公开(公告)号：US11744011B2

公开(公告)日：2023-08-29

申请号：US17290304

申请日：2019-10-31

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kenichi Ogawa ,  Naoko Okimoto ,  Mitsutaka Nagae ,  Makiko Sakata ,  Toru Miyoshi

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/12

CPC classification number: H05K1/0283 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/0064 ,  H05K3/1208 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/2009

Abstract: A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.

公开(公告)号：US20150036208A1

公开(公告)日：2015-02-05

申请号：US14384895

申请日：2013-03-14

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Masanori Umeya ,  Nanae Tagaya ,  Toru Miyoshi

IPC: G02F1/167 ,  B32B37/14 ,  G02F1/1333

CPC classification number: G02F1/167 ,  B32B37/14 ,  G02F1/1333 ,  G02F1/133308 ,  G02F1/1681 ,  G02F2202/28

Abstract: The present invention is an electrophoretic display device including a display medium containing electrophoretic elements of at least one or more kind(s), which is enclosed between opposed two substrates at least one of which is transparent, the display medium being configured to display predetermined information when a predetermined electric field is applied between the two substrates, wherein: a partition wall is formed in a predetermined pattern on one substrate; the display medium is located in each of cells which are areas divided by the partition wall; and the other substrate is adhered partially to a top surface of the partition wall, so that a not-adhered portion remains.

Abstract translation: 本发明是一种电泳显示装置，包括：包含至少一种以上种类的电泳元件的显示介质，其被封闭在相对的两个基板之间，其中至少一个基板是透明的，所述显示介质被配置为显示预定信息 当在两个基板之间施加预定电场时，其中：在一个基板上以预定图案形成分隔壁; 显示介质位于由分隔壁分割的区域的每个单元中; 并且另一个基板部分地粘附到分隔壁的顶表面，使得不粘附部分保留。

公开(公告)号：US12144108B2

公开(公告)日：2024-11-12

申请号：US17290633

申请日：2019-10-31

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Naoko Okimoto ,  Kenichi Ogawa ,  Mitsutaka Nagae ,  Makiko Sakata ,  Toru Miyoshi

IPC: H05K1/02 ,  H05K3/10

Abstract: A wiring board includes a substrate, wiring, and a reinforcing part. The substrate is stretchable, and includes a first surface and a second surface located opposite to the first surface. The wiring is located at the first surface side of the substrate. The reinforcing part overlaps the wiring when viewed in a direction normal to the first surface of the substrate. The substrate has a control region and a non-control region. The control region overlaps the reinforcing part. The non-control region does not overlap the reinforcing part. The non-control region is positioned to sandwich the control region in a direction orthogonal to the direction in which the wiring extends.

公开(公告)号：US11653444B2

公开(公告)日：2023-05-16

申请号：US17439326

申请日：2020-03-19

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Naoko Okimoto ,  Mitsutaka Nagae ,  Kenichi Ogawa ,  Makiko Sakata ,  Toru Miyoshi

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0283 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0162

Abstract: A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.