Yung-Wei Chen ,  Ching-Tai Cheng

Inventor： TRUNG DOAN ,  Wen-Huang Liu ,  Jui-Kang Yen ,  Yung-Wei Chen ,  Ching-Tai Cheng

IPC: G02F1/1335 ,  F21V9/16

CPC classification number: G02B6/0068 ,  G02B6/0073 ,  G02F1/133603 ,  G02F2001/133614

Abstract: A white light source using solid state technology, as well as general backlight units and liquid crystal displays (LCDs) that may incorporate such a white light source, are provided. The white light source described herein utilizes a monochrome light-emitting diode (LED) and a wavelength-converting layer having fluorescent materials to produce a substantially uniform broadband optical spectrum visible as white light. Being constructed on a metal substrate, the white light source may also provide for an improved heat transfer path over conventional solid state white light sources.

Abstract translation: 提供了使用固态技术的白光源以及可并入这种白光源的通用背光单元和液晶显示器（LCD）。 本文所述的白光源使用具有荧光材料的单色发光二极管（LED）和波长转换层，以产生可视为白光的基本均匀的宽带光谱。 在金属基板上构造，白光源也可以提供比常规固态白光源更好的传热路径。

公开(公告)号：US20080303157A1

公开(公告)日：2008-12-11

申请号：US11760369

申请日：2007-06-08

Applicant: Ching-Tai Cheng ,  Jui-Kang Yen

Inventor： Ching-Tai Cheng ,  Jui-Kang Yen

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L33/641 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation.

Abstract translation: 提供了一种用于封装半导体管芯以提高导热性并且与常规半导体封装技术相比更简单的制造的方法和装置。 本文描述的封装技术可适用于各种半导体器件，例如发光二极管（LED），中央处理单元（CPU），图形处理单元（GPU），微控制器单元（MCU）和数字信号处理器（DSP） 。 对于一些实施例，封装包括陶瓷衬底，其具有上空腔，其中设置有一个或多个半导体管芯，并且具有沉积有一个或多个金属层的下部空腔，以将散热从半导体管芯散出。 对于其它实施例，封装包括陶瓷衬底，该陶瓷衬底具有上空腔，其中设置有一个或多个半导体管芯，并且具有下表面，其上沉积有一个或多个金属层，用于有效散热。

公开(公告)号：US07728052B2

公开(公告)日：2010-06-01

申请号：US11309896

申请日：2006-10-24

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: C08K3/22

CPC classification number: C09K5/10

Abstract: A thermal interface material (10) includes 100 parts by weight of a silicone oil (11) and 800˜1200 parts by weight of a metal powder (12) mixed into the silicone oil. An outer surface of each metal particle (121) of the metal powder is coated with a metal oxide layer (122). A method of producing the thermal interface material includes steps of: (1) applying a layer of organo coupling agent on the metal powder; (2) heating the metal powder at a temperature between 200 to 300° C. to coat a metal oxide layer on an outer surface of the metal powder; and (3) adding the metal powder with the coated metal oxide layer to a silicone oil. The thermal interface material has an excellent thermal conductivity and an excellent electrical insulating property.

Abstract translation: 热界面材料（10）包括100重量份的硅油（11）和800〜1200重量份的混合到硅油中的金属粉末（12）。 金属粉末的每个金属颗粒（121）的外表面涂覆有金属氧化物层（122）。 一种制备该热界面材料的方法包括以下步骤：（1）在金属粉末上涂一层有机偶联剂; （2）在200〜300℃的温度下加热金属粉末，以在金属粉末的外表面上涂覆金属氧化物层; 和（3）将金属粉末与涂覆的金属氧化物层一起添加到硅油中。 热界面材料具有优异的导热性和优异的电绝缘性能。

公开(公告)号：US20070131913A1

公开(公告)日：2007-06-14

申请号：US11462673

申请日：2006-08-04

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: H01B1/12

CPC classification number: C09K5/14 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/73253

Abstract: A semiconductor device (10) includes a heat source (12), a heat-dissipating component (13) for dissipating heat generated by the heat source, and a thermal interface material (14) filled in a space formed between the heat source and the heat-dissipating component. The thermal interface material includes a mixture of first copper powders having an average particle size of 2 um and second copper powders having an average particle size of 5 um, a silicone oil having a viscosity from 50 to 50,000 cs at 25° C., and at least one oxide powder selected from the group consisting of zinc oxide and alumina powders. The mixture of copper powders is 50% to 90% in weight, the silicone oil is 5% to 15% in weight and the at least one oxide powder is 0% to 35% in weight of the thermal interface material.

