公开(公告)号：US20180228019A1

公开(公告)日：2018-08-09

申请号：US15428865

申请日：2017-02-09

Applicant: Cray Inc.

Inventor： Andy Becker ,  Hyunjun Kim ,  Shawn Utz ,  Paul Wildes

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/00 ,  G06F17/50

CPC classification number: H05K1/0251 ,  G06F17/5009 ,  G06F17/5072 ,  G06F17/5081 ,  H05K1/024 ,  H05K1/112 ,  H05K1/113 ,  H05K1/116 ,  H05K3/0005 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/09454 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09781

Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.

公开(公告)号：US10595394B1

公开(公告)日：2020-03-17

申请号：US16407721

申请日：2019-05-09

Applicant: Cray Inc.

Inventor： Hyunjun Kim ,  Paul Wildes ,  Andy Becker ,  Shawn Utz

IPC: H05K1/02 ,  H05K1/11

Abstract: A printed circuit board includes additional stitching vias placed at strategic location within a connection matrix, which provides additional isolation and further accommodates high-speed communication capabilities. The stitching vias have a variable length or depth, depending on related structures within the circuit board, so as to avoid any interference with underlining escape routing, or alternative signal transmission structures. More specifically, these stitching vias help to eliminate cross-talk in the via field caused by the close proximity of signal carrying structures. Further, differential signal communication is better accommodated based upon this reduction in cross-talk.

公开(公告)号：US10154581B2

公开(公告)日：2018-12-11

申请号：US15428865

申请日：2017-02-09

Applicant: Cray Inc.

Inventor： Andy Becker ,  Hyunjun Kim ,  Shawn Utz ,  Paul Wildes

IPC: G06F17/50 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/00 ,  H05K3/42

Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.