公开(公告)号：US20070160748A1

公开(公告)日：2007-07-12

申请号：US11323896

申请日：2005-12-30

Applicant: Michael Schugt ,  Kamal Mothilal ,  David Ruben ,  Lary Larson ,  Michael Mattes

Inventor： Michael Schugt ,  Kamal Mothilal ,  David Ruben ,  Lary Larson ,  Michael Mattes

IPC: B05D5/12 ,  A61N1/00 ,  A61B5/04

CPC classification number: A61N1/056 ,  A61B5/0215 ,  B81B3/0072 ,  B81C2201/0167 ,  H01L21/4857 ,  H05K1/0271 ,  H05K3/4061 ,  H05K3/4092

Abstract: Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

Abstract translation: 公开了用于传感器模块的介质曝光互连。 换能器可以是感测换能器，致动换能器，仅IC元件的换能器，或其组合，或其他合适的换能器。 换能器可以与可植入医疗装置结合使用，并且可以暴露于各种介质，例如体液。 用于换能器模块的介质暴露互连可以允许换能器与诸如可植入医疗装置的其它部件电气通信。

公开(公告)号：US20080038878A1

公开(公告)日：2008-02-14

申请号：US11877408

申请日：2007-10-23

Applicant: David Ruben ,  Scott Sleeper ,  Peter Tortorici

Inventor： David Ruben ,  Scott Sleeper ,  Peter Tortorici

IPC: H01L21/00

CPC classification number: H05K3/284 ,  H01L23/24 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/2018 ,  H01L2924/00

Abstract: An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.

Abstract translation: 一种用于电路板的组件包括衬底，形成在衬底上的至少一个电路部件和框架。 框架包括附接到基板的第一基本上平坦的表面，以及穿过框架形成并由围绕至少一个电路部件的壁限定的孔。 一种制造电路板的方法包括将框架的基本上平坦的表面附接到衬底的步骤，其中至少一个电路部件被限定孔的壁包围。

公开(公告)号：US20220132947A1

公开(公告)日：2022-05-05

申请号：US17516733

申请日：2021-11-02

Applicant: David Ruben

Inventor： David Ruben

IPC: A41D13/08 ,  A45C11/00

Abstract: An infection transmission control system is provided. The system can include pliable grips configured to wrap around a surface of a publicly used object. The system can include a securing mechanism structured to hold in place the pliable grips around the publicity used object and wherein the pliable grips when engaged with the securing mechanism form a layer which is structured to minimize physical contact between a user of the system and the surface of the publicly used object. Further, a finger pointer protection system is provided. The system includes a conductive silicon fingertip protective cap configured to fit on a person's index finger. The system also includes a fingertip storage container structured to allow storage of the silicon fingertip protective cap securely. The pliable grips and the fingertip protective cap can be created in a disposable version.

公开(公告)号：US20060125114A1

公开(公告)日：2006-06-15

申请号：US11350624

申请日：2006-02-09

Applicant: David Ruben

Inventor： David Ruben

IPC: H01L23/48 ,  H01L21/48

CPC classification number: H01L21/76886 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/16 ,  H01L2924/01322

Abstract: A low resistance path extends from a first region of a semiconductor substrate to a second region thereof. The low resistance path is produced by depositing a metal such as aluminum on the surface of the substrate and then directing a laser beam onto the metal causing the metal and a portion of the substrate beneath the metal to melt forming an alloy of the metal and the substrate material.

Abstract translation: 低电阻路径从半导体衬底的第一区域延伸到第二区域。 低电阻路径是通过在基板的表面上沉积诸如铝的金属然后将激光束引导到金属上而产生的，导致金属和金属的一部分基底熔化形成金属和 基材。

公开(公告)号：US5759197A

公开(公告)日：1998-06-02

申请号：US550273

申请日：1995-10-30

Applicant: Robert T. Sawchuk ,  Lynn M. Seifried ,  Bill Simmons ,  Jeff Galvin ,  David Ruben

Inventor： Robert T. Sawchuk ,  Lynn M. Seifried ,  Bill Simmons ,  Jeff Galvin ,  David Ruben

IPC: A61N1/05 ,  A61N1/362 ,  A61N1/375 ,  H01B17/30

CPC classification number: A61N1/3754

Abstract: A feedthrough configuration for a hermetically sealed implantable medical device includes a metal case having an aperture and a feedthrough in the aperture which includes a ferrule sealed in the aperture, a pin extending through the ferrule and the aperture, an insulating material supporting the pin within the ferrule and an electrically conductive block spaced from the ferrule and in electrical connection with the pin. A device for electrical or electromagnetic protection can be connected to a peripheral upstanding portion of the ferrule and a peripheral skirt portion of the block. This arrangement of feedthrough elements can be particularly useful if the protective device is a chip capacitor which typically has a flat-sided configuration that can bridge the space between the ferrule and the block and be connected at one end to the block and at the other end to the ferrule.

