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公开(公告)号：US09870961B2
公开(公告)日：2018-01-16
申请号：US15388168
申请日：2016-12-22
Applicant: DISCO CORPORATION
Inventor： Taku Iwamoto , Hironari Ohkubo , Junichi Kuki , Kentaro Odanaka
IPC: H01L21/268 , H01L21/66 , H01L21/67 , H01L21/68 , H01L21/683 , H01L21/687 , H01L23/544 , H01S3/11 , H01S3/16
CPC classification number: H01L22/20 , H01L21/268 , H01L21/67092 , H01L21/67259 , H01L21/67282 , H01L21/681 , H01L21/6838 , H01L21/68764 , H01L21/78 , H01L22/32 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01S3/11 , H01S3/163
Abstract: Disclosed herein is a wafer processing method including a processed position measuring step of imaging an area including a beam plasma generated by applying a pulsed laser beam to a wafer, by using an imaging unit during the formation of a laser processed groove on the wafer, and next measuring the positional relation between the position of the beam plasma and a preset processing position. Accordingly, it is possible to check whether or not the laser processed groove is formed at a desired position, in real time during laser processing. If the position of the laser processed groove is deviated, the processed position can be immediately corrected.
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公开(公告)号：US20170106471A1
公开(公告)日：2017-04-20
申请号：US15293587
申请日：2016-10-14
Applicant: DISCO CORPORATION
Inventor： Shungo Yoshii , Junichi Kuki , Kana Aida
IPC: B23K26/142 , B23K26/402 , B23K26/00 , B23K26/364
CPC classification number: B23K26/142 , B23K26/009 , B23K26/083 , B23K26/147 , B23K26/16 , B23K26/18 , B23K26/364 , B23K26/402 , B23K2101/40 , B23K2103/56
Abstract: A laser processing apparatus ablates the upper surface of a plate-shaped workpiece by using a laser beam passed through a water-soluble protective film formed on the upper surface of the plate-shaped workpiece. A nozzle applies the laser beam to the upper surface of the plate-shaped workpiece. The processing nozzle includes a debris capturing chamber for capturing debris scattering due to the application of the laser beam. A capturing space is defined in the debris capturing chamber, and an air discharge port and a suction port are opposed to each other in the capturing space. Air is discharged from the air discharge port toward the suction port so as to produce an air flow perpendicular to the optical path of the laser beam, so that the debris is sucked into the suction port by this air flow.
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公开(公告)号：US20190061063A1
公开(公告)日：2019-02-28
申请号：US16111413
申请日：2018-08-24
Applicant: DISCO CORPORATION
Inventor： Junichi Kuki , Joel Koerwer , Keinosuke Maeda
CPC classification number: B23K26/705 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/073 , G01J1/0477 , G01J1/4257 , G02B27/281
Abstract: A laser beam profiler unit for measuring an intensity distribution of a laser beam oscillated from a laser oscillator includes a magnifying optical system for magnifying a spot diameter of the laser beam oscillated from the laser oscillator and focused by a condensing lens, a first transmission prism for attenuating the laser beam, a second transmission prism for further attenuating a laser beam reflected by the first transmission prism, an image capturing element for detecting the laser beam reflected by the second transmission prism, and an analyzer for analyzing an intensity distribution of a spot of the laser beam from data of the laser beam detected by the image capturing element.
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公开(公告)号：US20160067819A1
公开(公告)日：2016-03-10
申请号：US14840742
申请日：2015-08-31
Applicant: DISCO CORPORATION
Inventor： Junichi Kuki , Yusaku Ito
IPC: B23K26/03 , B23K26/352 , B23K26/00 , B23K26/035 , B23K26/08
CPC classification number: B23K26/032 , B23K26/364 , B23K2103/56
Abstract: A laser processing apparatus includes a laser beam applying unit having a processing head for applying a laser beam to a workpiece held on a chuck table, a moving unit for relatively moving the chuck table and the laser beam applying unit, a controller for controlling the laser beam applying unit and the moving unit, an input unit for inputting a desired processing result, and a three-dimensional imaging unit for imaging a processed condition of the workpiece held on the chuck table to form a three-dimensional image. The controller adjusts processing conditions so as to obtain the desired processing result input by the input unit according to the desired processing result and the three-dimensional image formed by the three-dimensional imaging unit, and then controls the laser beam applying unit and the moving unit according to the processing conditions adjusted in the processing conditions adjusting step.
