公开(公告)号：US5241134A

公开(公告)日：1993-08-31

申请号：US908826

申请日：1992-07-01

Applicant: Clarence S. Yoo

Inventor： Clarence S. Yoo

IPC: H01L23/495 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01R43/0235 ,  H01L23/49541 ,  H05K3/3426 ,  H05K3/3442 ,  H05K3/3478 ,  H01L2924/0002 ,  H05K2201/0373 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0113 ,  H05K2203/033 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K3/3489 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179

Abstract: The prior art terminal for making a solder bond between a lead and a bond site is modified so as to enhance the reliability of the solder bond. In one embodiment, this modification entails solder relief terminals: solder relief holes through the terminal, notches, grooves or ridges on the surface of the terminal, or bending of the terminal. In a second embodiment, this modification entails predeposit of a predetermined and controlled amount of solid solder and flux on the terminal.

Abstract translation: 改进了用于在引线和键合部位之间形成焊料接合的现有技术的端子，以提高焊料接合的可靠性。 在一个实施例中，该修改涉及消除焊接端子：通过端子的焊接浮雕孔，端子表面上的凹口，凹槽或脊，或端子的弯曲。 在第二实施例中，该修改需要在端子上预定和控制量的固体焊料和焊剂。