公开(公告)号：US11973002B2

公开(公告)日：2024-04-30

申请号：US17777549

申请日：2020-11-12

Applicant: Denka Company Limited

Inventor： Atsushi Sakai ,  Masaya Yumiba ,  Kentaro Nakayama ,  Yoshitaka Taniguchi

IPC: H01L23/373 ,  C23C4/073 ,  C23C4/08 ,  C23C4/18 ,  C23C28/00 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/3735 ,  C23C4/073 ,  C23C4/08 ,  C23C4/18 ,  C23C28/321 ,  H01L21/4857 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/32227

Abstract: A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

公开(公告)号：US11570901B2

公开(公告)日：2023-01-31

申请号：US16488776

申请日：2018-02-22

Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE ,  DENKA COMPANY LIMITED

Inventor： Seiji Kuroda ,  Hiroshi Araki ,  Akira Hasegawa ,  Makoto Watanabe ,  Atsushi Sakai ,  Yoshitaka Taniguchi ,  Suzuya Yamada

IPC: H05K3/14 ,  C22C21/06 ,  H05K1/03

Abstract: A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.

公开(公告)号：US11160172B2

公开(公告)日：2021-10-26

申请号：US16477628

申请日：2018-01-16

Applicant: DENKA COMPANY LIMITED

Inventor： Atsushi Sakai ,  Yoshitaka Taniguchi ,  Suzuya Yamada

IPC: C23C24/04 ,  H05K3/14

Abstract: A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate. The disclosed method includes a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of a ceramic substrate from a nozzle, in which the first metal powder is heated to from 10° C. to 270° C. and then ejected from the nozzle 10 and a gauge pressure of the inert gas at an inlet of the nozzle 10 is from 1.5 to 5.0 MPa, a step of subjecting the first metal layer to a heat treatment in an inert gas atmosphere, and the like.

公开(公告)号：US11094648B2

公开(公告)日：2021-08-17

申请号：US16636184

申请日：2018-07-30

Applicant: DENKA COMPANY LIMITED

Inventor： Hideki Hirotsuru ,  Yoshitaka Taniguchi ,  Kohki Ichikawa ,  Atsushi Sakai

IPC: H01L23/00 ,  H01L23/15 ,  H01L25/07

Abstract: A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient α1 (×10−6/K) of the base plate and a linear thermal expansion coefficient α2 (×10−6/K) of the ceramic insulating substrate when a temperature decreases in the range of 25° C. to 150° C. satisfy the following Expression (1).  α ⁢ ⁢ 1 - α ⁢ ⁢ 2  ( α ⁢ ⁢ 1 + α ⁢ ⁢ 2 ) ⁢ / ⁢ 2 × 100 ≤ 10 ( 1 )

公开(公告)号：US11096278B2

公开(公告)日：2021-08-17

申请号：US16636239

申请日：2018-07-30

Applicant: DENKA COMPANY LIMITED

Inventor： Atsushi Sakai ,  Hideki Hirotsuru ,  Kohki Ichikawa ,  Yoshitaka Taniguchi

IPC: H05K1/03 ,  H05K1/05

Abstract: A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value α1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10−6 to 9×10−6/K, a ratio α1/α2 of the α1 to a theoretical value α2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.