公开(公告)号：US10716213B2

公开(公告)日：2020-07-14

申请号：US16048267

申请日：2018-07-28

Applicant: Cray Inc.

Inventor： Hyunjun Kim ,  Andy Becker ,  Jim Fitzke ,  Brad Smith ,  Paul Wildes

IPC: H05K1/18 ,  H05K1/11 ,  H01B11/18 ,  H01R12/71

Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.

公开(公告)号：US20180228019A1

公开(公告)日：2018-08-09

申请号：US15428865

申请日：2017-02-09

Applicant: Cray Inc.

Inventor： Andy Becker ,  Hyunjun Kim ,  Shawn Utz ,  Paul Wildes

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/00 ,  G06F17/50

CPC classification number: H05K1/0251 ,  G06F17/5009 ,  G06F17/5072 ,  G06F17/5081 ,  H05K1/024 ,  H05K1/112 ,  H05K1/113 ,  H05K1/116 ,  H05K3/0005 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/09454 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09781

Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.

公开(公告)号：US20200037448A1

公开(公告)日：2020-01-30

申请号：US16048267

申请日：2018-07-28

Applicant: Cray Inc.

Inventor： Hyunjun Kim ,  Andy Becker ,  Jim Fitzke ,  Brad Smith ,  Paul Wildes

IPC: H05K1/18 ,  H05K1/11 ,  H01B11/18 ,  H01R12/71

Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.

公开(公告)号：US10595394B1

公开(公告)日：2020-03-17

申请号：US16407721

申请日：2019-05-09

Applicant: Cray Inc.

Inventor： Hyunjun Kim ,  Paul Wildes ,  Andy Becker ,  Shawn Utz

IPC: H05K1/02 ,  H05K1/11

Abstract: A printed circuit board includes additional stitching vias placed at strategic location within a connection matrix, which provides additional isolation and further accommodates high-speed communication capabilities. The stitching vias have a variable length or depth, depending on related structures within the circuit board, so as to avoid any interference with underlining escape routing, or alternative signal transmission structures. More specifically, these stitching vias help to eliminate cross-talk in the via field caused by the close proximity of signal carrying structures. Further, differential signal communication is better accommodated based upon this reduction in cross-talk.

公开(公告)号：US10154581B2

公开(公告)日：2018-12-11

申请号：US15428865

申请日：2017-02-09

Applicant: Cray Inc.

Inventor： Andy Becker ,  Hyunjun Kim ,  Shawn Utz ,  Paul Wildes

IPC: G06F17/50 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/00 ,  H05K3/42

Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.