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公开(公告)号：US10716213B2
公开(公告)日：2020-07-14
申请号：US16048267
申请日：2018-07-28
Applicant: Cray Inc.
Inventor： Hyunjun Kim , Andy Becker , Jim Fitzke , Brad Smith , Paul Wildes
Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.
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公开(公告)号：US20200037448A1
公开(公告)日：2020-01-30
申请号：US16048267
申请日：2018-07-28
Applicant: Cray Inc.
Inventor： Hyunjun Kim , Andy Becker , Jim Fitzke , Brad Smith , Paul Wildes
Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.
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