Abstract translation: 一种激光加工装置，具备：激光束施加单元，具有用于将激光束施加到夹持台上的工件的处理头，用于相对移动卡盘台和激光束施加单元的移动单元，控制激光器 光束施加单元和移动单元，用于输入期望的处理结果的输入单元和用于对保持在卡盘台上的工件的处理状态进行成像以形成三维图像的三维成像单元。 控制器调整处理条件，以便根据期望的处理结果和由三维成像单元形成的三维图像获得由输入单元输入的期望的处理结果，然后控制激光束施加单元和移动 单位根据处理条件调整处理条件调整步骤。
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公开(公告)号：US20150104930A1
公开(公告)日：2015-04-16
申请号：US14514069
申请日：2014-10-14
Applicant: DISCO CORPORATION
Inventor： Chikara Aikawa , Kunimitsu Takahashi , Nobuyasu Kitahara , Seiji Fujiwara , Yoshiaki Yodo , Junichi Kuki
IPC: H01L21/78 , H01L21/683
CPC classification number: H01L21/78 , H01L21/268 , H01L21/6836 , H01L2221/68327
Abstract: A wafer processing method divides a wafer into a plurality of individual devices along a plurality of crossing division lines formed on the front side of the wafer. The method includes a functional layer removing step of applying a CO2 laser beam to the wafer along each division line with the spot of the CO2 laser beam, having a width corresponding to the width of each division line set on the upper surface of each division line, thereby removing a functional layer along each division line to form a groove along each division line where the functional layer has been removed, and a groove shaping and debris removing step of applying a laser beam having a wavelength in the ultraviolet region to the wafer along each groove, thereby removing debris sticking to the bottom surface of each groove and also shaping the side walls of each groove.
Abstract translation: 晶片处理方法沿着形成在晶片的前侧上的多个交叉分割线将晶片分成多个单独的器件。 该方法包括：功能层去除步骤，其沿着与所述CO 2激光束的光点相对应的每个分割线将晶片上的CO 2激光束施加到具有对应于每个分割线的上表面上的每个分割线的宽度的宽度 从而沿着每个分割线移除功能层，以沿除去功能层的每个分割线形成凹槽，以及将具有紫外区域中的波长的激光束施加到晶片的凹槽成形和碎片去除步骤 每个凹槽，从而去除残留在每个凹槽的底表面上的碎片，并且还使每个凹槽的侧壁成形。
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Patent Agency Ranking
公开(公告)号：US09895768B2
公开(公告)日：2018-02-20
申请号：US14840742
申请日：2015-08-31
Applicant: DISCO CORPORATION
Inventor： Junichi Kuki , Yusaku Ito
IPC: B23K26/00 , B23K26/035 , B23K26/08 , B23K26/352 , B23K26/03 , B23K26/364 , B23K103/00
CPC classification number: B23K26/032 , B23K26/364 , B23K2103/56
Abstract: A laser processing apparatus includes a laser beam applying unit having a processing head for applying a laser beam to a workpiece held on a chuck table, a moving unit for relatively moving the chuck table and the laser beam applying unit, a controller for controlling the laser beam applying unit and the moving unit, an input unit for inputting a desired processing result, and a three-dimensional imaging unit for imaging a processed condition of the workpiece held on the chuck table to form a three-dimensional image. The controller adjusts processing conditions so as to obtain the desired processing result input by the input unit according to the desired processing result and the three-dimensional image formed by the three-dimensional imaging unit, and then controls the laser beam applying unit and the moving unit according to the processing conditions adjusted in the processing conditions adjusting step.
