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公开(公告)号:US20230054128A1
公开(公告)日:2023-02-23
申请号:US17821789
申请日:2022-08-23
Applicant: Cornell University
Inventor: Amit LAL , Shubham JADHAV , Ved GUND , Benyamin DAVAJI , Grace XING , Debdeep JENA
IPC: G11C23/00
Abstract: Disclosed are ferroelectric devices including devices for performing a multiplication of analog input signals and resonators. In one aspect, a ferroelectric nanoelectromechanical device includes a first structural beam, a first input electrode disposed on a first top portion of the first structural beam, and an output electrode. The apparatus further includes a first ferroelectric film disposed on a second top portion of the first input electrode, and a first resistive layer disposed on a third top portion of the first ferroelectric film, wherein a first electrode is positioned at a first end of the first resistive layer and a second electrode is positioned at a second end of the first resistive layer.
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公开(公告)号:US20210255032A1
公开(公告)日:2021-08-19
申请号:US17057868
申请日:2019-05-23
Applicant: CORNELL UNIVERSITY
Inventor: Amit LAL
IPC: G01H11/08 , G06F17/14 , H01L41/083 , H01L41/18 , G01N29/46
Abstract: A device configured for low-energy ultrasonic 2D Fourier transform analysis, comprising: (i) a first layer comprising an array of piezoelectric pixels; (ii) a second layer comprising an array of piezoelectric pixels; (iii) a third layer, positioned between the first and second layers, comprising a bulk ultrasonic transmission medium; wherein the second layer of array of piezoelectric pixels is in the Fourier plane of an input signal of the first layer array of piezoelectric pixels.
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公开(公告)号:US20230417708A1
公开(公告)日:2023-12-28
申请号:US17933988
申请日:2022-09-21
Applicant: Cornell University
Inventor: Amit LAL , Mamdouh ABDELMEJEED , Justin KUO
CPC classification number: G01N29/07 , G01K11/22 , G01N29/2437 , G01N33/24 , G10K11/28 , G01N2291/106 , G01N2291/011 , G01N2291/0231 , G01N2291/02881 , G01N2291/044 , H05B1/023
Abstract: Disclosed are devices, systems and methods for touch, force and/or thermal sensing by an ultrasonic transceiver chip. In some aspects, an ultrasonic transceiver sensor device includes a semiconductor substrate; a CMOS layer attached to the substrate; an array of piezoelectric transducers coupled to the CMOS layer to generate ultrasonic pulses; and a contact layer attached to the substrate on a side opposite the substrate for providing a surface for contact with an object, where an ultrasonic pulse generated by a piezoelectric transducer propagates through the substrate and the contact layer, such that when the object is in contact with the surface of the contact layer, a reflected ultrasonic pulse is produced and propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers, and the CMOS layer receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses.
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公开(公告)号:US20210101148A1
公开(公告)日:2021-04-08
申请号:US17065459
申请日:2020-10-07
Applicant: Cornell University
Inventor: Amit LAL , Adarsh RAVI , Alexander RUYACK , Justin KUO
Abstract: In one aspect a high frequency ultrasonic microfluidic flow control device is disclosed. The device includes an array of ultrasonic transducers arranged to direct ultrasound to a microfluidic channel. The device further includes one or more driver circuits. Each ultrasonic transducer is associated with one of the one or more driver circuits, and each ultrasonic transducer is driven by a driver signal from the associated driver circuit. The array of ultrasonic transducers and one or more driver circuits are produced in the same semiconductor fabrication process. The device further includes one or more electrical contacts associated with each ultrasonic transducer in the array if ultrasonic transducers, wherein the one or more electrical contacts associated with each ultrasonic transducer applies the driver signal from the associated ultrasonic driver circuit.
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公开(公告)号:US20210003534A1
公开(公告)日:2021-01-07
申请号:US15733459
申请日:2019-02-04
Applicant: Cornell University
Inventor: Amit LAL , Mamdouh ABDELMEJEED , Justin KUO
Abstract: Disclosed are devices, systems and methods for touch, force and/or thermal sensing by an ultrasonic transceiver chip. In some aspects, an ultrasonic transceiver sensor device includes a semiconductor substrate; a CMOS layer attached to the substrate; an array of piezoelectric transducers coupled to the CMOS layer to generate ultrasonic pulses; and a contact layer attached to the substrate on a side opposite the substrate for providing a surface for contact with an object, where an ultrasonic pulse generated by a piezoelectric transducer propagates through the substrate and the contact layer, such that when the object is in contact with the surface of the contact layer, a reflected ultrasonic pulse is produced and propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers, and the CMOS layer receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses.
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公开(公告)号:US20170169899A1
公开(公告)日:2017-06-15
申请号:US15116441
申请日:2015-02-03
Applicant: Cornell University
Inventor: Amit LAL , Justin C. KUO
CPC classification number: G11C21/023 , B06B1/0215 , B06B2201/20 , B06B2201/55 , B06B2201/70 , G11C7/16 , G11C19/00 , G11C2013/0095
Abstract: Delay line memory device, systems and methods are disclosed. In one aspect, a delay line memory device includes a substrate; an electronic unit disposed on the substrate and operable to receive, amplify, and/or synchronize data signals into a bit stream to be transmitted as acoustic pulses carrying data stored in the delay line memory device; a first and a second piezoelectric transducer disposed on the substrate and in communication with the electronic unit, in which the first piezoelectric transducer is operable to transmit the data signals to the acoustic pulses that carry the data through the bulk of the substrate, and the second piezoelectric transducer is operable to transduce the received acoustic pulses to intermediate electrical signals containing the data, which are transferred to the electronic unit via an electrical interconnect to cause refresh of the data in the delay line memory device.
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