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公开(公告)号：US20220418171A1
公开(公告)日：2022-12-29
申请号：US17898024
申请日：2022-08-29
Applicant: DENSO CORPORATION
Inventor： Kazuma FUKUSHIMA , Tomohisa SANO
Abstract: Disclosed is a cooling system for cooling an electric drive system. The electric drive system includes a motor and an inverter configured to drive the motor. The cooling system includes a first cooler, a second cooler, a circulating flow passage and a pump. The first cooler is configured to cool the motor by heat exchange using a coolant flowing through the first cooler. The second cooler is configured to cool the inverter by heat exchange using the coolant flowing through the second cooler. The circulating flow passage passes through both the first and second coolers, and the coolant circulates in the circulating flow passage. The pump is arranged in the circulating flow passage to pump the coolant.
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公开(公告)号：US20200036297A1
公开(公告)日：2020-01-30
申请号：US16526762
申请日：2019-07-30
Applicant: DENSO CORPORATION
Inventor： Yuu YAMAHIRA , Tetsuya MATSUOKA , Kazuma FUKUSHIMA , Akifumi ARARAGI , Noriyuki KAKIMOTO , Masakiyo SUMITOMO
Abstract: In a power converter, a control circuit has a speed adjustment resistor that limits a control current to adjust a switching speed of each of first and second switching elements. The speed adjustment resistor has a resistance that varies depending on a voltage at the control electrode of each of the first and second switching elements. A feedback route connects between the control electrode of the first switching element and the control electrode of the second switching element. The feedback route has a resistance that is set to be lower than a value of the resistance of the speed adjustment resistor during a predetermined Miller period of each of the first and second switching elements.
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公开(公告)号：US20170302153A1
公开(公告)日：2017-10-19
申请号：US15491366
申请日：2017-04-19
Applicant: DENSO CORPORATION
Inventor： Kengo MOCHIKI , Mitsunori KIMURA , Hiroshi SHIMIZU , Yasuyuki OHKOUCHI , Yuu YAMAHIRA , Tetsuya MATSUOKA , Kazuma FUKUSHIMA
CPC classification number: H02M1/088 , B60L3/003 , B60L3/0084 , B60L15/007 , H01L27/0623 , H01L2224/05554 , H01L2224/48247 , H02M1/08 , H02M3/158 , H02M7/003 , H02M7/537 , H02M7/53871 , H02M2001/0054 , H02P27/06 , H03K17/0412 , H03K17/08116 , H03K17/127 , H03K17/6871 , H03K2217/0036
Abstract: A power conversion apparatus includes a semiconductor module including a semiconductor device and a control circuit unit controlling the semiconductor module. The semiconductor module has main and subsidiary semiconductor devices connected in parallel. The control circuit unit performs control such that the subsidiary semiconductor device is turned on after the main semiconductor device is turned on, and the main semiconductor device is turned off after the subsidiary semiconductor device is turned off. The control circuit unit performs control such that, one of the turn-on and turn-off switching timings has a switching speed faster than that of the other of the switching timings. The semiconductor module is configured such that, at a high-speed switching timing, an induction current directed to turn off the subsidiary semiconductor device is generated in a control terminal of the subsidiary semiconductor device depending on temporal change of a main current flowing to the main semiconductor device.
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公开(公告)号：US20250038673A1
公开(公告)日：2025-01-30
申请号：US18911330
申请日：2024-10-10
Applicant: DENSO CORPORATION
Inventor： Kazuma FUKUSHIMA , Hiroshi TAKI
Abstract: An inverter device includes an inverter outer peripheral wall, a high voltage board, a control board, and an arm switch unit. The inverter outer peripheral wall has an inner peripheral surface. The high voltage board and the control board extend in a direction orthogonal to an axial direction. In the high voltage board and the control board, an outer peripheral end extends in a ring shape in a circumferential direction along the inner peripheral surface. In the arm switch unit, a drain terminal and a source terminal are connected to the high voltage board, and a gate terminal and a driver source terminal are connected to the control board. Multiple arm switch units are arranged in the circumferential direction along the outer peripheral end.
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公开(公告)号：US20200176435A1
公开(公告)日：2020-06-04
申请号：US16785913
申请日：2020-02-10
Applicant: DENSO CORPORATION
Inventor： Kazuma FUKUSHIMA , Yuu YAMAHIRA , Ryota TANABE , Tetsuya MATSUOKA , Kosuke KAMIYA , Taijiro MOMOSE
Abstract: A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring. The power conversion device includes a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel, a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel, and a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series.
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Patent Agency Ranking
公开(公告)号：US20190123657A1
公开(公告)日：2019-04-25
申请号：US16090145
申请日：2017-03-10
Applicant: DENSO CORPORATION
Inventor： Tomoya MIURA , Yuu YAMAHIRA , Kazuma FUKUSHIMA
IPC: H02M7/00 , H02M1/088 , H02M7/5387 , H02P27/06
CPC classification number: H02M7/003 , H01L23/46 , H02M1/088 , H02M7/5387 , H02P27/06
Abstract: A plurality of semiconductor elements and a control circuit unit are provided. The plurality of semiconductor elements which are connected in parallel are configured to perform switching at the same time. The control circuit unit includes a drive circuit connected to the plurality of semiconductor elements which perform operation at the same time, control wirings and reference wirings. The control wirings connect control electrodes of the semiconductor elements to the drive circuit. The reference wirings connect reference electrodes of the semiconductor elements to the drive circuit. A parasitic inductance in the reference wiring is made smaller than a parasitic inductance in the control wiring.