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公开(公告)号：US20170186656A1
公开(公告)日：2017-06-29
申请号：US15388168
申请日：2016-12-22
Applicant: DISCO CORPORATION
Inventor： Taku Iwamoto , Hironari Ohkubo , Junichi Kuki , Kentaro Odanaka
IPC: H01L21/66 , H01L23/544 , H01L21/67 , H01S3/16 , H01L21/683 , H01L21/68 , H01S3/11 , H01L21/268 , H01L21/687
CPC classification number: H01L22/20 , H01L21/268 , H01L21/67092 , H01L21/67259 , H01L21/67282 , H01L21/681 , H01L21/6838 , H01L21/68764 , H01L21/78 , H01L22/32 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01S3/11 , H01S3/163
Abstract: Disclosed herein is a wafer processing method including a processed position measuring step of imaging an area including a beam plasma generated by applying a pulsed laser beam to a wafer, by using an imaging unit during the formation of a laser processed groove on the wafer, and next measuring the positional relation between the position of the beam plasma and a preset processing position. Accordingly, it is possible to check whether or not the laser processed groove is formed at a desired position, in real time during laser processing. If the position of the laser processed groove is deviated, the processed position can be immediately corrected.
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公开(公告)号：US20170140928A1
公开(公告)日：2017-05-18
申请号：US15348448
申请日：2016-11-10
Applicant: DISCO CORPORATION
Inventor： Taku Iwamoto , Hiroto Yoshida , Junichi Kuki
IPC: H01L21/02 , H01L21/67 , H01L21/683
CPC classification number: H01L21/02282 , H01L21/0206 , H01L21/02118 , H01L21/67051 , H01L21/67092 , H01L21/6715 , H01L21/6836 , H01L21/68792 , H01L21/78 , H01L33/0095 , H01L2221/68327 , H01S5/0201
Abstract: A method for forming a water-soluble resin film on a wafer having a plurality of devices thereon. The wafer is supported through an adhesive tape to an annular frame. The method includes removing the resin scattered onto the surface of the frame in forming the film on the wafer held on a spinner table, and this step further includes: rotating the spinner table; positioning a water nozzle above the frame held on the spinner table, supplying water from the nozzle to the frame, positioning an air nozzle adjacent to the water nozzle on the downstream side thereof in the rotational direction of the spinner table, and supplying air from the air nozzle against the flow of the water on the frame, whereby the water is forced to temporarily stay on the surface of the frame by the air supplied and is then expelled outward of the frame.
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公开(公告)号：US10532433B2
公开(公告)日：2020-01-14
申请号：US16111413
申请日：2018-08-24
Applicant: DISCO CORPORATION
Inventor： Junichi Kuki , Joel Koerwer , Keinosuke Maeda
Abstract: A laser beam profiler unit for measuring an intensity distribution of a laser beam oscillated from a laser oscillator includes a magnifying optical system for magnifying a spot diameter of the laser beam oscillated from the laser oscillator and focused by a condensing lens, a first transmission prism for attenuating the laser beam, a second transmission prism for further attenuating a laser beam reflected by the first transmission prism, an image capturing element for detecting the laser beam reflected by the second transmission prism, and an analyzer for analyzing an intensity distribution of a spot of the laser beam from data of the laser beam detected by the image capturing element.
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公开(公告)号：US09989468B2
公开(公告)日：2018-06-05
申请号：US15621197
申请日：2017-06-13
Applicant: DISCO CORPORATION
Inventor： Yusaku Ito , Senichi Ryo , Junichi Kuki
IPC: G01N21/64
CPC classification number: G01N21/6456 , G01N21/645 , G01N21/9501 , G01N2021/6471 , G01N2021/8427
Abstract: A fluorescence detecting apparatus includes an excitation light applying section that applies excitation light to a protective film containing an absorbing agent. A photomultiplier tube detects fluorescence emitted from the absorbing agent due to absorption of the excitation light. A fluorescence passing filter removes light having wavelengths other than the wavelength of the fluorescence emitted from the absorbing agent, and a reflecting mirror having a reflecting surface reflects the fluorescence emitted from the protective film toward the photomultiplier tube. This reflecting surface is formed by a part of a curved surface forming a spheroid having first and second foci. The first focus is positioned at a target area of the protective film where the excitation light is applied, and the second focus is positioned at a light detecting element included in the photomultiplier tube.
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