公开(公告)号：US20210003534A1

公开(公告)日：2021-01-07

申请号：US15733459

申请日：2019-02-04

Applicant: Cornell University

Inventor： Amit LAL ,  Mamdouh ABDELMEJEED ,  Justin KUO

IPC: G01N29/07 ,  G01N29/24 ,  G01K11/22 ,  G01N33/24 ,  H05B1/02 ,  G10K11/28

Abstract: Disclosed are devices, systems and methods for touch, force and/or thermal sensing by an ultrasonic transceiver chip. In some aspects, an ultrasonic transceiver sensor device includes a semiconductor substrate; a CMOS layer attached to the substrate; an array of piezoelectric transducers coupled to the CMOS layer to generate ultrasonic pulses; and a contact layer attached to the substrate on a side opposite the substrate for providing a surface for contact with an object, where an ultrasonic pulse generated by a piezoelectric transducer propagates through the substrate and the contact layer, such that when the object is in contact with the surface of the contact layer, a reflected ultrasonic pulse is produced and propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers, and the CMOS layer receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses.

公开(公告)号：US20230417708A1

公开(公告)日：2023-12-28

申请号：US17933988

申请日：2022-09-21

Applicant: Cornell University

Inventor： Amit LAL ,  Mamdouh ABDELMEJEED ,  Justin KUO

IPC: G01N29/07 ,  G01K11/22 ,  G01N29/24 ,  G01N33/24 ,  G10K11/28 ,  H05B1/02

CPC classification number: G01N29/07 ,  G01K11/22 ,  G01N29/2437 ,  G01N33/24 ,  G10K11/28 ,  G01N2291/106 ,  G01N2291/011 ,  G01N2291/0231 ,  G01N2291/02881 ,  G01N2291/044 ,  H05B1/023

Abstract: Disclosed are devices, systems and methods for touch, force and/or thermal sensing by an ultrasonic transceiver chip. In some aspects, an ultrasonic transceiver sensor device includes a semiconductor substrate; a CMOS layer attached to the substrate; an array of piezoelectric transducers coupled to the CMOS layer to generate ultrasonic pulses; and a contact layer attached to the substrate on a side opposite the substrate for providing a surface for contact with an object, where an ultrasonic pulse generated by a piezoelectric transducer propagates through the substrate and the contact layer, such that when the object is in contact with the surface of the contact layer, a reflected ultrasonic pulse is produced and propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers, and the CMOS layer receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses.

公开(公告)号：US20210101148A1

公开(公告)日：2021-04-08

申请号：US17065459

申请日：2020-10-07

Applicant: Cornell University

Inventor： Amit LAL ,  Adarsh RAVI ,  Alexander RUYACK ,  Justin KUO

IPC: B01L3/00 ,  F04B17/00

Abstract: In one aspect a high frequency ultrasonic microfluidic flow control device is disclosed. The device includes an array of ultrasonic transducers arranged to direct ultrasound to a microfluidic channel. The device further includes one or more driver circuits. Each ultrasonic transducer is associated with one of the one or more driver circuits, and each ultrasonic transducer is driven by a driver signal from the associated driver circuit. The array of ultrasonic transducers and one or more driver circuits are produced in the same semiconductor fabrication process. The device further includes one or more electrical contacts associated with each ultrasonic transducer in the array if ultrasonic transducers, wherein the one or more electrical contacts associated with each ultrasonic transducer applies the driver signal from the associated ultrasonic driver circuit.