Abstract translation: 用于气密密封的可植入医疗装置的馈通配置包括具有孔和孔中的馈通的金属外壳，其包括密封在孔中的套圈，延伸穿过套圈和孔的销，将销钉支撑在内 套圈和与套圈间隔开并与销电连接的导电块。 用于电气或电磁保护的装置可以连接到套圈的周边直立部分和块的外围裙部。 如果保护装置是通常具有平坦侧面构造的片状电容器，那么馈通元件的这种布置可以是特别有用的，该平板电容器可以桥接套圈和块之间的空间并且在一端连接到块并且在另一端连接 到套圈。

公开(公告)号：US20060219672A1

公开(公告)日：2006-10-05

申请号：US11096433

申请日：2005-03-31

Applicant: David Ruben ,  Christopher Kinsey ,  Jeffrey Galvin ,  Scott Sleeper

Inventor： David Ruben ,  Christopher Kinsey ,  Jeffrey Galvin ,  Scott Sleeper

IPC: B23K1/005 ,  B23K26/20

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K26/037 ,  B23K26/211 ,  B23K26/22 ,  B23K2101/42 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A bonding tool for use in a laser bonding apparatus comprises an elongated body portion and a foot portion coupled thereto. The foot portion extends substantially transversely from the body portion and has a laser aperture and a guide channel therethrough. The guide channel is disposed between the body portion and the laser aperture.

Abstract translation: 用于激光焊接装置的接合工具包括细长主体部分和与其连接的脚部分。 脚部基本上横向地从主体部分延伸并且具有穿过其的激光孔和引导通道。 引导通道设置在主体部分和激光孔之间。

公开(公告)号：US20060163747A1

公开(公告)日：2006-07-27

申请号：US11042740

申请日：2005-01-25

Applicant: David Ruben ,  Scott Sleeper ,  Peter Tortorici

Inventor： David Ruben ,  Scott Sleeper ,  Peter Tortorici

IPC: H01L23/48

CPC classification number: H05K3/284 ,  H01L23/24 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/2018 ,  H01L2924/00

Abstract: An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.

Abstract translation: 一种用于电路板的组件包括衬底，形成在衬底上的至少一个电路部件和框架。 框架包括附接到基板的第一基本上平坦的表面，以及穿过框架形成并由围绕至少一个电路部件的壁限定的孔。 一种制造电路板的方法包括将框架的基本上平坦的表面附接到衬底的步骤，其中至少一个电路部件被限定孔的壁包围。

公开(公告)号：US20050011533A1

公开(公告)日：2005-01-20

申请号：US10499136

申请日：2003-01-06

Applicant: David Ruben

Inventor： David Ruben

IPC: A45D1/04 ,  A45D1/28

CPC classification number: A45D1/28 ,  A45D1/04

Abstract: The present invention is a heated hair styling device comprising a handle (20), a body (30), an LCD visual interface (50), and an audible signal (70) to notify a user of particular states of operation of the hair styling device. The LCD (50) display provides information of at least one operating condition of the device, for example, the temperature of the device, the heat setting, the amount of time that the device has been “on”, etc.

Abstract translation: 本发明是一种加热的头发造型装置，其包括手柄（20），主体（30），LCD可视界面（50）和可听信号（70），以向用户通知头发造型的特定操作状态 设备。 LCD（50）显示器提供设备的至少一个操作条件的信息，例如设备的温度，热定形，设备“开启”的时间量等。

公开(公告)号：US20050004616A1

公开(公告)日：2005-01-06

申请号：US10902539

申请日：2004-07-29

Applicant: David Ruben

Inventor： David Ruben

IPC: A61N1/375 ,  H01L21/304 ,  H05K1/00 ,  A61N1/372

CPC classification number: H01L21/304 ,  A61N1/375 ,  A61N1/3758 ,  H05K1/0284

Abstract: An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but also of the substrate itself. Integrated circuit components are formed to fit the shape of the substrate, freeing areas in the device for additional components, or allowing the device to be made smaller through a maximized use of the available space-volume.

Abstract translation: 植入式医疗装置基板是自由形式切割成装置内部的形状。 自由形状允许不仅使器件的内部空间更有效地使用，而且还可以更有效地利用衬底本身。 集成电路部件形成为适合基板的形状，释放设备中的附加部件的区域，或者允许通过最大限度地利用可用的空间体积来使装置更小。