Abstract translation: 半导体器件（10）包括热源（12），用于散热由热源产生的热量的散热部件（13），以及填充在形成于热源和热源之间的空间中的热界面材料 散热部件。 热界面材料包括平均粒度为2μm的第一铜粉末和平均粒度为5μm的第二铜粉末，在25℃下具有50至50,000cs粘度的硅油，以及 至少一种选自氧化锌和氧化铝粉末的氧化物粉末。 铜粉的混合物的重量比为50重量％至90重量％，硅油的重量为5重量％至15重量％，至少一种氧化物粉末为热界面材料重量的0至35重量％。

公开(公告)号：US20060162906A1

公开(公告)日：2006-07-27

申请号：US11164093

申请日：2005-11-10

Applicant: Chu-Wan Hong ,  Jung-Yuan Wu ,  Ching-Tai Cheng ,  Chang-Ting Lo

Inventor： Chu-Wan Hong ,  Jung-Yuan Wu ,  Ching-Tai Cheng ,  Chang-Ting Lo

IPC: F28D15/02

CPC classification number: F28D15/046

Abstract: A heat pipe (10) includes a pipe body (20) having an inner wall (22) and a screen mesh (30) disposed on the inner wall of the pipe body. The screen mesh is in the form of a multi-layer structure with at least one layer thereof having an average pore size different from that of the other layers. The layer with large-sized pores is capable of reducing the flow resistance to the condensed fluid to flow back, whereas the layer with small-size pores is capable of providing a relatively large capillary pressure for drawing the condensed fluid from the condensing section to the evaporating section.

Abstract translation: 热管（10）包括具有设置在管体内壁上的内壁（22）和筛网（30）的管体（20）。 筛网是多层结构的形式，其中至少一层具有不同于其它层的平均孔径。 具有大尺寸孔的层能够降低对冷凝流体的流动阻力以流回，而具有小尺寸孔的层能够提供相对较大的毛细管压力，用于将冷凝流体从冷凝部分抽出到 蒸发段。

公开(公告)号：US20060157229A1

公开(公告)日：2006-07-20

申请号：US11292258

申请日：2005-12-01

Applicant: Chu-Wan Hong ,  Ching-Tai Cheng ,  Chang-Ting Lo ,  Jung-Yuan Wu

Inventor： Chu-Wan Hong ,  Ching-Tai Cheng ,  Chang-Ting Lo ,  Jung-Yuan Wu

IPC: F28D15/00

CPC classification number: F28D15/046

Abstract: A heat pipe (10) includes a pipe body (30) filled with working fluid, a screen mesh (50) located in the pipe body, a porous support member (70) supporting the screen mesh to contact with an inner wall (32) of the pipe body.

Abstract translation: 热管（10）包括填充有工作流体的管体（30），位于管体内的筛网（50），支撑筛网以与内壁（32）接触的多孔支撑构件（70） 的管体。

公开(公告)号：US07541403B2

公开(公告)日：2009-06-02

申请号：US11309611

申请日：2006-08-31

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: C08K3/22

CPC classification number: C08L83/08 ,  C08K3/10 ,  C08K3/22 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2982 ,  Y10T428/31663 ,  C08L83/00

Abstract: A thermal interface material includes 100 parts by weight of base oil including amino-modified silicone fluid and at least one of methylphenylsilicone fluid and fluorosilicone fluid, and 800 to 1200 parts by weight of fillers filled in the base oil. The fillers have an average particle size of 0.1 to 5 um and are selected from the group consisting of zinc oxide powder, alumina powder and metallic aluminum powder.

Abstract translation: 热界面材料包括100重量份的基础油，包括氨基改性的硅氧烷流体和甲基苯基硅酮流体和氟硅酮流体中的至少一种，以及填充在基础油中的800至1200重量份的填料。 填料的平均粒径为0.1-5μm，选自氧化锌粉末，氧化铝粉末和金属铝粉末。

公开(公告)号：US07682083B2

公开(公告)日：2010-03-23

申请号：US11245319

申请日：2005-10-06

Applicant: Chu-Wan Hong ,  Ching-Tai Cheng ,  Tze-Yuan Wang

Inventor： Chu-Wan Hong ,  Ching-Tai Cheng ,  Tze-Yuan Wang

IPC: F16C33/24

CPC classification number: F16C33/103

Abstract: A bearing system includes a bearing, a shaft extending in the bearing, and a layer of nano-structured coating coated on one of the bearing and the shaft. A space is formed between the bearing and the shaft, and a lubricant is filled in the space. The lubricant is made of polymer material with hydrophilic and hydropholic properties. The nano-structured coating has a high surface tension which results in the coating being capable of adsorbing the lubricant to form a layer of lubricant film between the coating and the other of the bearing and the shaft, thereby reducing possibility of direct contact between the lubricant and the other of the shaft and the bearing. Thus, loss of the lubricant is reduced to avoid contacting frication between the shaft and the bearing. Accordingly, noise generated by the bearing system is decreased and life of the bearing system is extended.

Abstract translation: 轴承系统包括轴承，在轴承中延伸的轴和涂覆在轴承和轴之一上的纳米结构涂层。 在轴承和轴之间形成空间，并且在该空间中填充润滑剂。 润滑剂由具有亲水和疏水性质的聚合物材料制成。 纳米结构涂层具有高的表面张力，这导致涂层能够吸附润滑剂以在涂层和轴承和轴的另一个之间形成润滑剂膜层，从而减少润滑剂之间的直接接触的可能性 和另一个轴和轴承。 因此，减少润滑剂的损失，以避免在轴和轴承之间接触磨料。 因此，由轴承系统产生的噪声减小，轴承系统的寿命延长。