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    ASYMMETRIC DIFFERENTIAL VIA STUBS FOR SKEW COMPENSATION
    1.
    发明申请
    ASYMMETRIC DIFFERENTIAL VIA STUBS FOR SKEW COMPENSATION 有权

    公开(公告)号：US20210274648A1

    公开(公告)日：2021-09-02

    申请号：US16805517

    申请日：2020-02-28

    Applicant: Cray Inc.

    Inventor： Hyunjun Kim ,  Andrew J. Becker ,  Paul T. Wildes

    IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

    Abstract: One embodiment can provide a method and system for compensating for timing skew in a differential pair transmission line on a printed circuit board (PCB). During operation, the system obtains a PCB comprising one or more layers and at least a differential pair transmission line. The differential pair transmission line comprises first and second transmission lines, with a respective transmission line coupled to at least one via extending through the one or more layers of the PCB. The system determines a difference in length between first and second transmission lines and determines a stub length of the at least one via based on the determined difference in length between the first and second transmission lines, thereby compensating for the time skew in the differential pair transmission line.

    Direct connection of high speed signals on PCB chip
    2.
    发明授权
    Direct connection of high speed signals on PCB chip 有权

    公开(公告)号：US10716213B2

    公开(公告)日：2020-07-14

    申请号：US16048267

    申请日：2018-07-28

    Applicant: Cray Inc.

    Inventor： Hyunjun Kim ,  Andy Becker ,  Jim Fitzke ,  Brad Smith ,  Paul Wildes

    IPC: H05K1/18 ,  H05K1/11 ,  H01B11/18 ,  H01R12/71

    Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.

    SKEW COMPENSATION APPARATUS FOR CONTROLLING TRANSMISSION LINE IMPEDANCE
    4.
    发明申请
    SKEW COMPENSATION APPARATUS FOR CONTROLLING TRANSMISSION LINE IMPEDANCE 审中-公开

    公开(公告)号：US20200375025A1

    公开(公告)日：2020-11-26

    申请号：US16880944

    申请日：2020-05-21

    Applicant: Cray Inc.

    Inventor： Hyunjun Kim ,  Andrew J. Becker ,  Paul Taylor Wildes ,  Gregory E. Scott

    IPC: H05K1/02 ,  H01P3/08

    Abstract: One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.

    PCB with minimized crosstalk
    5.
    发明授权
    PCB with minimized crosstalk 有权

    公开(公告)号：US10595394B1

    公开(公告)日：2020-03-17

    申请号：US16407721

    申请日：2019-05-09

    Applicant: Cray Inc.

    Inventor： Hyunjun Kim ,  Paul Wildes ,  Andy Becker ,  Shawn Utz

    IPC: H05K1/02 ,  H05K1/11

    Abstract: A printed circuit board includes additional stitching vias placed at strategic location within a connection matrix, which provides additional isolation and further accommodates high-speed communication capabilities. The stitching vias have a variable length or depth, depending on related structures within the circuit board, so as to avoid any interference with underlining escape routing, or alternative signal transmission structures. More specifically, these stitching vias help to eliminate cross-talk in the via field caused by the close proximity of signal carrying structures. Further, differential signal communication is better accommodated based upon this reduction in cross-talk.

    Method for impedance compensation in printed circuit boards
    6.
    发明授权
    Method for impedance compensation in printed circuit boards 有权

    公开(公告)号：US10154581B2

    公开(公告)日：2018-12-11

    申请号：US15428865

    申请日：2017-02-09

    Applicant: Cray Inc.

    Inventor： Andy Becker ,  Hyunjun Kim ,  Shawn Utz ,  Paul Wildes

    IPC: G06F17/50 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/00 ,  H05K3/42

    Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.

    Method for cross-talk reduction technique with fine pitch vias
    7.
    发明授权
    Method for cross-talk reduction technique with fine pitch vias 有权

    公开(公告)号：US10966311B2

    公开(公告)日：2021-03-30

    申请号：US16882146

    申请日：2020-05-22

    Applicant: CRAY INC.

    Inventor： Hyunjun Kim ,  Andrew J. Becker ,  Paul Taylor Wildes

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K1/18 ,  H05K1/14 ,  H05K3/42

    Abstract: Systems and methods are provided for reducing crosstalk between differential signals in a printed circuit board (PCB) using fine pitch vias. A pair of contact pads are on the top surface of the PCB and configured to couple a PCB component to the PCB, the contacts a first distance from each other. A first via of a plurality of vias is electrically coupled to a first contact of the pair of contacts and a second via is electrically coupled to a second contact, the first via and second via a second distance from each other, the second distance being less than current standards for minimum via pitch. Each via comprises a via pad on the top surface and a plated through-hole extending from the top surface to a termination point. A separator gap is between the first via and the second via.

    DIRECT CONNECTION OF HIGH SPEED SIGNALS ON PCB CHIP
    8.
    发明申请
    DIRECT CONNECTION OF HIGH SPEED SIGNALS ON PCB CHIP 审中-公开

    公开(公告)号：US20200037448A1

    公开(公告)日：2020-01-30

    申请号：US16048267

    申请日：2018-07-28

    Applicant: Cray Inc.

    Inventor： Hyunjun Kim ,  Andy Becker ,  Jim Fitzke ,  Brad Smith ,  Paul Wildes

    IPC: H05K1/18 ,  H05K1/11 ,  H01B11/18 ,  H01R12/71

    Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.

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