公开(公告)号：US09761442B2

公开(公告)日：2017-09-12

申请号：US15348448

申请日：2016-11-10

Applicant: DISCO CORPORATION

Inventor： Taku Iwamoto ,  Hiroto Yoshida ,  Junichi Kuki

IPC: H01L21/31 ,  H01L21/469 ,  H01L21/02 ,  H01L21/683 ,  H01L21/67 ,  H01L33/00 ,  H01S5/02

CPC classification number: H01L21/02282 ,  H01L21/0206 ,  H01L21/02118 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/6715 ,  H01L21/6836 ,  H01L21/68792 ,  H01L21/78 ,  H01L33/0095 ,  H01L2221/68327 ,  H01S5/0201

Abstract: A method for forming a water-soluble resin film on a wafer having a plurality of devices thereon. The wafer is supported through an adhesive tape to an annular frame. The method includes removing the resin scattered onto the surface of the frame in forming the film on the wafer held on a spinner table, and this step further includes: rotating the spinner table; positioning a water nozzle above the frame held on the spinner table, supplying water from the nozzle to the frame, positioning an air nozzle adjacent to the water nozzle on the downstream side thereof in the rotational direction of the spinner table, and supplying air from the air nozzle against the flow of the water on the frame, whereby the water is forced to temporarily stay on the surface of the frame by the air supplied and is then expelled outward of the frame.

公开(公告)号：US20220139754A1

公开(公告)日：2022-05-05

申请号：US17576570

申请日：2022-01-14

Applicant: DISCO CORPORATION

Inventor： Senichi Ryo ,  Yukinobu Ohura ,  Hiroto Yoshida ,  Tomoaki Endo

IPC: H01L21/683 ,  H01L23/544 ,  H01L21/268 ,  H01L21/78 ,  B23K26/00 ,  B23K26/402 ,  H01L21/02

Abstract: A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.

公开(公告)号：US11322383B2

公开(公告)日：2022-05-03

申请号：US16744823

申请日：2020-01-16

Applicant: DISCO CORPORATION

Inventor： Senichi Ryo ,  Yukinobu Ohura ,  Hiroto Yoshida ,  Tomoaki Endo

IPC: H01L21/683 ,  H01L23/544 ,  H01L21/268 ,  H01L21/78 ,  B23K26/00 ,  B23K26/402 ,  H01L21/02 ,  B23K103/00

Abstract: A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.

公开(公告)号：US11892282B2

公开(公告)日：2024-02-06

申请号：US17663490

申请日：2022-05-16

Applicant: DISCO CORPORATION

Inventor： Hiroto Yoshida ,  Nobuyasu Kitahara ,  Kuo Wei Wu ,  Kunimitsu Takahashi ,  Naoki Murazawa ,  Joel Koerwer

IPC: G01B11/06

CPC classification number: G01B11/0625

Abstract: A protective film thickness measuring method includes a step of applying light to a top surface of a wafer in a state in which no protective film is formed and measuring a first reflection intensity of the light reflected from the top surface, a step of forming the protective film including a light absorbing material, a step of irradiating the protective film with exciting light of a wavelength at which the light absorbing material fluoresces and measuring a second reflection intensity including fluorescence of the protective film and the light reflected from the top surface, and a step of excluding reflection intensity of patterns formed on the top surface, by subtracting the measured first reflection intensity from the measured second reflection intensity, and calculating fluorescence intensity of the protective film.

公开(公告)号：US11637033B2

公开(公告)日：2023-04-25

申请号：US17576570

申请日：2022-01-14

Applicant: DISCO CORPORATION

Inventor： Senichi Ryo ,  Yukinobu Ohura ,  Hiroto Yoshida ,  Tomoaki Endo

IPC: H01L21/683 ,  H01L23/544 ,  H01L21/268 ,  H01L21/78 ,  B23K26/00 ,  B23K26/402 ,  H01L21/02 ,  B23K103/00

Abstract: A manufacturing method of a protective film agent for laser dicing that includes a solution preparation step of preparing a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed; and an ion-exchange treatment step of carrying out ion exchange of sodium ions in the solution by using a cation-exchange resin.

公开(公告)号：US20170140928A1

公开(公告)日：2017-05-18

申请号：US15348448

申请日：2016-11-10

Applicant: DISCO CORPORATION

Inventor： Taku Iwamoto ,  Hiroto Yoshida ,  Junichi Kuki

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/02282 ,  H01L21/0206 ,  H01L21/02118 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/6715 ,  H01L21/6836 ,  H01L21/68792 ,  H01L21/78 ,  H01L33/0095 ,  H01L2221/68327 ,  H01S5/0201

Abstract: A method for forming a water-soluble resin film on a wafer having a plurality of devices thereon. The wafer is supported through an adhesive tape to an annular frame. The method includes removing the resin scattered onto the surface of the frame in forming the film on the wafer held on a spinner table, and this step further includes: rotating the spinner table; positioning a water nozzle above the frame held on the spinner table, supplying water from the nozzle to the frame, positioning an air nozzle adjacent to the water nozzle on the downstream side thereof in the rotational direction of the spinner table, and supplying air from the air nozzle against the flow of the water on the frame, whereby the water is forced to temporarily stay on the surface of the frame by the air supplied and is then expelled outward of the frame.