公开(公告)号：US09686854B2

公开(公告)日：2017-06-20

申请号：US14427458

申请日：2013-09-24

Applicant: DENSO CORPORATION

Inventor： Yuuki Sanada ,  Norihisa Imaizumi ,  Shinya Uchibori ,  Masaji Imada ,  Toshihiro Nakamura ,  Eiji Yabuta ,  Masayuki Takenaka

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H01L23/13 ,  H05K7/20 ,  H01L23/367 ,  H01L23/373

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K1/182 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/09781 ,  H05K2201/10166 ,  H01L2924/00

Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.