Abstract:
This invention relates to semiconductor devices and to printed circuit boards (PCB) or circuit assemblies used to electrically connect components. Delay devices are associated with the conductive traces or with integrated circuits. Delay is used to offset then realign the wave edges of propagating signals so as to minimize electric field effects on nearby signals. Impedance controlling devices are used to minimize reflections. The effects of split planes may be minimized or negated.
Abstract:
A printed circuit board to electrically couple electrical components has non-conductive layers. Conductive planes are formed on the non-conductive layers. Conductive traces are formed on the non-conductive layer to provide signal paths for the electrical components. Delay devices coupled to the conductive traces to space apart signals so as to minimize electric field effects on nearby signals.
Abstract:
The purpose of the described invention is to provide a means to reduce cross talk (coupled signal distortion) between adjacent signal transmissions, to reduce simultaneous switching noise, and to reduce the need for decoupling capacitance. The method used to obtain these objectives is misaligning the rising or falling edges of adjacent signals.