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公开(公告)号：US20200321319A1
公开(公告)日：2020-10-08
申请号：US16904088
申请日：2020-06-17
Applicant: DENSO CORPORATION
Inventor： Tetsuya MATSUOKA , Yuu YAMAHIRA , Kazuma FUKUSHIMA , Noriyuki KAKIMOTO
IPC: H01L25/07 , H01L25/18 , H02M7/48 , H01L29/739
Abstract: A power converter includes: at least one pair of first and second semiconductor devices including multiple first and second semiconductor chips, having first and second switching elements providing upper and lower arms, and multiple first and second main terminals having at least one of multiple first and second high potential terminals and multiple first and second low potential terminals; and a bridging member providing an upper and lower coupling portion, together with the first low and second high potential terminals. The first and second semiconductor chips are arranged in line symmetry with respect to first and second axes and in line symmetry with the second axis as a symmetry axis to differentiate the arrangement of the second low potential terminal with respect to the second high potential terminal from the arrangement of the first low potential terminal with respect to the first high potential terminal.
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公开(公告)号：US20200177093A1
公开(公告)日：2020-06-04
申请号：US16782158
申请日：2020-02-05
Applicant: DENSO CORPORATION
Inventor： Tetsuya MATSUOKA , Ryota TANABE , Yuu YAMAHIRA , Kazuma FUKUSHIMA , Kosuke KAMIYA
IPC: H02M7/00 , H01L25/18 , H02M7/5387 , H01L23/473
Abstract: A power conversion apparatus has a positive electrode bus bar and a negative electrode bus bar. The power conversion apparatus has a first semiconductor module incorporating an upper-arm switching element and including a positive electrode terminal and a second semiconductor module incorporating a lower-arm switching element and including a negative electrode terminal. The first semiconductor module and the second semiconductor module are placed such that the positive electrode terminal and the negative electrode terminal face each other in a direction orthogonal to a protruding direction. The positive electrode bus bar and the negative electrode bus bar respectively have coexisting parts placed together between the positive electrode terminal and the negative electrode terminal as seen in the protruding direction of power terminals. The coexisting parts are at least partially placed in a space between the positive electrode terminal and the negative electrode terminal.
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公开(公告)号：US20180331617A1
公开(公告)日：2018-11-15
申请号：US16046278
申请日：2018-07-26
Applicant: DENSO CORPORATION
Inventor： Kengo MOCHIKI , Mitsunori KIMURA , Hiroshi SHIMIZU , Yasuyuki OHKOUCHI , Yuu YAMAHIRA , Tetsuya MATSUOKA , Kazuma FUKUSHIMA
IPC: H02M1/088 , H03K17/0412 , H02M3/158 , H02M7/537 , H03K17/687 , H03K17/081 , H01L27/06 , H03K17/12 , H02P27/06
CPC classification number: H02M1/088 , B60L3/003 , B60L3/0084 , B60L15/007 , H01L27/0623 , H01L2224/05554 , H01L2224/48247 , H02M1/08 , H02M3/158 , H02M7/003 , H02M7/537 , H02M7/53871 , H02M2001/0054 , H02P27/06 , H02P27/08 , H03K17/0412 , H03K17/08116 , H03K17/127 , H03K17/6871 , H03K2217/0036 , Y02T10/644 , Y02T10/645
Abstract: A power conversion apparatus includes a semiconductor module including a semiconductor device and a control circuit unit controlling the semiconductor module. The semiconductor module has main and subsidiary semiconductor devices connected in parallel. The control circuit unit performs control such that the subsidiary semiconductor device is turned on after the main semiconductor device is turned on, and the main semiconductor device is turned off after the subsidiary semiconductor device is turned off. The control circuit unit performs control such that, one of the turn-on and turn-off switching timings has a switching speed faster than that of the other of the switching timings. The semiconductor module is configured such that, at a high-speed switching timing, an induction current directed to turn off the subsidiary semiconductor device is generated in a control terminal of the subsidiary semiconductor device depending on temporal change of a main current flowing to the main semiconductor device.
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公开(公告)号：US20200177101A1
公开(公告)日：2020-06-04
申请号：US16787122
申请日：2020-02-11
Applicant: DENSO CORPORATION
Inventor： Yuu YAMAHIRA , Tetsuya MATSUOKA , Kazuma FUKUSHIMA
Abstract: In a power conversion device, each of semiconductor modules of a layered body includes a body portion incorporating a plurality of switching elements and a plurality of power terminals protruding therefrom. The semiconductor modules include upper-arm switching elements and lower-arm switching element that are alternately layered in a layering direction of the layered body. A capacitor is disposed on one side of the layered body and a current sensor is disposed on an opposite side of the layered body, in an orthogonal direction orthogonal to both a protruding direction of the power terminals and the layering direction. Each of the semiconductor modules includes, as the power terminals, two collector terminals connected to a collector electrode of the switching element and one emitter terminal connected to an emitter electrode of the switching element, and the emitter terminal is disposed between the two collector terminals in the orthogonal direction.
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