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公开(公告)号：US20140355211A1
公开(公告)日：2014-12-04
申请号：US14227528
申请日：2014-03-27
Applicant: Control Techniques Limited
CPC classification number: H05K1/0201 , H05K1/0209 , H05K1/0272 , H05K7/20909 , H05K2201/09063 , H05K2201/09145 , H05K2203/081
Abstract: There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.
Abstract translation: 描述了一种电子组件，其包括结构和连接到该结构以形成管道的印刷电路板（PCB）。 PCB具有布置成接收一个或多个发热部件的第一侧和第二侧。 PCB包括形成在其中的一个或多个孔。 电子组件还包括气流发生装置，其布置成沿着管道并沿着PCB的第二侧产生气流，使得空气被迫通过一个或多个孔。 通过在PCB下面形成管道并允许空气被迫通过在PCB中形成的孔，可以实现对PCB上部件的更有效的冷却。 例如，孔的位置可以被调整为使得特定部件或部件的特定部分可能暴露于通过孔的气流。
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公开(公告)号：US09398682B2
公开(公告)日：2016-07-19
申请号：US14227528
申请日：2014-03-27
Applicant: Control Techniques Limited
CPC classification number: H05K1/0201 , H05K1/0209 , H05K1/0272 , H05K7/20909 , H05K2201/09063 , H05K2201/09145 , H05K2203/081
Abstract: There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.
Abstract translation: 描述了一种电子组件，其包括结构和连接到该结构以形成管道的印刷电路板（PCB）。 PCB具有布置成接收一个或多个发热部件的第一侧和第二侧。 PCB包括形成在其中的一个或多个孔。 电子组件还包括气流发生装置，其布置成沿着管道并沿着PCB的第二侧产生气流，使得空气被迫通过一个或多个孔。 通过在PCB下面形成管道并允许空气被迫通过在PCB中形成的孔，可以实现对PCB上部件的更有效的冷却。 例如，孔的位置可以被调整为使得特定部件或部件的特定部分可能暴露于通过孔的气流。
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